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In this work, yttrium (Y) thin films have been deposited on Si (100) substrates by the pulsed laser deposition technique. Ex-situ morphological, structural and optical characterisations of such films have been performed by scanning electron microscopy, X-ray diffractometry, atomic force microscopy and ellipsometry. Polycrystalline films with a thickness of 1.2 μm, homogenous with a root mean square roughness of about 2 nm, were obtained by optimised laser irradiation conditions. Despite the relatively high thickness, the films resulted very adherent to the substrates. The high quality of such thin films is important to the synthesis of metallic photocathodes based on Y thin film, which could be used as electron sources of high photoemission performance in radio-frequency guns.

Pb thin films were prepared by the nanosecond pulsed laser deposition technique on Si (100) and polycrystalline Nb substrates for photocathode application. As the photoemission performances of a cathode are strongly affected by its surface characteristics, the Pb films were grown at different substrate temperatures with the aim of modifying the morphology and structure of thin films. An evident morphological modification in the deposited films with the formation of spherical grains at higher temperatures has been observed. X-ray diffraction measurements showed that a preferred orientation of Pb (111) normal to the substrate was achieved at 30 °C while the Pb (200) plane became strongly pronounced with the increase in the substrate temperature. Finally, a Pb thin film deposited on Nb substrate at 30 °C and tested as the photocathode showed interesting results for the application of such a device in superconducting radio frequency guns.

A Finite Element Method (FEM) study of the coupled thermal-stress during the heteroepitaxial growth induced by excimer laser radiation of patterned amorphous hydrogenated silicon (a-Si:H) and germanium (a-Ge:H) bi-layers deposited on a Si(100) wafer is presented. The ArF (193 nm) excimer laser provides high energy densities during very short laser pulse (20 ns) provoking, at the same time, melting and solidification phenomena in the range of several tenths of nanoseconds. These phenomena play an important role during the growth of heteroepitaxial SiGe structures characterized by high Ge concentration buried under a Si rich surface. In addition, the thermal-stresses that appear before the melting and after the solidification processes can also affect to the epitaxial growth of high quality SiGe alloys in these patterned structures and, in consequence, it is necessary to predict their effects. The aim of this work is to estimate the energy threshold and the corresponding thermal-stresses in the interfaces and the borders of these patterned structures.

In this manuscript, a 3-D axisymmetric model for the heteroepitaxial growth induced by irradiating thin patterned amorphous hydrogenated silicon (a-Si:H) and germanium (a-Ge:H) bi-layers on Si (100) with pulsed UV-laser radiation, is presented. For reducing optimization steps, an efficient simulation of the laser induced processes that include rapid heating and solidification phenomena in the range of several tenth of nanoseconds, must be performed, if alloy composition and quality has to be adjusted. In this study, the effects of various laser energy densities on different amorphous Si/Ge bi-layer structures has been predicted and adjusted to obtain the desired Ge concentration profiles for applications as sacrificial layers, i.e. a Ge containing film buried under a Si rich surface layer. The numerical model includes the temperature dependent variations of the thermophysical properties and takes the coupled effects of temperature and hydrodynamic phenomena for a Boussinesq fluid, to estimate the element interdiffusion during the process and predicting the concentration profiles.

This manuscript presents a numerical analysis of the Excimer Laser Annealing and Crystallization induced in a set of amorphous hydrogenated silicon (a-Si:H) and germanium (a-Ge:H) bi-layers deposited on crystalline (c-) Si(100), with the aim to select the adequate range of energy densities for growing SiGe alloys of definite graded compositions, that might be useful as sacrificial layers for the fabrication of Si based Micro-Electro-Mechanical Systems and Silicon-On-Nothing devices. We have been able to predict the energy threshold to get an adequate epitaxial SiGe alloy growth with a thickness ranging from 10 to 30 nm. Temperature distribution, melting depth as well as the Ge concentration gradient have been calculated and compared with experimental results.