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Doped hydrogenated amorphous silicon (a-Si:H) films of only a few nanometer thin find application in a-Si:H/crystalline silicon heterojunction solar cells. Although such films may yield a field effect at the interface, their electronic passivation properties are often found to be inferior, compared to those of their intrinsic counterparts. In this article, based on H2 effusion experiments, the authors argue that this phenomenon is caused by Fermi energy dependent Si¿H bond rupture in the a-Si:H films, for either type of doping. This results in the creation of Si dangling bonds, counteracting intentional doping of the a-Si:H matrix, and lowering the passivation quality. [ABSTRACT FROM AUTHOR]

Silicon heterojunction solar cells consist of crystalline silicon (c-Si) wafers coated with doped/ intrinsic hydrogenated amorphous silicon (a-Si:H) bilayers for passivating-contact formation. Here, we unambiguously demonstrate that carrier injection either due to light soaking or (dark) forwardvoltage bias increases the open circuit voltage and fill factor of finished cells, leading to a conversion efficiency gain of up to 0.3% absolute. This phenomenon contrasts markedly with the light-induced degradation known for thin-film a-Si:H solar cells. We associate our performance gain with an increase in surface passivation, which we find is specific to doped a-Si:H/c-Si structures. Our experiments suggest that this improvement originates from a reduced density of recombination-active interface states. To understand the time dependence of the observed phenomena, a kinetic model is presented. [ABSTRACT FROM AUTHOR]

Intrinsic hydrogenated amorphous silicon films can yield outstanding electronic surface passivation of crystalline silicon wafers. In this letter the authors confirm that this is strongly determined by the abruptness of the interface. For completely amorphous films the passivation quality improves by annealing at temperatures up to 260 °C, most likely by film relaxation. This is different when an epitaxial layer has been grown at the interface during film deposition. Annealing is in such a case detrimental for the passivation. Consequently, the authors argue that annealing followed by carrier lifetime measurements allows determining whether the interface is abrupt. [ABSTRACT FROM AUTHOR]

Excellent amorphous/crystalline silicon interface passivation is of extreme importance for high-efficiency silicon heterojunction solar cells. This can be obtained by inserting hydrogen-plasma treatments during deposition of the amorphous silicon passivation layers. Prolonged hydrogen-plasmas lead to film etching. We report on the defect creation induced by such treatments: A severe drop in interface-passivation quality is observed when films are etched to a thickness of less than 8 nm. Detailed characterization shows that this decay is due to persistent defects created at the crystalline silicon surface. Pristine interfaces are preserved when the post-etching film thickness exceeds 8 nm, yielding high quality interface passivation. [ABSTRACT FROM AUTHOR]

Amorphous/crystalline silicon interfaces feature considerably larger valence than conduction band offsets. In this article, we analyze the impact of such band offset asymmetry on the performance of silicon heterojunction solar cells. To this end, we use silicon suboxides as passivation layers-- inserted between substrate and (front or rear) contacts--since such layers enable intentionally exacerbated band-offset asymmetry. Investigating all topologically possible passivation layer permutations and focussing on light and dark current-voltage characteristics, we confirm that to avoid fill factor losses, wider-bandgap silicon oxide films (of at least several nanometer thin) should be avoided in hole-collecting contacts. As a consequence, device implementation of such films as window layers--without degraded carrier collection--demands electron collection at the front and hole collection at the rear. Furthermore, at elevated operating temperatures, once possible carrier transport barriers are overcome by thermionic (field) emission, the device performance is mainly dictated by the passivation of its surfaces. In this context, compared to the standard amorphous silicon layers, the wide-bandgap oxide layers applied here passivate remarkably better at these temperatures, which may represent an additional benefit under practical operation conditions. [ABSTRACT FROM AUTHOR]

Low-temperature (≤200 °C) epitaxial growth yields precise thickness, doping, and thermal-budget control, which enables advanced-design semiconductor devices. In this paper, we use plasmaenhanced chemical vapor deposition to grow homo-epitaxial layers and study the different growth modes on crystalline silicon substrates. In particular, we determine the conditions leading to epitaxial growth in light of a model that depends only on the silane concentration in the plasma and the mean free path length of surface adatoms. For such growth, we show that the presence of a persistent defective interface layer between the crystalline silicon substrate and the epitaxial layer stems not only from the growth conditions but also from unintentional contamination of the reactor. Based on our findings, we determine the plasma conditions to grow high-quality bulk epitaxial films and propose a two-step growth process to obtain device-grade material. [ABSTRACT FROM AUTHOR]

Passivating metal/silicon contacts combine low carrier recombination with low contact resistivities, enabled by a low gap state density at their interface. Such contacts find applications in high-efficiency solar cells. We perform first-principles calculations based on density functional theory to investigate the surface defect and metal-induced gap state density of silicon in close contact with metals (Al and Ag). We confirm that surface hydrogenation fully removes surface-defect gap states of (111)-oriented silicon surfaces. However, the metal-induced gap state density increases significantly when metals are closer than 0.5 nm to such surfaces. These results highlight the importance of the tunneling-film thickness in achieving effective passivating-contact formation. [ABSTRACT FROM AUTHOR]

Perovskite/crystalline silicon tandem solar cells have the potential to reach efficiencies beyond those of silicon single-junction record devices. However, the high-temperature process of 500 °C needed for state-of-the-art mesoscopic perovskite cells has, so far, been limiting their implementation in monolithic tandem devices. Here, we demonstrate the applicability of zinc tin oxide as a recombination layer and show its electrical and optical stability at temperatures up to 500 °C. To prove the concept, we fabricate monolithic tandem cells with mesoscopic top cell with up to 16% efficiency. We then investigate the effect of zinc tin oxide layer thickness variation, showing a strong influence on the optical interference pattern within the tandem device. Finally, we discuss the perspective of mesoscopic perovskite cells for high-efficiency monolithic tandem solar cells. [ABSTRACT FROM AUTHOR]

In amorphous/crystalline silicon heterojunction solar cells, an inversion layer is present at the front interface. By combining numerical simulations and experiments, we examine the contribution of the inversion layer to lateral transport and assess whether this layer can be exploited to replace the front transparent conductive oxide (TCO) in devices. For this, heterojunction solar cells of different areas (2 × 2, 4 × 4, and 6 × 6 mm2) with and without TCO layers on the front side were prepared. Laser-beam-induced current measurements are compared with simulation results from the ASPIN2 semiconductor simulator. Current collection is constant across millimeter distances for cells with TCO; however, carriers traveling more than a few hundred microns in cells without TCO recombine before they can be collected. Simulations show that increasing the valence band offset increases the concentration of holes under the surface of n-type crystalline silicon, which increases the conductivity of the inversion layer. Unfortunately, this also impedes transport across the barrier to the emitter. We conclude that the lateral conductivity of the inversion layer may not suffice to fully replace the front TCO in heterojunction devices. [ABSTRACT FROM AUTHOR]

Silicon heterojunction solar cells have record-high open-circuit voltages but suffer from reduced short-circuit currents due in large part to parasitic absorption in the amorphous silicon, transparent conductive oxide (TCO), and metal layers. We previously identified and quantified visible and ultraviolet parasitic absorption in heterojunctions; here, we extend the analysis to infrared light in heterojunction solar cells with efficiencies exceeding 20%. An extensive experimental investigation of the TCO layers indicates that the rear layer serves as a crucial electrical contact between amorphous silicon and the metal reflector. If very transparent and at least 150 nm thick, the rear TCO layer also maximizes infrared response. An optical model that combines a ray-tracing algorithm and a thin-film simulator reveals why: parallel-polarized light arriving at the rear surface at oblique incidence excites surface plasmons in the metal reflector, and this parasitic absorption in the metal can exceed the absorption in the TCO layer itself. Thick TCO layers-or dielectric layers, in rear-passivated diffused-junction silicon solar cells-reduce the penetration of the evanescent waves to the metal, thereby increasing internal reflectance at the rear surface. With an optimized rear TCO layer, the front TCO dominates the infrared losses in heterojunction solar cells. As its thickness and carrier density are constrained by anti-reflection and lateral conduction requirements, the front TCO can be improved only by increasing its electron mobility. Cell results attest to the power of TCO optimization: With a high-mobility front TCO and a 150-nm-thick, highly transparent rear ITO layer, we recently reported a 4-cm2 silicon heterojunction solar cell with an active-area short-circuit current density of nearly 39 mA/cm2 and a certified efficiency of over 22%. [ABSTRACT FROM AUTHOR]