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We present a set of novel optogenetic devices for mice freely moving in cages. The purpose of the devices is to stimulate specific brain regions using light. The devices we have constructed consist of an electrical connector, cannula and micro- LED chip operating at 470 nm as light source for delivering light into the stimulated region of the mouse brain. We have also demonstrated light conversion from 470 nm to 590 nm by applying a silicate orange phosphor directly to the LED chip. The measured conversion efficiency is approximately 80% for ZIP595I phosphor. We discuss the properties of various forms of implant needles with respect to the ease of LED attachment and experimental validation of the constructed optogenetic implants.

The STS/MUCH-XYTER2 ASIC is a full-size prototype chip for the Silicon Tracking System (STS) and Muon Chamber (MUCH) detectors in the new fixed-target experiment Compressed Baryonic Matter (CBM) at FAIR-center, Darmstadt, Germany. The noise performance is tightly related both to the analog front-end architecture and structure of the detector. In the STS case, the stereo-angle, double-sided microstrip sensors are biased and connected with the frontend chips by the dedicated assembly of ultra-thin micro-cables. The structure of this system contributes to the overall performance of the modules being fabricated. Moreover, the system will contain multiple modules with different sensor and cable lengths. This paper shows the simulated expected noise results based on the latest measurements of the system components including: specific architecture and measured parasitics of the fabricated micro-cables, measured parameters of the silicon microstrip sensors. Presented studies show also impact of the protection diodes.

We demonstrate results for phase maps of biological cells using white-light and multi-spectral interference microscopy. Study on comparison of phase maps reconstructed using 1-CCD and 3- CCD is presented to reduce color cross-talk and improved resolution.

Tracking driver’s face is one of the essentialities for driving safety control. This kind of system is usually designed with complicated algorithms to recognize driver’s face by means of powerful computers. The design problem is not only about detecting rate but also from parts damages under rigorous environments by vibration, heat, and humidity. A feasible strategy to counteract these damages is to integrate entire system into a single chip in order to achieve minimum installation dimension, weight, power consumption, and exposure to air. Meanwhile, an extraordinary methodology is also indispensable to overcome the dilemma of low-computing capability and real-time performance on a low-end chip. In this paper, a novel driver face tracking system is proposed by employing semantics-based vague image representation (SVIR) for minimum hardware resource usages on a FPGA, and the real-time performance is also guaranteed at the same time. Our experimental results have indicated that the proposed face tracking system is viable and promising for the smart car design in the future.

Dressing as an integrated part of the grinding process influences the quality of ground surface and the loading of the grinding tool. This paper addresses the effect of dressing parameters, including the different dressing overlapping ratios (severely high values) and dressing speed ratios (up and down dressing modes) on the chip loading and surface finish in the grinding with micro-pins and grinding wheels with very fine grits. The results revealed that both the ground surface quality and chip loading are significantly influenced by the grinding tool topography which is generated by the dressing process. The very high dressing overlapping ratios generated a fine topography on the grinding tool, which resulted in lower chip loading and finer surface finish. Moreover, both chip nests and welded clogging on the grinding grains were observed. More welded clogging of the grinding pin was detected when the dressing overlapping ratio decreased and down dressing mode was applied. Mirror surface quality (Ra=0.035) was achieved with utilizing overlapping ratios up to 60 for a grinding wheel with grits size #500.

We present a microfluidic chip for an easy setup of a 3D-culture of mammalian cells. The chip contains feeding structures and gas supply for long-term cultivation of mammalian cells. The device is fabricated out of hard materials like silicon and glass that are all highly biocompatible. The chip uses the concept of surficial phaseguides that allows the partial filling of a microfluidic chip with liquids based on hydrophobic and hydrophilic surfaces. Here, a suspension of mammalian cells and melted agarose is filled into the chip and is pulled by the capillary pressure on the hydrophilic areas but not on the hydrophobic phaseguides. Consequently, only a part of the chip is filled with the agarose which gels by cooling a form the 3D-cell culture. The unfilled areas are used as supply structures for nutrition and gases. So the supply is based on diffusion and the supply of nutrition and gases is controlled independently. We cultured HaCaT-cells over 24 hours in our device and achieve a good viability.

International audience; ecause of the advantages in terms of reproducibility for optical resonators on chip which are designed of various topologies and integration with optical devices. To increase the Q-factor from the lower rang [104 - 106 ] to higher one [108 -1010] [1-4] one use crystalline resonators. It is much complicated to couple an optical signal from a tapered fiber to crystalline resonator than from a defined ridge to a resonator designed on a chip. In this work, we will focus on the optimization of the crystalline resonators under straight wave guide (based on COMSOL multi-physic software) [5- 7] and subject also to technological constraints of manufacturing. The coupling problem at the Nano scale makes our optimizations problem more dynamics in term of design space.© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

The dazzling phenomena such as point saturation, line crosstalk present successively when laser irradiates on the CCD camera. We use CW laser at 532 nm and 1064 nm to irradiate the interline transfer area array CCD, CCD emerges lattice spots under the lens focusing. Based on geometrical optics, we use theoretical analysis and numerical simulation to study the mechanization of lattice spots. Laser jamming effects to the same CCD are different between 532 nm and 1064 nm. This is because the 532 nm laser diffracts with the chip, while 1064 nm laser interferences with its reflected light in the transmission process. Meanwhile, the mechanization of the ring surrounding the main spot is analyzed.

Portable and handheld spectrometers are being developed and commercialized in the late few years leveraging the rapidly-progressing technology and triggering new markets in the field of on-site spectroscopic analysis. Although handheld devices were commercialized for the near-infrared spectroscopy (NIRS), their size and cost stand as an obstacle against the deployment of the spectrometer as spectral sensing components needed for the smart phone industry and the IoT applications. In this work we report a chip-sized microelectromechanical system (MEMS)-based FTIR spectrometer. The core optical engine of the solution is built using a passive-alignment integration technique for a selfaligned MEMS chip; self-aligned microoptics and a single detector in a tiny package sized about 1 cm3. The MEMS chip is a monolithic, high-throughput scanning Michelson interferometer fabricated using deep reactive ion etching technology of silicon-on-insulator substrate. The micro-optical part is used for conditioning the input/output light to/from the MEMS and for further light direction to the detector. Thanks to the all-reflective design of the conditioning microoptics, the performance is free of chromatic aberration. Complemented by the excellent transmission properties of the silicon in the infrared region, the integrated solution allows very wide spectral range of operation. The reported sensor’s spectral resolution is about 33 cm-1 and working in the range of 1270 nm to 2700 nm; upper limited by the extended InGaAs detector. The presented solution provides a low cost, low power, tiny size, wide wavelength range NIR spectral sensor that can be manufactured with extremely high volumes. All these features promise the compatibility of this technology with the forthcoming demand of smart portable and IoT devices.

The development of rapid, easy-to-use and highly sensitive DNA detection methods has received increasing interest for medical diagnostics and research purposes. Our laboratory has developed several chip-based DNA biosensors including molecular sentinel-on-chip (MSC), multiplex MSC, and inverse molecular sentinel-on-chip (iMS-on-Chip). These sensors use surface-enhanced Raman scattering (SERS) plasmonic chips, functionalized with DNA probes for single-step DNA detection. The sensing mechanisms is based on the hybridization of target sequences and DNA probes, resulting in a displacement of a SERS reporter from the chip surface. This distance increase results in change in SERS signal intensity from the reporter, thus indicating the capture, and therefore the presence, of the target nucleic acid sequence. The nucleic acid probes and the SERS chip, which compose the sensing platform, were designed for single-step DNA detection. The target sequences are detected by delivery of a sample solutions on a functionalized chip and characterization of the SERS signals, after 1 - 2 hr incubation. These techniques avoid labeling of the target sequence or washing to remove unreacted components, making them easy-to-use and cost effective. The use of SERS chip for medical diagnostics was demonstrated by detecting genetic biomarkers for respiratory viral infection and the DNA of dengue virus 4.

We present a method for measuring polarization extinction ratio (PER) of multi-functional integrated optic chip (MFIOC) based on White light interferometry (WLI) against birefringence dispersion (BD) and noise. Instead of reading peak value, this method obtains PER via calculating the energy of the interferogram, which is theoretically proved that is independent of BD and proportional to the square of its peak value. In addition, the results of simulation demonstrate the method has an advantage of noise robustness versus the conventional peak value method. Eventually, experiment results of 100 measurements for a MFIOC are agree with the theory and simulation results.

Particle focusing is an important functionality useful in a wide set of biological applications. Nevertheless, it is still challenging to realize it in microfluidics, especially in a low pressure system, because of the intrinsic 2D nature of standard microfluidic devices; long channels or complicated device geometries with several lateral channels are usually needed to avoid this limitation. In this work we present the fabrication and optimization of a compact microfluidic chip, which is capable to perform 3D particle focusing at high flow rates, thanks to the superposition of inertial focusing and intense Dean flow in tightly curving 3D channels. The device layout comprises alternating helices and straight channel sections permitting particle focusing with driving pressures < 1 bar due to the compactness of this chip. Beads characterization is performed, demonstrating the possibility of the chip to effectively focus 15 μm size sample using a single inlet and with no need of additional lateral channels that could complicate the sample processing procedure. Femtosecond laser micromachining followed by chemical etching is used to fabricate the device. This technique is a two-step process that permits fabrication of 3D structures in fused silica substrates and it is a fundamental tool to obtain 3D helices in the substrate. A surface fabrication approach has been used to avoid tapered channels. We envisage the use of this chip for high speed flow cytometer applications.

Infrared (IR) spectroscopy is widely recognized as a gold standard technique for chemical and biological analysis. Traditional IR spectroscopy relies on fragile bench-top instruments located in dedicated laboratory settings, and is thus not suitable for emerging field-deployed applications such as in-line industrial process control, environmental monitoring, and point-of-care diagnosis. Recent strides in photonic integration technologies provide a promising route towards enabling miniaturized, rugged platforms for IR spectroscopic analysis. It is therefore attempting to simply replace the bulky discrete optical elements used in conventional IR spectroscopy with their on-chip counterparts. This size down-scaling approach, however, cripples the system performance as both the sensitivity of spectroscopic sensors and spectral resolution of spectrometers scale with optical path length. In light of this challenge, we will discuss two novel photonic device designs uniquely capable of reaping performance benefits from microphotonic scaling. We leverage strong optical and thermal confinement in judiciously designed micro-cavities to circumvent the thermal diffusion and optical diffraction limits in conventional photothermal sensors and achieve a record 104 photothermal sensitivity enhancement. In the second example, an on-chip spectrometer design with the Fellgett’s advantage is analyzed. The design enables sub-nm spectral resolution on a millimeter-sized, fully packaged chip without moving parts.

As technology advances, the need for running lithographic (litho) checking for early detection of hotspots before tapeout has become essential. This process is important at all levels—from designing standard cells and small blocks to large intellectual property (IP) and full chip layouts. Litho simulation provides high accuracy for detecting printability issues due to problematic geometries, but it has the disadvantage of slow performance on large designs and blocks [1]. Foundries have found a good compromise solution for running litho simulation on full chips by filtering out potential candidate hotspot patterns using pattern matching (PM), and then performing simulation on the matched locations. The challenge has always been how to easily create a PM library of candidate patterns that provides both comprehensive coverage for litho problems and fast runtime performance. This paper presents a new strategy for generating candidate real design patterns through a random generation approach using a layout schema generator (LSG) utility. The output patterns from the LSG are simulated, and then classified by a scoring mechanism that categorizes patterns according to the severity of the hotspots, probability of their presence in the design, and the likelihood of the pattern causing a hotspot. The scoring output helps to filter out the yield problematic patterns that should be removed from any standard cell design, and also to define potential problematic patterns that must be simulated within a bigger context to decide whether or not they represent an actual hotspot. This flow is demonstrated on SMIC 14nm technology, creating a candidate hotspot pattern library that can be used in full chip simulation with very high coverage and robust performance.

Lithography simulation is an essential technique for today’s semiconductor manufacturing process. In order to calculate an entire chip in realistic time, compact resist model is commonly used. The model is established for faster calculation. To have accurate compact resist model, it is necessary to fix a complicated non-linear model function. However, it is difficult to decide an appropriate function manually because there are many options. This paper proposes a new compact resist model using CNN (Convolutional Neural Networks) which is one of deep learning techniques. CNN model makes it possible to determine an appropriate model function and achieve accurate simulation. Experimental results show CNN model can reduce CD prediction errors by 70% compared with the conventional model.

Multiple patterning ArF immersion lithography has been expected as the promising technology to meet tighter leading edge device requirements. The most needed features for the next generation lasers are improvement of device yield, the prevention against rare resource shortage and the reduction of operational costs in multiple-patterning lithography [1] [2]. To support these requirements, GT65A provides the functions of tighter E95 bandwidth stability, lower E95 bandwidth and tunable E95 bandwidth to enhance chip yields [3] [4]. Furthermore, in the prevention against rare resource shortage and the reduction of operational costs, GT65A realizes helium-free operation in a line narrowing module (LNM) and the reduction of neon consumption in a chamber [5]. A faster actuator equipped with the movable lens enables shot average of E95 bandwidth stability to be within ±5 fm to more rapidly adjust laser beam wavefront. More stable spectral bandwidth stability leads to improve CD uniformity. New designed LNM realizes 200 fm of lower E95 bandwidth, because it suppresses thermal wavefront deformation in optical elements and mechanical components. Lower E95 bandwidth improves image contrast and enhances exposure latitude. The combination of a faster actuator and new LNM enables tunable E95 bandwidth to vary from 200 to 450 fm at less than time intervals of a wafer lot exchange, six seconds. This enhances imaging margins by optimizing E95 bandwidth of light sources according to individual scanners. New LNM additionally enables helium-free operation to lower E95 bandwidth in spite of nitrogen purge with higher refractive index variation to temperature. The employment of a new LNM can avoid helium supply risk and saves helium consumption of 80 kL/year/unit. Gas recycling system saves by about 92% of neon consumption in ArF laser. Similarly, the recycling system saves about 85% of neon consumption in KrF laser too. These functions with GT65A improve chip yield and process margins, and support sustainable high volume manufacturing (HVM).

In this paper we introduce an inverse lithography technology (ILT) solution that provides masks with perfect symmetry and minimal complexity. In this solution we divide the ILT problem into three steps and strictly maintain symmetry in each of these steps. First, we optimize an ideal grayscale mask. Second, we seed this ideal mask with polygons. Finally, we grow these seeds in a separate optimization flow. The final mask perfectly maintains the symmetry properties of the illumination source. To the best of our knowledge, this is the first ILT solution that can be used on the original design hierarchy on a full chip scale.

This research considers problem of sampling design space of a given physical design layout. More specifically, it deals with extraction of a set of characteristic design patterns evenly distributed within design space occupied by the layout. The methodology reported here is capable of condensing large design layouts comprised of billions of patterns to few tens of representative cases fulfilling needs of process development and process monitoring in a semiconductor manufacturing facility as well as for OPC and process compensation setup. Patterns extracted by this method include both patterns having high representation in the incoming design and anomalous configurations. In the case study we have sampled design space of a 22FDX test chip with 40 mm2 area on a contact layer. Incoming design layout comprised of 763.6 million patterns has been condensed to 61 patterns that contained all anticipated design configurations as well as a couple of unexpected findings. Extractions of compact pattern representations and multi-step hierarchical clustering method enabling full chip execution (106-1010 patterns) are discussed here in detail.

We developed two types of cantilever-based biosensors for portable diagnostics applications. One sensor is based on MEMS cantilever chip mounted in a microfluidic channel and the other sensor is based on a movable optical fiber placed across a microfluidic channel. Both types of sensors were aimed at direct mechanical measurement of coagulation time in a disposable cartridge using plasma or whole blood samples. There are several similarities and also some important differences between the MEMS based and the optical fiber based solutions. The aim of this paper is to provide a comparison between the two solutions and the results. For both types of sensors, actuation of the cantilever or the moving fiber is achieved using an electro coil and the readout is optical. Since both the actuation and sensing are remote, no electrical connections are required for the cartridge. Therefore it is possible to build low cost disposable cartridges. The reader unit for the cartridge contains light sources, photodetectors, the electro coil, a heater, analog electronics, and a microprocessor. The reader unit has different optical interfaces for the cartridges that have MEMS cantilevers and moving fibers. MEMS based platform has better sensitivity but optomechanical alignment is a challenge and measurements with whole blood were not possible due to high scattering of light by the red blood cells. Fiber sensor based platform has relaxed optomechanical tolerances, ease of manufacturing, and it allows measurements in whole blood. Both sensors were tested using control plasma samples for activated-Partial-Thromboplastin-Time (aPTT) measurements. Control plasma test results matched with the manufacturer's datasheet. Optical fiber based system was tested for aPTT tests with human whole blood samples and the proposed platform provided repeatable test results making the system method of choice for portable diagnostics., Scientific and Technological Research Council of Turkey (TÜBİTAK)

We present a simple yet robust way to fabricate mono-dispersed gas-in-oil-in-water (G/O/W) double emulsions in a non-planar microfluidic device. The microfluidic device is composed of two pieces of chip which make the non-planar structure in microchannel be implemented. By manipulating the flow rate of each phase, the structure of the microbubbles can be tuned. This approach is also valid to the generation of G/W/O double emulsions.

We have developed and evaluated the large full well capacity (FWC) for wide signal detection range and low temporal noise for high sensitivity lock-in pixel CMOS image sensor (CIS) embedded with two storage-diodes (SDs). In addition, for fast charge transfer from photodiode (PD) to SDs, a lateral electric field charge modulator (LEFM) is used for the developed lock-in pixel. As a result, the time-resolved CIS achieves a very large FWC of approximately 7000e-, low temporal random noise of 1.17e-rms at 45fps with true correlated double sampling (CDS) operation, and fast intrinsic response less than 500ps at 635nm. The proposed imager has an effective pixel array of 128(H)×256(V) and a pixel size of 11.2×11.2μm2. The sensor chip is fabricated by a Dongbu HiTek 1P4M 0.11μm CIS process.

To reduce the diode laser bar’s smile effect induced by packaging, a method based on a chip mounter is presented. When the bare bar is picked up by the pick-up tool (PUT) of the chip mounter, the curve direction and volume of the bar can be measured by scanning the P side surface of the bar with a laser rangefinder, and they can be controlled through adjusting the setting up of the PUT. By controlling the curve direction and volume at an appropriate state to compensate the packaging induced strain, the obtaining smile effect is restricted within 0.5μm steadily.

DNA hybridization, where two single-stranded DNA molecules form duplex through sequence-specific interactions, is a fundamental biological process. To gain better understanding, sequence-specific detection of hybridization at the singlemolecule level has been instrumental and can find a wide variety of applications. Nanoporous gold nanoparticle (NPGNP) array chip features large specific surface area and high-density plasmonic field enhancement known as “hot-spots” that are attractive in nanoplasmonic sensor development. In this paper, we discuss results on detecting single-molecule DNA hybridization on functionalizing NPG-NP array chip with unique bio-recognition elements towards both high sensitivity and specificity.

The fabrication of optical interconnects has been widely investigated for the generation of optical circuit boards. Twophoton absorption (TPA) lithography (or high-precision 3D printing) as an innovative production method for direct manufacture of individual 3D photonic structures gains more and more attention when optical polymers are employed. In this regard, we have evaluated novel ORMOCER-based hybrid polymers tailored for the manufacture of optical waveguides by means of high-precision 3D printing. In order to facilitate future industrial implementation, the processability was evaluated and the optical performance of embedded waveguides was assessed. The results illustrate that hybrid polymers are not only viable consumables for industrial manufacture of polymeric micro-optics using generic processes such as UV molding. They also are potential candidates to fabricate optical waveguide systems down to the chip level where TPA-based emerging manufacturing techniques are engaged. Hence, it is shown that hybrid polymers continue to meet the increasing expectations of dynamically growing markets of micro-optics and optical interconnects due to the flexibility of the employed polymer material concept.

As parallel optics data rates transition from 10 Gbps to 25 Gbps and beyond, VCSELs and photodiodes (PDs) are evolving to support the higher transmission rates. In order to maintain system performance as speeds increase and tolerances become tighter, an improved method is needed to efficiently couple VCSEL/PD array optical outputs to fiber optic networks. The mechanical-optical interface (MOI) is a monolithic component with an array of collimating lenses designed for efficient coupling between the on-board active components and a detachable fiber optic connector. This paper describes the design and implementation of a next generation MOI to match high speed VCSEL/PD requirements. Improvements to an earlier design were made to accommodate a wider variety of transceiver architectures by taking into account chip driver and wire-bond clearance requirements, while also optimizing the optical design to maximize coupling performance. Monte Carlo simulation results and the sensitivity analysis used to optimize optical performance with respect to VCSEL/PD alignment and coupling requirements are presented. Empirical testing results are shown to validate the optical model and subsequent system performance; eye-diagram results of a 25 Gbps error-free link are provided across a broad operating temperature range. Environmental and mechanical testing of the component after alignment and adhesion to the circuit substrate validates part and epoxy interaction and performance.

In this paper, a 3D 1Gfps BSI image sensor is proposed, where 128 × 256 pixels are located in the top-tier chip and a 32 × 32 localized driver array in the bottom-tier chip. Pixels are designed with Multiple Collection Gates (MCG), which collects photons selectively with different collection gates being active at intervals of 1ns to achieve 1Gfps. For the drivers, a global PLL is designed, which consists of a ring oscillator with 6-stage current starved differential inverters, achieving a wide frequency tuning range from 40MHz to 360MHz (20ps rms jitter). The drivers are the replicas of the ring oscillator that operates within a PLL. Together with level shifters and XNOR gates, continuous 3.3V pulses are generated with desired pulse width, which is 1/12 of the PLL clock period. The driver array is activated by a START signal, which propagates through a highly balanced clock tree, to activate all the pixels at the same time with virtually negligible skew.

This paper presents a technology of hybrid integration vertical cavity surface emitting lasers (VCSELs) directly on silicon photonics chip. By controlling the reflow of the solder balls used for electrical and mechanical bonding, the VCSELs were bonded at 10 degree to achieve the optimum angle-of-incidence to the planar grating coupler through vision based flip-chip techniques. The 1 dB discrepancy between optical loss values of flip-chip passive assembly and active alignment confirmed that the general purpose of the flip-chip design concept is achieved. This hybrid approach of integrating a miniaturized light source on chip opens the possibly of highly compact sensor system, which enable future portable and wearable diagnostics devices.

Nanoplasmonic sensor has become a recent research focus due to its significant signal enhancement and robust signal transduction measured by various techniques. However, since the native gold surface does not have the capability to selectively bind target biomolecules, high molecular specificity has been a challenge. Nanoporous gold nanoparticle (NPG-NP) array chip showcases large specific surface area and high-density plasmonic field enhancement known as “hot-spots”. In this paper, we discuss strategies to enhance molecular specificity by functionalizing NPG-NP with unique bio-recognition elements towards both high sensitivity and specificity. A few examples will be given using existing and novel bio-recognition elements.

We demonstrate a flexible stand-alone, minimally invasive video-endomicroscope with an outer diameter of 1.6 mm and a length of the rigid tip of 6.7 mm that enables surgeons and biologists to image hardly accessible regions in-vivo in epifluorescence mode. The 60 mg light device improves state-of-the-art objectives by a double deflection approach using a side-fire fiber in combination with spherical microlenses, GRIN-lenses with a specific adapted gradient index profile and an extremely miniaturized chip-on-the-tip camera to achieve an excellent imaging quality. A high NA of 0.7 enables the observation of subcellular features within the entire field of view with a diameter of 183 μm, assure a bright and high-contrast image and promise a good overview during the intervention. Ex-vivo measurements of biological samples confirmed the functionality of the probe.

In order to solve the problem of the bandwidth limitation of the image transmission system on UAV, a scheme with image compression technology for mini UAV is proposed, based on the requirements of High-definition image transmission system of UAV. The video codec standard H.264 coding module and key technology was analyzed and studied for UAV area video communication. Based on the research of high-resolution image encoding and decoding technique and wireless transmit method, The high-resolution image transmission system was designed on architecture of Android and video codec chip; the constructed system was confirmed by experimentation in laboratory, the bit-rate could be controlled easily, QoS is stable, the low latency could meets most applied requirement not only for military use but also for industrial applications.

This paper presents a 10Gb/s partial response (PR) equalizer in 0.18μm CMOS technology. By incorporating a reshaping filter with high-frequency emphasis and the intrinsic roll-off bandwidth of the channel, a duobinary signal is available at the receiver, reducing the bandwidth requirement of high speed communication. To enhance the performance of the PR equalizer, a two-path oversampling technique is used to cope with the time delay variations due to different process corners. Additionally, adjustable capacitance and load calibration technique are also applied to eliminate the process variations further. The chip area including I/O pads occupies 0.835×0.715mm2 and the power consumption is about 224mW under 1.8V power supply. Post simulation results show that the proposed equalizer works properly at 10Gb/s and more than 70% eye opening can be obtained.

We present an ultra-high frequency radio frequency identification based wireless communication set-up for paper-based point-of-care diagnostic applications, based on a sensing radio frequency identification chip. Paper provides a low-cost, disposable platform for ease of fluidic handling without bulky instrumentation, and is thus ideally suited for point-ofcare applications; however, result communication – a crucial aspect for healthcare to be implemented effectively – is still lacking. Printing of radio frequency identification antennas and electronic circuitry for sensing on paper are presented, with read out of the results using a radio frequency identification reader illustrated, demonstrating the feasibility of developing integrated, all-printed solutions for point-of-care diagnosis in resource-limited settings.

A multi-sensor application specific integrated circuit has been developed with a number of sensors: capacitive, inductive, magnetic, ambient light, infrared and acceleration. The capacitive sensing is implemented using a unique, patented, charge transfer technique allowing the measurement of very small capacitances while at the same time eliminating the effects of unwanted parasitic capacitances in the measurement circuit. For cost effective implementation the charge transfer measurement circuit has been has been modified, augmented and expanded to not only measure capacitance but also to act as the measurement circuit for all the sensors. Enabling the multi-sensor chip to measure acceleration on a range of MEMs accelerometer chips including a single axis accelerometer, a dual axis xy accelerometer and a z-axis accelerometer, innovative and patent pending techniques have been developed and implemented on standard CMOS. The CMOS ASIC and a MEMs chip will be double bonded in a plastic package offering multi-sensor capability in a small low cost package.

Digital coherent technology is considered an attractive way of realizing both high-speed metro links and long distance transmissions. In metro areas, there is a strong demand for a smaller, faster transceiver module. This demand is mainly driven by the rapidly increasing data center interconnection traffic, where transmission capacity per faceplane is a key feature. Therefore, optical integration technology is desired. Since compensation in digital coherent technology is performed in the electrical or digital domain, users can deal with those optics performances that are not compensated for digitally. This means using a new material that cannot provide perfect characteristics but that is suitable for miniaturization and integration is possible. Silicon photonics (SiPh) is considered an attractive technology that would enable the significant miniaturization of optical circuits and be capable of optical integration with high manufacturability. While SiPh-based devices have begun to be deployed for very short or short reach links on the basis of direct detection technology, their digital coherent applications have recently been investigated in view of their integration capability. This paper describes recent progress on SiPh-based integrated optical devices for high-speed digital coherent transceivers targeting metro links. An optical modulator and receiver with related circuits have been integrated into a single SiPh chip. TEC-free operation under non-hermetic conditions and the direct attachment of optical fibers have both been realized. Very thin and small packaging with sufficient performance has been demonstrated by using the SiPh chip co-packaged with high-speed ICs.

Currently, there is only one monitor of the temperature and humidity in an incubator, which may cause inaccurate or unreliable data, and even endanger the life safety of the baby. In order to solve this problem,we designed a multi-point temperature and humidity monitoring system for incubators. The system uses the STC12C5A60S2 microcontrollers as the sender core chip which is connected to four AM2321 temperature and humidity sensors. We select STM32F103ZET6 core development board as the receiving end,cooperating with Zigbee wireless transmitting and receiving module to realize data acquisition and transmission. This design can realize remote real-time observation data on the computer by communicating with PC via Ethernet. Prototype tests show that the system can effectively collect and display the information of temperature and humidity of multiple incubators at the same time and there are four monitors in each incubator.

Traffic accident is one of the severe social problems in the world, but the appraisal and prevention of the fatigue driving is still a difficult problem that can not be solved. This paper is to study the results of fatigue driving and the existing antifatigue driving products, collecting brain wave with the TGAM (ThinkGear AM) Brain Wave Sensor Chip. We analyze the collected waveform based on eye blink detect algorithm to work out current situation of the driver. According to the analysis results, Sound Module and controllable speed car will make a series of feedback. Finally, an effective Anti- Fatigue Driving System is designed based on all above.

LED is a kind of reliable source of LCD backlight. The characteristics of LED determine the color gamut and brightness of LCD TV. At present, the mainstream of white LED mainly uses blue chip coated with YAG phosphor to get white light, which can only guarantee the color gamut to 72%NTSC. Based on the color characteristics of backlight module, the method of calculating the color gamut of backlight module are introduced in detail. Coating blue chip by different kind of phosphors, a new LED backlight for LCD TV is developed. The color gamut is improved to more than 80%NTSC or more. At the same time, through the optimization of combination of blue chip with selected green phosphor and red phosphor excitation peak, this white LED solution can get the different color gamut and the highest color gamut, which will be 88%NTSC at most. This technique has been applied to a LCD TV.

In this paper, we studied the structure characteristics of quantum dots-quantum well photodetector with response wavelength range from 400 nm to 1000 nm. It has the characteristics of high sensitivity, low dark current and the high conductance gain. According to the properties of the quantum dots-quantum well photodetectors, we designed a new type of capacitive transimpedence amplifier (CTIA) readout circuit structure with the advantages of adjustable gain, wide bandwidth and high driving ability. We have implemented the chip packaging between CTIA-CDS structure readout circuit and quantum dots detector and tested the readout response characteristics. According to the timing signals requirements of our readout circuit, we designed a real-time spectral data acquisition system based on FPGA and ARM. Parallel processing mode of programmable devices makes the system has high sensitivity and high transmission rate. In addition, we realized blind pixel compensation and smoothing filter algorithm processing to the real time spectrum data by using C++. Through the fluorescence spectrum measurement of carbon quantum dots and the signal acquisition system and computer software system to realize the collection of the spectrum signal processing and analysis, we verified the excellent characteristics of detector. It meets the design requirements of quantum dot spectrum acquisition system with the characteristics of short integration time, real-time and portability.

Design a chip for flexible multifunction optical micro-manipulation based on elastomeric materials-PDMS. We realized the different motion types of microspheres, including stably capture, spiral motion and orbital rotation, by adjusting the input voltage of piezoceramics designed in PDMS Chip. Compared to conventional techniques, this PDMS chip based method does not require special optical properties of the microspheres to be manipulated. In addition, the technique was convenient and precise for dynamical adjustment of motion types without external influences. From these results, we verify that this multifunctional optical micro-manipulation technique of PDMS elastomeric materials can find potential applications for optical manipulation, including cost-effective on-chip diagnostics, optical sorting and optical binding, etc. © 2017 SPIE.

We have developed the new technology for production of sensitive modules for electrochemical sensors of pressure and acceleration. The technology is applicable for mass production and scalable for high-volume production. In this work we demonstrate the new sensing module for electrochemical motion sensors, and its possibility of applying in geophones. We fabricated prototypes of electrochemical planar transducer chips, produced a laboratory prototype of a geophone based on our planar transducer chip, and tested them. This paper presents the preliminary results of the tests.

Nowadays, lab on a chip (LOC) applications are very popular in the field of biomedicine. LOC device works with biological materials and enables to arrange conventional laboratory operations on a small chip. Philosophy of LOC applications stands on quick and precise diagnostics process and technology, which uses cheap materials with possibility of rapid prototyping. LOC, as a time saving application, works with small volume of samples and reagents and enables better control over the sample. We present fabrication method of functional LOC chip for different biomedical microfluidic applications based on direct laser writing (DLW) lithography. We present fabrication of few types of microfluidic and micro-optic structures with different capabilities created by DLW system. The combination of DLW lithography in photoresist layer deposited on glass substrate and polydimethylsiloxane (PDMS) replica molding process were used for patterning of designed microstructures. Prepared microfluidic and micro-optic structures were observed by confocal microscope and microfluidic flow observations were investigated by conventional optical microscope and CCD camera.

A test chip for investigation of junctionless FETs as sub-THz electromagnetic radiation detectors is presented. A number of sensors have been included in the chip designed for production on the SOI substrate. The sensors differ one from one another by the presence of an antenna, transistor layout and doping details. A technology for fabrication of transistors with the self-aligned gate and well-controlled gate to n + source/drain separation distance has been developed. Results of device simulation and electrical characterization are presented in the paper.

The Silicon-On-Insulator (SOI) CMOS is one of the most advanced and promising technology for monolithic pixel detectors design. The insulator layer that is implemented inside the silicon crystal allows to integrate sensors matrix and readout electronic on a single wafer. Moreover, the separation of electronic and substrate increases also the SOI circuits performance. The parasitic capacitances to substrate are significantly reduced, so the electronic systems are faster and consume much less power. The authors of this presentation are the members of international SOIPIX collaboration, that is developing SOI pixel detectors in 200 nm Lapis Fully-Depleted, Low-Leakage SOI CMOS. This work shows a set of advantages of SOI technology and presents possibilities for pixel detector design SOI CMOS. In particular, the preliminary results of a Cracow chip are presented.

Many Biomolecules vibration frequencies are in terahertz (0.1THz-10THz) frequency range, so terahertz (THz) technology is an essential tool for detecting biological molecules. However, due to terahertz strongly absorbed by water, it is difficult to detect these molecules for biological and chemical liquid samples. Therefore, we present a novel detection method by combining terahertz technology with microfluidic technology. The strong absorption of water is effectively overcome by controlling the length that terahertz passes through liquid samples. What’s more, a higher signal to noise ratio is obtained through using less samples. In this paper, we designed a THz microfluidic chip that is easy to be fabricated by using the materials of Zeonor and polydimethylsiloxane (PDMS). Using terahertz time-domainspectroscopy (THz-TDS) system, we find that the chip has a high transmittance above 80% in the range from 0.2 THz to 2.6 THz. Then the THz spectra of deionized water and different kinds of solutions with different concentrations in the microfluidic chip were measured, respectively. In our research, it is found that different kinds of solutions have different transmission coefficients for THz. In addition, the THz transmission and absorption spectrum changes with the concentration of the same kind of solution.

Compared with the visible light imaging system, the infrared imaging system is more uncertain and unstable. Visible system is stable and mature, and the image quality less affected by ambient light, temperature, and other factors. The infrared detectors have a more complex process, there are many non-uniformity problems. The image quality has great influence from the environment, and the effect of temperature on the image is most serious. Especially with a closed infrared system, deterioration of image is very obvious with the temperature. The infrared detectors are vastly different, not only do the various manufacturers have different detector performance, but also detectors from the same batch by the same manufacturer; the image changes with the ambient temperature are not the same. In this case, calibration and debug of the image system is very difficult. Even when you get a better result in one system, it’s difficult to apply to another system. This paper presents a real-time temperature-based correction algorithm for infrared image, and encapsulate it to configurable parameters, reusable IP core, which is based on Altera’s Qsys platform, and use the Avalon-MM and Avalon-ST bus. The image data stream via the IP core by Avalon-ST bus, and the image correction parameters configured by controller through Avalon-MM bus. The IP core read from temperature chip to get ambient temperature, and correct image according to the parameters. The IP core has such a high degree of reusability and portability because compatibility for Qsys platform and using Avalon interface. And people can see the system output results in real time through the adjustable parameters. So this IP core can accelerate the development of product.

With the development of high-resolution imaging infrared remote satellites, high resolution imaging and wide swath width are required. Now one effective way to get a wide imaging swath is to increase the length of infrared chip linear array. Restricted by the number of sensor elements on each chip, field butting of the multiple chips is often adopted to obtain a wide of the field of view (FOV). However, since each infrared chip is actually an array in physical structure, and there is also an outer cover for each chip, it is really impossible to place the multiple infrared chips directly as a straight line on the focal plane, and three non-collinear arranging style is adopted instead. Due to the control stability of the drift angle, a non-collinear arrangement of the three chips on the focal plane, the undulation of the ground elevation and so on, the sub-image separately captured by each infrared chip cannot directly from as an integrated image scene. In this paper, the image mode of the three non-collinear Infrared chips is proposed. What is more, some key factors that affect the imaging quality of the three non-collinear infrared chips are discussed in detail, including the control of the drift angle, the placement of the three infrared chips on the focal plane, the terrain undulation and so on. The scales of the effect caused by those factors are calculated in the paper. In order to test and verify the methods given in the paper, flight mission of sun synchronism circle orbit is taken as an example for simulation. Some practical conclusions are arrived at. When the drift angle is out of control, it can bring the effect of the drift angle on the overlapping degree about pixel number, and relative distortion variation tendency was given based on altitude difference.

In this paper, a method to measure the flow speed based on microfluidic chip by digital holography in real-time is demonstrated experimentally. The injection pressure of microfluidic device is changed to create different flow rate in microfluidic channels. On this basis, the phase distributions within the microfluidic channels can be reconstructed by using digital holographic microscopy, and then flow rate can be obtain by measuring the phase distributions of cross section. The experiment results show that digital holographic phase image is an effective and real-time detection means for the characteristic parameters of micro-fluid such as flow rate and injection pressure. In addition, the chip calibration is made to ensure the validity of the experimental results.

In this paper, we report a new filter by combining fiber-optic microring and lithium niobate microwaveguide chip. In our design, fiber-optic microring works as a resonator to trapped the resonant light and enlarge its optical energy. The lithium niobate microwaveguide chip serves as a mount to load the fiber-optic microring on the microwaveguide. Then the resonant light coupled from the microring could transmit through the microwaveguide and be detected. We experimentally demonstrated our design and its operation feasibility. The characteristic of the filter could be clearly observed. The results proved that the combination of fiber-optic microring and lithium niobate microwaveguide chip might provide an alternative way to integrate the fiber-optic micro and nanodevices on lithium niobate microwaveguide chip.

Infrared focal plane array detector has advantages of strong anti-interference ability and high sensitivity. Its size, weight and power dissipation has been noticeably decreased compared to the conventional infrared imaging system. With the development of the detector manufacture technology and the cost reduction, IRFPA detector has been widely used in the military and commercial fields. Due to the restricting of array chip manufacturing process and material defects, the fault phenomenon such as cracking, bad pixel and abnormal output was showed during the test, which restricts the performance of the infrared detector imaging system, and these effects are gradually intensified with the expanding of the focal plane array size and the shrinking of the pixel size. Based on the analysis of the test results for the infrared detector array chip components, the fault phenomenon was classified. The main cause of the chip component failure is chip cracking, bad pixel and abnormal output. The reason of the failure has been analyzed deeply. According to analyze the mechanism of the failure, a series of measures which contain filtrating materials and optimizing the manufacturing process of array chip components were used to improve the performance of the chip components and the test pass rate, which is used to meet the needs of the detector performance.