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1. THE ELECTRONIC EQUIPMENT MODAL ANALYSIS BASED ON THE SUB-STRUCTURE

Author

CHAI GuoDong, WANG ShunHui, and CHAI GuoQiang

Subjects
Finite element, Sub-structure, Modal analysis, Electronic equipment, Mechanical engineering and machinery, TJ1-1570, Materials of engineering and construction. Mechanics of materials, TA401-492
Abstract

Using the ANSYS finite element analysis software to analyze the modal of the case and its modules by the substructure method,the natural frequency and mode shape of the equipment are obtained. Synthesizing the results of the modal analysis,the comprehensive structure improvements recommendations are proposed. And the substructure method has important reference value for the large-scale electronic equipments.

Published
2015
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