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In this paper, pure Sb and composite multilayer In2Se3/Sb thin films were prepared on a SiO2/Si substrate. The effects of the addition of In2Se3 interlayers on the physical and electrical properties of phase change thin films were investigated. Compared with pure Sb film, the composite multilayer In2Se3/Sb film had a higher crystallization temperature (~145 °C), larger crystallization activation energy (~2.48 eV), less resistance drift (~0.0238) and better thermal stability. The results of X-ray photoelectron spectroscopy indicated that the In-Sb bond was formed in the multilayer In2Se3/Sb film. The near infrared spectrophotometer showed that the band gap changed at different annealing temperatures. Changing the annealing temperature of the film allowed for the phase structure of the film to be studied by using X-ray diffractometer. The surface morphology and electrostatic potential at different annealing temperatures were using atomic force microscope. It was found that the flat film had a smoother surface. Phase-change memory devices based on [In2Se3(4 nm)/Sb(6 nm)]8 film reduced power consumption by approximately 74% compared to pure Sb film. In conclusion, the In2Se3 interlayers effectively inhibited the resistance drift of the phase change thin film and enhanced its thermal stability. [ABSTRACT FROM AUTHOR]

The selector is an indispensable section of the phase change memory (PCM) chip, where it not only suppresses the crosstalk, but also provides high on-current to melt the incorporated phase change material. In fact, the ovonic threshold switching (OTS) selector is utilized in 3D stacking PCM chips by virtue of its high scalability and driving capability. In this paper, the influence of Si concentration on the electrical properties of Si-Te OTS materials is studied; the threshold voltage and leakage current remain basically unchanged with the decrease in electrode diameter. Meanwhile, the on-current density (Jon) increases significantly as the device is scaling down, and 25 MA/cm2 on-current density is achieved in the 60-nm SiTe device. In addition, we also determine the state of the Si-Te OTS layer and preliminarily obtain the approximate band structure, from which we infer that the conduction mechanism conforms to the Poole-Frenkel (PF) model. [ABSTRACT FROM AUTHOR]

High density phase change memory array requires both minimized critical dimension (CD) and maximized process window for the phase change material layer. High in-wafer uniformity of the nanoscale patterning of chalcogenides material is challenging given the optical proximity effect (OPE) in the lithography process and the micro-loading effect in the etching process. In this study, we demonstrate an approach to fabricate high density phase change material arrays with half-pitch down to around 70 nm by the co-optimization of lithography and plasma etching process. The focused-energy matrix was performed to improve the pattern process window of phase change material on a 12-inch wafer. A variety of patternings from an isolated line to a dense pitch line were investigated using immersion lithography system. The collapse of the edge line is observed due to the OPE induced shrinkage in linewidth, which is deteriorative as the patterning density increases. The sub-resolution assist feature (SRAF) was placed to increase the width of the lines at both edges of each patterning by taking advantage of the optical interference between the main features and the assistant features. The survival of the line at the edges is confirmed with around a 70 nm half-pitch feature in various arrays. A uniform etching profile across the pitch line pattern of phase change material was demonstrated in which the micro-loading effect and the plasma etching damage were significantly suppressed by co-optimizing the etching parameters. The results pave the way to achieve high density device arrays with improved uniformity and reliability for mass storage applications. [ABSTRACT FROM AUTHOR]

Phase-change random-access memory (PCRAM) holds great promise for next-generation information storage applications. As a mature phase change material, Ge2Sb2Te5 alloy (GST) relies on the distinct electrical properties of different states to achieve information storage, but there are relatively few studies on the relationship between electron transport and microstructure. In this work, we found that the first resistance dropping in GST film is related to the increase of carrier concentration, in which the atomic bonding environment changes substantially during the crystallization process. The second resistance dropping is related to the increase of carrier mobility. Besides, during the cubic to the hexagonal phase transition, the nanograins grow significantly from ~50 nm to ~300 nm, which reduces the carrier scattering effect. Our study lays the foundation for precisely controlling the storage states of GST-based PCRAM devices. [ABSTRACT FROM AUTHOR]

Phase change memory (PCM), due to the advantages in capacity and endurance, has the opportunity to become the next generation of general−purpose memory. However, operation speed and data retention are still bottlenecks for PCM development. The most direct way to solve this problem is to find a material with high speed and good thermal stability. In this paper, platinum doping is proposed to improve performance. The 10-year data retention temperature of the doped material is up to 104 °C; the device achieves an operation speed of 6 ns and more than 3 × 105 operation cycles. An excellent performance was derived from the reduced grain size (10 nm) and the smaller density change rate (4.76%), which are less than those of Ge2Sb2Te5 (GST) and Sb2Te3. Hence, platinum doping is an effective approach to improve the performance of PCM and provide both good thermal stability and high operation speed. [ABSTRACT FROM AUTHOR]

To solve the problems of complex structure, poor reliability, and low intelligence of existing fan clutches for large hybrid vehicles, this paper proposes a new adaptive shape memory alloy intelligent fan clutch for large hybrid vehicle motor cooling. Based on the pure shear shape memory alloy thermodynamic effects, the relationship between shape memory alloy spring recovery force and temperature has been established; based on the shape memory alloy spring thermal drive characteristics and clutch construction dimensions, clutch torque transmission equations have been established. The shape memory alloy fan clutch transmission characteristics were quantitatively analyzed in terms of temperature, torque, rotational speed, and slip rate. The results show that the shape memory alloy fan clutch model based on the finite element method (FEM) and the established transmission model can accurately describe the mechanical characteristics of the shape memory alloy phase change process and the clutch torque transmission characteristics. When the clutch input speed is 3000 rad/min and the temperature is 100 °C, the output torque is 19.04 N·m, the speed is 2877.2 rad/min, and the slip rate is 4.3%. Due to the shape memory effect of shape memory alloy, the clutch can intelligently adjust the fan speed by sensing the ambient temperature. A fan clutch can satisfy the heat dissipation requirement of a large hybrid vehicle's transmission system under complicated road conditions. [ABSTRACT FROM AUTHOR]

The integration level is a significant index that can be used to characterize the performance of non-volatile memory devices. This paper proposes innovative design schemes for high-density integrated phase change memory (PCM). In these schemes, diploid and four-fold memory units, which are composed of nano-strip film GST-based memory cells, are employed to replace the memory unit of a conventional vertical PCM array. As the phase transformation process of the phase change material involves the coupling of electrical and thermal processes, an in-house electrothermal coupling simulator is developed to analyze the performance of the proposed memory cells and arrays. In the simulator, a proven mathematical model is used to describe the phase change mechanism, with a finite element approach implemented for numerical calculations. The characteristics of the GST-strip-based memory cell are simulated first and compared with a conventional vertical cell, with a decrease of 32% in the reset current amplitude achieved. Next, the influences of geometric parameters on the characteristics of memory cell are investigated systematically. After this, the electrothermal characteristics of the proposed vertical PCM arrays are simulated and the results indicate that they possess both excellent performance and scalability. At last, the integration densities of the proposed design schemes are compared with the reference array, with a maximum time of 5.94 achieved. [ABSTRACT FROM AUTHOR]

The combination of the integrated waveguide and phase-change materials (PCMs) provides a promising platform for reconfigurable and multifunctional photoelectric devices. Through plasmonic enhancement and the low loss propagation of the waveguide, the footprint and power consumption of the photoelectric device can be effectively improved. In this work, a metal double-ring structure embedded with phase change materials was proposed to utilize the plasmonic effect for enhancement of the light-matter interaction. In particular, the overall temperature difference in the PCM cell can be confined within 2 °C during the crystallization process, thus avoiding the interior heterogeneous crystallization. The insertion loss of the cell in amorphous and crystalline states at a wavelength of 1550 nm are 2.3 dB and 1.0 dB, respectively. A signal contrast ratio of 15.8% is achieved under the ultra-small footprint (50 × 90 nm2) at a wavelength of 1550 nm. [ABSTRACT FROM AUTHOR]

Ge-rich Ge–Sb–Te compounds are attractive materials for future phase change memories due to their greater crystallization temperature as it provides a wide range of applications. Herein, we report the self-assembled Ge-rich Ge–Sb–Te/Sb2Te3 core-shell nanowires grown by metal-organic chemical vapor deposition. The core Ge-rich Ge–Sb–Te nanowires were self-assembled through the vapor–liquid–solid mechanism, catalyzed by Au nanoparticles on Si (100) and SiO2/Si substrates; conformal overgrowth of the Sb2Te3 shell was subsequently performed at room temperature to realize the core-shell heterostructures. Both Ge-rich Ge–Sb–Te core and Ge-rich Ge–Sb–Te/Sb2Te3 core-shell nanowires were extensively characterized by means of scanning electron microscopy, high resolution transmission electron microscopy, X-ray diffraction, Raman microspectroscopy, and electron energy loss spectroscopy to analyze the surface morphology, crystalline structure, vibrational properties, and elemental composition. [ABSTRACT FROM AUTHOR]

Ge-Sb-Te-based phase change memory alloys have recently attracted a lot of attention due to their promising applications in the fields of photonics, non-volatile data storage, and neuromorphic computing. Of particular interest is the understanding of the structural changes and underlying mechanisms induced by short optical pulses. This work reports on structural changes induced by single nanosecond UV laser pulses in amorphous and epitaxial Ge2Sb2Te5 (GST) thin films. The phase changes within the thin films are studied by a combined approach using X-ray diffraction and transmission electron microscopy. The results reveal different phase transitions such as crystalline-to-amorphous phase changes, interface assisted crystallization of the cubic GST phase and structural transformations within crystalline phases. In particular, it is found that crystalline interfaces serve as crystallization templates for epitaxial formation of metastable cubic GST phase upon phase transitions. By varying the laser fluence, GST thin films consisting of multiple phases and different amorphous to crystalline volume ratios can be achieved in this approach, offering a possibility of multilevel data storage and realization of memory devices with very low resistance drift. In addition, this work demonstrates amorphization and crystallization of GST thin films by using only one UV laser with one single pulse duration and one wavelength. Overall, the presented results offer new perspectives on switching pathways in Ge-Sb-Te-based materials and show the potential of epitaxial Ge-Sb-Te thin films for applications in advanced phase change memory concepts. [ABSTRACT FROM AUTHOR]