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Copyright of Journal of Shenzhen University Science & Engineering is the property of Editorial Department of Journal of Shenzhen University Science & Engineering and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Electroplating & Finishing is the property of Electroplating & Finishing Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Polymer Materials Science & Engineering is the property of Sichuan University, Polymer Research Institute and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Electroless plating of Ni--B alloy was conducted on the surface of iron specimen. The effects of the dosage of nickel salt, reducing agent, and complexing agent in the bath, and different stabilizers on the deposition rate, appearance, and microhardness of Ni--B alloy coating were studied. The bath composition was optimized as follows: SF-815 nickel salt A 60 mL/L, SF-815 complexing agent B 200 mL/L, SF-815 reducing agent C 20 mL/L, and thiol-containing compound as stabilizer 5 mg/L. The Ni--B alloy coating obtained by electroless plating from it at pH 6.2-7.2 and temperature 60-70 °C for 1 hour was uniform, semi-bright, fine-grained, and compact with a mass fraction of B ranging from 1.62% to 3.23% and a microhardness of 683.0-753.1 HV. The bath was stable as be shown by keeping clear after being used continuously for 10 turnovers, as well as the appearance and other properties of the coating remained qualified. [ABSTRACT FROM AUTHOR]

Copyright of Electroplating & Finishing is the property of Electroplating & Finishing Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Electroplating & Finishing is the property of Electroplating & Finishing Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Electroplating & Finishing is the property of Electroplating & Finishing Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The variation law of potential and the formation process of zinc layer during the first and secondary zinc dipping were analyzed by electrochemical measurement and scanning electron microscopy. The effect of secondary zinc dipping on initial deposition behavior during alkaline electroless nickel plating was studied. The basic mechanism for secondary zinc dipping in improving the adhesion of nickel coating obtained subsequently was discussed. The results showed that titanium alloy underwent three stages during the first zinc dipping i.e. the dissolution of oxide film, the growth of thin zinc layer, and the dynamic balancing between the growth and dissolution of zinc layer, and a loose whisker-like zinc layer was formed. The general rule for film formation during the secondary zinc dipping was similar to that of the first zinc dipping, but it took less time to reach the dynamic growth--dissolution balance, and the zinc layer formed thereafter was more uniform and compact with a higher coverage. Secondary zinc dipping not only facilitates the quick formation of a complete and uniform nickel coating for the subsequent electroless nickel plating, but also improves the adhesion between titanium alloy and nickel coating. [ABSTRACT FROM AUTHOR]

The influence of complexing agent, solution pH value and temperature on the quality of electroless nickel plating of diamond powder at low temperature were investigated. At the temperature of 35 t and the pH value of 5, the stability of plating solution, deposition rate, morphology and phosphorus (P) content of electroless nickel plating coating were tested and analyzed by changing the ratio of complexing agent. The results show that CeHgO, • H2O (20 g/L) + (CH2)2(COOH)2(5 g/L) is the best complexing agent in test samples. The electroless plating solution corresponding to the complexing agent has good stability and rapid deposition rate (0. 391 5 g/h), and the obtained coating is leak-free and dense, with P weight content of 11. 73%. The deposition rate, morphology and P content of electroless plating samples were measured and analyzed by changing pH value and temperature of plating solution with the best complexing agent. The results show that when the temperature of the plating bath is 35 t and the pH value is 3 ~13, the deposition rate increases and the P content gradually decrease with the increase of the pH value. When the pH value is higher than 11, the rapid reaction rate is difficult to stabilize the pH value of the plating solution, and the plating solution is easy to decompose, so the pH value is more suitable within 5 - 11. The effect of temperature on plating was studied in the range of 30 - 50 t at solution pH value of 5. It is found that the deposition rate and P content increase with the increase of temperature, and the plating layer is dense and leak-free. When the temperature is higher than 45 t, the reaction rate is too fast and it is not easy to stabilize the pH value of the plating solution, so the temperature is more appropriate in the range from 35 t to 45 C. [ABSTRACT FROM AUTHOR]

Copyright of Acta Materiae Compositae Sinica is the property of Acta Materiea Compositae Sinica Editorial Department and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Electroplating & Finishing is the property of Electroplating & Finishing Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Electroplating & Finishing is the property of Electroplating & Finishing Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Electroplating & Finishing is the property of Electroplating & Finishing Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Electronic Components & Materials is the property of Electronic Components & Materials and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The paper reports an electroless method to prepare Ni-Mo-Cr-P alloy depositions. It also studiesthe structure and anti-corrosion behaviors with the increase of the heat-treatment temperature, andcarriesout further analysis regarding the reasons. The results show the as-deposited Ni-Mo-Cr-P films are amorphous state, but the Ni3P phase is emerged at 300 °C and more crystalline Ni is generated at 400 °C. Nickel is fully crystallized at 500 °C and Cr1.122Ni2.88 is evolved. Additionally, there are Cr2Ni3, CuNi, Cu3.8Ni and Mo1.24Ni0.76 formed at 600 °C, while Cu0.8lNi0.19, MoNi3and Ni3P are re-crystallized at 700 CC with the formation of oxide layer (NiO) on the depositions. The electrochemical analysis reveals the as-deposited Ni-Mo-Cr-P alloy films see better performance of anti-corrosion than Ni-P and Ni-Mo-P depositions. Moreover, the anti-corrosion of Ni-Mo-Cr-P is further enhanced after the crystallization at 400 °C and higher heat-treatment temperature will lead to the inferior anti-corrosion performance. [ABSTRACT FROM AUTHOR]

Copyright of China Sciencepaper is the property of China Sciencepaper and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)