1. Atomic layer deposition deposited high dielectric constant (κ) ZrAlOx gate insulator enabling high performance ZnSnO thin film transistors.
- Author
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Huang, Chuan-Xin, Li, Jun, Zhong, De-Yao, Zhao, Cheng-Yu, Zhu, Wen-Qing, Zhang, Jian-Hua, Jiang, Xue-Yin, and Zhang, Zhi-Lin
- Subjects
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ATOMIC layer deposition , *X-ray photoelectron spectroscopy , *ELECTRIC properties , *METAL insulator semiconductors , *RADIO frequency - Abstract
The high κ ZrAlO x gate insulators were deposited by atomic layer deposition on silicon and characterized by the different analytical techniques. The grazing incidence X-ray diffraction (GIXRD) verifies that ZrAlO x thin films show an amorphous structure. The X-ray photoelectron spectroscopy (XPS) confirms that the form of ZrAlO x phase improves the electrical properties and stability of the associated devices. Then, all ZrAlO x thin films were integrated in metal-insulator-semiconductor structures to check the electrical capabilities. They all show a low leakage current density (about 1 × 10 −8 A/cm 2 ) under a high electric field of about 2.0 MV/cm, and exhibit a stable capacitance as a function of frequency. Their associated ZTO TFTs were deposited by a radio frequency sputtering, and the influence of the ZrAlO x thickness on the stabilities under positive bias stress and electrical properties is investigated. The 130 nm ZrAlO x based TFT shows the optimized electrical properties (its mobility, threshold voltage, sub-threshold voltage swing and on-off ratio are 12.5 cm 2 /V, 0.3 V, 0.15 V/dec. and 8 × 10 7 and the good stability with 2.5 V threshold voltage shift under the positive bias voltage stress. The better properties of 130 nm ZrAlO x based TFTs are attributed to a less interface trap states and surface scattering center. [ABSTRACT FROM AUTHOR]
- Published
- 2017
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