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The rapid development of miniaturized, high-frequency, and highly integrated microelectronic devices has brought about critical issues in electromagnetic compatibility and thermal management. In recent years, there has been significant interest in lightweight polymer-based composites that offer both electromagnetic interference (EMI) shielding and thermal conductivity. One promising approach involves constructing three-dimensional (3D) interconnection networks using functional fillers in the polymer matrix. These networks have been proven effective in enhancing the thermal and electrical conductivity of the composites. This mini-review focuses on the preparation and properties of 3D network-reinforced polymer composites, specifically those incorporating metal, carbon, ceramic, and hybrid networks. By comparing the effects of different filler types and distribution on the composite materials, the advantages of 3D interconnected conductive networks in polymer composites are highlighted. Additionally, this review addresses the challenges faced in the field of multifunctional thermal management and electromagnetic protection materials and provides insights into future development trends and application prospects of 3D structured composites. [ABSTRACT FROM AUTHOR]

With the development of electronic components towards high power, high packaging density, and miniaturization of device size, heat dissipation and the electromagnetic interference problems between the electronic components are emerging. In order to solve the undesirable electromagnetic wave and heat emissions produced by electronic device simultaneously, the electronic packaging materials with high thermal conductivity and anti-electromagnetic interference are highly expected. In this work, NiFe2O4-modified short carbon fibers (SCF) were designed and prepared. NiFe2O4 were in situ grown on the surface of SCF by hydrothermal method. The chemical structure and morphology of SCF-NiFe2O4 were characterized by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). The microwave absorbing performance test shows that SCF-NiFe2O4 possess superior microwave absorbing performance, where the minimum reflection loss is − 20.7 dB. Finally, SCF-NiFe2O4/epoxy resin composites were prepared by introducing SCF-NiFe2O4 as thermal conductive filler into epoxy resin. The surface-modified SCF with NiFe2O4 is more easily infiltrated by resin and exhibits strong interfacial interaction with the matrix. With the increase of the content of SCF-NiFe2O4, the thermal conductivity of the composites increases obviously. When the content of SCF-NiFe2O4 reaches 20 vol%, the composites show better thermal conductivity, and the thermal conductivity reaches 1.03 W/m K. [ABSTRACT FROM AUTHOR]

• MXene/AgNWs aerogels with interpenetrating double-network structure were fabricated. • The porous structure contributes to higher attenuation of electromagnetic waves. • 3D network provides channel for electron and phonon transmission in epoxy composites. • The composites possess remarkable EMI SE and thermal conductivity. The novel multifunctional materials with anti-electromagnetic interference (EMI) and effective thermal management are ideal for modern electronic industry. Generally, the EMI shielding effectiveness (SE) and thermal conductivity (TC) of materials can be effectively enhanced by compounding with high electrically and thermally conductive fillers. However, it seems that the high-performance cannot be compensated without sacrificing the high fillers loading. Herein, from one-dimensional silver nanowires (AgNWs) and two-dimensional MXene, three-dimensional MXene/AgNWs aerogels were designed as electric and heat transferring skeletons for epoxy nanocomposites by directional-freezing and freeze-drying methods. The resultant MXene/AgNWs/Epoxy nanocomposites with a low MXene/AgNWs content of 8.2 wt% combine a high electrical conductivity of 1532 S/m, and an exceptional EMI SE value of 94.1 dB with 3 mm thickness at the X-band frequency, as well as an improved TC of 2.34 W/m·K. The fabricated MXene/AgNWs/Epoxy nanocomposites possess excellent comprehensive properties enable valuable applications in electronic devices for EMI shielding and thermal management. [ABSTRACT FROM AUTHOR]

For new-generation miniaturized and high-frequency electronics, it is of vital importance to develop advanced electronic packaging materials, which combine high electromagnetic interference (EMI) shielding effectiveness (SE) and efficient thermal management capabilities, including heat absorption, thermal conductivity (TC) and heat dissipation. However, high EMI SE and efficient thermal management usually cannot complement each other for the same packaging material, because EMI shielding devices convert electromagnetic radiation directly into heat consumption, leading to consequent severe challenge to dispose heat dissipation. Herein, we have newly developed a high-performance phase change composites, in which MXene is confined in shape-stabilized phase change material (PCM) for simultaneous achievement of high EMI SE and efficient thermal management. Regarding high EMI, MXene can effectively shield electromagnetic radiation by converting the radiation into heat consumption. As for thermal management, PCM enables efficient heat absorption via the phase change process, and MXene enhances the thermal conductivity (TC) of MXene/PCM composite to facilitate heat dissipation. As a result, our developed MXene/PCM composite can achieve a high EMI SE of 64.7 dB in X-band, with an improved TC of 0.74 W/m·K. Furthermore, the interlayer capillary effect of MXene inhibits the leakage of liquid PCM during the solid-liquid phase transition, which can maintain the PCM shape stability. Our newly-designed shape-stabilized MXene/PCM composites with high EMI SE and large TC shed new light on designing EMI shielding materials with prolonged exposure to electromagnetic radiation, which can be envisioned to exhibit vast implications for advanced new-generation miniaturized and high-frequency electronics. [Display omitted] [ABSTRACT FROM AUTHOR]