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Copyright of Foundry Technology (1000-8365) is the property of Foundry Technology Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

In order to expand the application of 3D printing technology to the thick-film hybrid integrated circuits and to improve sintering efficiency of the thick films, four kinds of thick films including three conductor films and a dielectric film were prepared via 3D direct printing followed by laser sintering. Subsequently, microstructures and properties of the obtained films were compared with those of the thick films fabricated by commonly-used screen printing & high-temperature furnace sintering. The results show that the thick conductor and dielectric films produced by using the common method exhibit fine microstructures and good properties. In contrast, the thick conductor films prepared by the 3D direct printing & laser sintering are flat and continuous with a uniform thickness and good welding performance, but the density of the films is not large enough to ensure acceptable adhesion and square resistance. The relative density of the thick dielectric film is much lower than those of the thick conductor films. As a result, the insulation performance of the thick dielectric film does not meet the standard requirements. Overall, it is feasible to prepare the thick conductor/dielectric films via 3D direct writing, but the laser sintering parameters should be optimized to fulfill sintering densification of the thick films, and further to improve their bonding strengths with the ceramic substrates. [ABSTRACT FROM AUTHOR]

To overcome the most important concerns, such as harsh storage conditions and the removal of solvents and surfactants in aerosol jet printing (AJP) technology, a nano-powder aerosol pining device with sheath gas assisted aerodynamic lens focusing was proposed, and the aerosol jet pining system was established, and the effects of pining speed, volume flow ratio of sheath gas and carrier gas on printing efficiency and line morphology were explored. The effects of laser treatment on the resistivity, microscopic morphology and oxidation degree of aerosol printing lines were analyzed by laser sintering experiments and electrochemical performance test experiments. Experimental results show that when the printing speed is 19.20 mm/min and the volume low ratio of sheath gas to carrier gas is 2.65, the minimum width of the printing line is 56.52 µm, After laser sintering, the nano silver powder particles in the printing lines melt and agglomerate and form filaments to bond with each other, which significantly reduces the resistivity of the aerosol printing lines. [ABSTRACT FROM AUTHOR]

Copyright of China Plastics / Zhongguo Suliao is the property of Journal Office of CHINA PLASTICS and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The research status from magnetic substrate design, insulation coating treatment and new preparation technology were reviewed. It pointed out that the density and resistivity of soft magnetic composites could be effectively improved by using magnetic powders with different characteristics to complement the performance or controlling the morphology of the substrate during the design of the magnetic substrate. The insulation coating treatment could be used to increase the resistivity of the soft magnetic composite to reduce eddy current loss, but the addition of non-magnetic phase insulation materials would lead to a decrease in the magnetic permeability and saturation magnetization of the material. The optimized new preparation technology could effectively improve the performance of soft magnetic composite materials, such as plasma sintering, microwave sintering and laser sintering. The current comprehensive performance of soft magnetic composite materials could not meet the development needs of high frequency and miniaturization of electronic components. The future research directions would be further optimization of substrate component design and particle size coordination, development of new coating materials, innovative preparation processes, optimization of process parameters, and perfection of theoretical models. [ABSTRACT FROM AUTHOR]