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The effects of Si doping on the evolution of stress in AlxGa1-xN:Si thin films (x≈0.4–0.6) grown on 6H-SiC by metal organic chemical vapor deposition were investigated using in situ wafer curvature measurements. The results were correlated with changes in film microstructure as observed by transmission electron microscopy. The incorporation of Si into the films resulted in a compressive-to-tensile transition in the biaxial stress at the surface, and the magnitude of the tensile stress was found to increase in proportion to the Si concentration. The stress gradient was attributed to Si-induced dislocation inclination resulting from an effective climb mechanism. Si doping also resulted in a decrease in the threading dislocation density in the AlxGa1-xN layers, which was attributed to increased dislocation interaction and annihilation. The model describing tensile stress generated by dislocation effective climb was modified to account for the dislocation reduction and was found to yield an improved fit to the experimental stress-thickness data. [ABSTRACT FROM AUTHOR]

We investigated growth of GaN films on [001] GaAs substrates by plasma-assisted molecular beam epitaxy in an As-free chamber. The crystalline quality and the surface morphology of the films were studied with x-ray diffraction and transmission electron, scanning electron, and atomic force microscopes. We determined that direct GaN deposition on the thermally desorbed substrate resulted in the growth of a polycrystalline film containing misoriented grains and inclusions. We achieved a significant improvement of the film quality by adopting a procedure consisting of a substrate nitridation, deposition of a low-temperature buffer layer, and a high-temperature overgrowth. [ABSTRACT FROM AUTHOR]