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In order to ensure the normal operation and safety at work of electronic equipment, the research on thermal management of electronic components has continued increasing in recent years. Graphite film produced with polyimide (PI) as the substrate is an important thermal conductivity material, and its thermal conductivity can be improved through doping modification. Compared with solid thermal conductive filler, ionic liquid has better compatibility with polyimide matrix, and has been commonly used in gas separation membrane, colorless polyimide (CP1) and other applications. This article used 4, 4'-diaminobenzoylanilide (DABA) and 3, 3', 4, 4'-biphenyltetracarboxylic dianhydride (BPDA) as monomers, and modified PI films by using l-ethyl-3-methylimi-dazolium bis[(trifluoromethyl)sulfonyl]imide(lL) that had the characteristic of multiple hydrogen bond sites. Then, high thermal conductivity graphite film was prepared by graphitization. The research results show that when the 1L content is 5.0 wt%, the grain size of the graphite film is 78.417 nm, the degree of graphitization reaches 88%, and the thermal conductivity reaches 770 W/mK, which is 1.53 times that of the pure PI cornerstone ink film. [ABSTRACT FROM AUTHOR]