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Electronic and mechanical properties, and their biocompatibility, make diamond-based materials promising biomedical applications. The cost required to produce high quality single crystalline diamond films is still a hurdle to prevent them from commercial applications, but the emergence of polycrystalline diamond (PCD) films grown by chemical vapour deposition (CVD) method has provided an affordable strategy. PCD films grown on silicon wafer have been used throughout and were fully characterised by SEM, XPS, Raman spectroscopy and FTIR. The samples contain nearly pure carbon, with impurities originated from the CVD growth and the silicon etching process. Raman spectroscopy revealed it contained tetrahedral amorphous carbon with small tensile stress. The sp2 carbon content, comprised between 16.1 and 18.8%, is attributed to the diamond grain boundaries and iron-catalysed graphitisation. Antibacterial properties of PCD films were performed with two model bacteria, i.e. Escherichia coli (Gram-negative) and Staphylococcus aureus (Gram-positive) using direct contact and shaking flask methods. The samples showed strong bacteriostatic properties against S. aureus and E. coli with the direct contact method and no influence on planktonic bacterial growth. These results suggest that the bacteriostatic mechanism of PCD films is linked to their surface functional groups (carbon radicals and –NH 2 and –COOH groups) and that no diffusible molecules or components were involved. [ABSTRACT FROM AUTHOR]

Diamond radiation detector is an ideal choice for the next-generation radiation detection in harsh environments, due to its small size, high irradiation resistance and fast response. However, high-purity single crystal diamond is hard to be prepared at the high growth rate due to the inevitable impurity incorporation. In this paper, based on the high-quality high-temperature/high-pressure (HPHT) single crystal diamond substrate, detector-grade single crystal diamonds material with high purity and low defect density were epitaxially grown at growth rate of about 4 μm/h by using plasma environment purification technology. It showed that the full width at half maximum of X-ray rocking curve of high-quality single crystal diamond could reach 0.007°, there was no nitrogen related impurity in PL spectrum, and the substitutional nitrogen content estimated by UV absorption spectrum was less than 10 ppb. After metallization and packaging process, the diamond detectors were prepared and the detector response under irradiation with 241Am α-particles was realized. For the sample with fewer dislocations, the charge collection efficiency and energy resolution of this detector were 86.8 % and 7.85 % for electrons, and 96.7 % and 2.48 % for holes. The product of mobility and lifetime of electrons and holes were 1.7 × 10−4 cm2V−1 and 3.7 × 10−4 cm2V−1, respectively. The high performances of the detector indicate that the current diamond detector can meet the application requirements of commercial diamond detectors. [Display omitted] • Detector-grade diamond was prepared by plasma environment purification technology. • The high-purity single crystal diamond was grown at growth rate of about 4 μm/h. • The diamond detector with charge collection efficiency of 96.7 % was realized. • The products of mobility and lifetime of electrons and holes were 1.7 × 10−4 and 3.7 × 10−4 cm2V−1. [ABSTRACT FROM AUTHOR]

Lift-off is a promising method to prepare thin, high-finish, and freestanding large-area single crystal and polycrystalline diamonds. However, accurate control of the damage layer characteristic to achieve both stress release and lift-off process is difficult. In this work, high-energy C+ was implanted in single crystal diamond and polycrystalline diamond to create subsurface damage. The defect behavior and structural transformation of the ion implantation and annealing process were investigated. The homoepitaxial growth was subsequently carried out and the epitaxial layer was lifted off from the substrate by selectively etching the damaged layer. The results show that the cap layer and the substrate (below the damage layer) keep the sp3 carbon structure before and after annealing, which is confirmed by the atomic-scale electron energy loss spectroscopy (EELS). The high-resolution transmission electron microscopy (HRTEM) images show that after annealing at 1000 °C for 1 h, the damaged layer was transformed from amorphous carbon to a mixture of graphite and amorphous carbon, providing the damaged layer that could be removed by electrochemical solution. Meanwhile, the distorted diamond area was changed to a sharp interface, which ensures the low roughness of the substrate surface after the lift-off process. After etching for 30 h, a freestanding polycrystalline diamond film with a thickness of 100 μm and a surface roughness of 1.68 nm was obtained. The roughness of the lift-off substrate surface is 1.10 nm, indicating the epitaxial growth can be repeated directly without polishing. [Display omitted] • The defect behavior and structural transformation of the high-energy C+ implanted diamonds were investigated. • The stress state of the diamonds before and after ion implantation and after lift-off process were evaluated. • A 100 μm-thick freestanding polycrystalline diamond film with a surface roughness of 1.68 nm was successful obtained. [ABSTRACT FROM AUTHOR]

Surface etching of single-crystal diamond (SCD) in hydrogen plasma plays a decisive role for high-quality homoepitaxy and surface conduction of diamond. The complexity of surface/subsurface condition such as defects would give rise to the distinct morphology features and even further result in the unpredictable properties. Correspondingly, the evolutionary relationship between the morphology and electrical properties of mechanically polished SCDs which have typical cleavage damage in microns depth after hydrogen plasma treatment still needs to be further completed. In this work, the chemical vapor deposited (CVD) SCDs with uniform polishing-caused subsurface cleavage were immersed in microwave hydrogen plasma for variable duration. Time-dependent morphological evolution, multi-mode etched pits (EPs) (resulting from local defects/cracks and dislocations) and associated etching mechanism were comprehensively studied. At the early stage of plasma treatment before 60 min, owing to the obvious surface roughing generated by preferential etching (with the rate of >400 nm/h) of severe mechanically damaged regions, the hole mobility was significantly deteriorated, also accompanying with the apparent drop of sheet concentration. Concurrently, the deposited surface sp 2 amorphous carbon (a -C) nanodots on diamond surface and non- sp 3 hydrogen bonds reconstruction, which arising from defect-etching produced local abundant carbon-containing radicals or possible exfoliation generated by hydrogen penetration of massive defective regions, also would play an adverse role for the conduction associated with (100) C–H surface. However, the surface roughness was reduced from the maximum 13.2 nm–4.2 nm by prolonging etching, resulting from the smoothing effect of small-angle crystal misorientation on waved height difference related to the uniform (111) cleavage and the removal of dense irregular EPs associated with polishing-induced local defects as well as the vanishing of surface a -C nanodots. In this case, the improvement of surface electrical properties together with the negative correlation of the mobility and sheet concentration were appeared by the gradual formation of (100) diamond surface and the building of uniform (100) C–H bonds. • CVD SCDs with typical subsurface damages(defects) were treated in pure hydrogen plasma. • Morphology evolution associated with polishing defects was time-dependently presented. • Surface sp2 nanodots deposition from defect-etching and CH reconstruction would affect electrical properties. [ABSTRACT FROM AUTHOR]

In order to realize the practical use of diamond as a semiconductor material, large-area single-crystal diamond wafers with uniform quality are required. Mosaic growth is an effective method to produce inch-grade single-crystal diamonds. However, the quality of the wafer is limited by the junction interface seriously, because cracking occurs easily due to the high internal stress. In this paper, the repetition growth method was adopted to grow mosaic splicing single-crystal diamond without polycrystalline diamond interface. The high-quality single crystal diamond slices were reduplicated by microwave plasma chemical vapor deposition (MPCVD). The substrates were obtained by cutting a piece of CVD diamond along a plane perpendicular to 〈001〉 (with a (100)-oriented surface). The evolution of the growth characteristics around the junction of the substrates at different stages was studied. The results show that the surface of the epitaxial layers gradually evolves from blurry terraces to a regular well-ordered step flow. When the substrates have the same deviation direction and the off-direction angles are within 3°, the junction of the substrates can connect smoothly. Raman mapping shows that there is a mixture of tensile stress and compressive stress near the junction. As the thickness of the epitaxial layer increases from 280 μm to 560 μm, the range of tensile stress near the joint area expands from 85 μm to 150 μm, the maximum tensile stress increases from 0.08 GPa to 0.16 GPa. In addition, the value of FWHM in the X-ray rocking curve is less than 2.80 cm−1 around the junction, which indicates good crystal quality. [Display omitted] • The evolution of growth characteristics around the junction in the mosaic diamond was studied. • The mosaic boundary evolved from blurry terraces to a well-ordered step flow and finally connected. • The lowest value of tensile stress near the joint area was reported as the film thickness increased. • The larger FWHM of Raman peak around the junction is caused by the increased tensile stress. • The "inherit" effect of NV content of the epitaxial layer was observed for the corresponding substrate. [ABSTRACT FROM AUTHOR]