43 results on '"Elad, Danny"'
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2. A Dual-Loop Synthesizer With Fast Frequency Modulation Ability for 77/79 GHz FMCW Automotive Radar Applications.
3. A 21 dBm 60 GHz SiGe power amplifier using modified Wilkinson combiner.
4. A 230 GHz quadrupler with 2 dBm output power in 90 nm SiGe BiCMOS technology.
5. High-performance 81–86 GHz transceiver chipset for Point-to-Point communication in SiGe BiCMOS technology.
6. A 17.8 dBm 110–130 GHz Power Amplifier and doubler chain in SiGe BiCMOS technology.
7. Key components of a D-band Dicke-radiometer in 90 nm SiGe BiCMOS technology.
8. High-Performance E-Band Transceiver Chipset for Point-to-Point Communication in SiGe BiCMOS Technology.
9. Variable Delay Transmission Lines in advanced CMOS SOI technology.
10. A 71–86GHz multi-tanh up-conversion mixer achieving +1dBm OP1dB in 0.13 μm SiGe technology.
11. A 240 GHz multiplier chain with −0.5 dBm output power in SiGe BiCMOS technology.
12. An E-band 40dB dynamic range multi-tanh power detector in 0.13μm SiGe technology.
13. A 17.5-dBm D-band power amplifier and doubler chain in SiGe BiCMOS technology.
14. Analog read-out integragted W-band Dicke-radiometer in 0.13um SiGe design and characterization of W-band radiometer RFIC intended for FPA imager.
15. Broadcast-Enabled Massive Multicore Architectures: A Wireless RF Approach.
16. Design of a cloverleaf antenna for an antenna coupled bolometer for room temperature THz imaging.
17. A 60GHz, linear, direct down-conversion mixer with mm-Wave tunability in 32nm CMOS SOI.
18. TSV multi-signal connection compact modeling.
19. Wideband planar skirt antenna and its application for the detection of terahertz radiation.
20. Uncooled and passive 0.5–1.5 THz FPA imager: Design and characterization of focal plane array imager based on antenna-coupled MOSFET bolometers.
21. High power SiGe E-band transmitter for broadband communication.
22. Design of a wide-bandwidth on-chip antenna for uncooled passive THz imaging.
23. A low phase noise Ku-band sub-integer frequency synthesizer for E-band transceivers.
24. Electrical characterization of low-cost glass/epoxy laminates at millimeter wave frequencies.
25. Room-temperature THz imaging based on antenna-coupled MOSFET bolometer.
26. A 20dBm E-band power amplifier in SiGe BiCMOS technology.
27. High-power high-linearity SiGe based E-BAND transceiver chipset for broadband communication.
28. A fully integrated SiGe E-BAND transceiver chipset for broadband point-to-point communication.
29. A 20dBm E-band power amplifier in SiGe BiCMOS technology.
30. A 14 dBm 110?130 GHz power amplifier and doubler chain in 90 nm SiGe BiCMOS technology.
31. A 122-150 GHz LNA with 30 dB gain and 6.2 dB noise figure in SiGe BiCMOS technology.
32. Charge pump architecture with reduced medium and high frequency noise.
33. Thermal performance of CMOS-SOI transistors from weak to strong inversion.
34. Low Cost Ka Band Transceiver for Digital Radios.
35. Design and Modeling Methodology of Vertical Interconnects for 3DI Applications.
36. Key components of a 130 GHz dicke-radiometer SiGe RFIC.
37. Signal Space and Its Implementation for Microwave Nonlinear-Network Analysis.
38. 24×24 Pixel focal plane array for THz imaging applications.
39. H-band SiGe frequency multiplier chain with 4 dBm output power.
40. A robust low phase noise Ku band VCO with 23.3% tuning range for E-band and V-band backhaul transceivers.
41. Towards mm-wave camera assisted human stress gauging.
42. Modeling and optimization method for thermal THz sensing with MOS transistors.
43. A 0.6–1.2 THz monolithic imaging array.
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