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The microstructural features and mechanical properties of a B 4 C particle-reinforced Cu matrix composite prepared by friction stir welding (FSW) were investigated. For this purpose, the FSW process was carried out along a 0.6-mm-width gap, between two Cu plates, filled with boron carbide (B 4 C) particles. Microstructural observations taken in the stir zone (SZ) revealed that the presence of B 4 C particles led to the evolution of fine grains (∼2 μm). Based on the hardness measurements of the FSW-fabricated samples, the hardness values were significantly improved after the B 4 C particles were incorporated. [ABSTRACT FROM AUTHOR]

High heat-endurance bonding between Cu Ni was investigated by hybrid transient liquid phase sintering bonding. By simultaneously adding Cu and Ni to SAC305, the IMC was stably formed, and the bonding strength of hybrid TLPS joint was the highest. It is expected to be used for SiC die attachment of power module packaging. [Display omitted] • Novel hybrid transient liquid phase sintering bonding is developed for Cu Ni bonding. • Fast and stable ternary (Cu,Ni)-Sn IMCs were formed by hybrid transient liquid phase sintering bonding. • Electron probe micro-analyzer was used for investigating the atomic distribution of TLPS joints. A novel approach to copper-nickel bonding was investigated by hybrid transient liquid phase sintering (TLPS) method. Hybrid bonding material containing copper, nickel, and Sn-3.0Ag-0.5Cu (SAC305) and an organic solvent was fabricated to form a fast and stable ternary Cu Ni Sn intermetallic compound (IMC) joint between Cu to Ni joint. The atomic distribution was analyzed by an electron probe micro-analyzer, showing full IMC formation of the hybrid TLPS joint. In addition, by simultaneously adding Cu and Ni to SAC305, the IMC was stably formed, and the bonding strength of hybrid TLPS joint was the highest. [ABSTRACT FROM AUTHOR]