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Semi-insulating GaN films with controlled dopant profiles have significant potential to improve the performance of high-power electronics. Beryllium doped GaN (GaN:Be) films previously demonstrated a semi-insulating nature, but the Be-dopant profiles in these films exhibited Be surface segregation and accumulation, which would lead to undesired leakage current paths in devices and deterioration of breakdown voltage. Improved growth kinetics of metal modulated epitaxy at low growth temperatures are applied in the study of GaN:Be films to achieve selectively controlled and abrupt step-doped Be profiles. The GaN:Be films were found to be semi-insulating via Hall effect measurements at elevated temperatures of 495 K. The films were shown to effectively electrically compensate surface contaminants at regrowth interfaces. Surface contaminants (O, Si, and C) typically result in unintentional n-type doping at the GaN on GaN regrowth interface. In order to demonstrate the utility of Be doping, GaN:Mg p-type films are grown atop GaN:Be buffer, AlN buffer, and control samples without any insulating buffer on GaN:Fe templates. Remarkably, the p-type films grown atop control samples up to 400 nm thick are compensated from surface contaminants, whereas the films grown atop AlN and GaN:Be insulating layers effectively electrically neutralize the surface contaminants and result in high hole concentrations of 2.3 and 2.5 × 1019 cm−3, respectively. The use of GaN:Be instead of AlN buffers eliminates the need to deconvolve the effects of the AlN/GaN 2D sheet charges and defects from lattice mismatch, removes lateral conduction paths, and reduces inherently high static vertical electric fields that detract from power device performance. [ABSTRACT FROM AUTHOR]

Defect origins and their propagation behavior were investigated in 25 μm thick homo-epitaxial GaN layers grown on ammono-thermal and void-assisted separation (VAS) substrates using multi-vector x-ray topography in both transmission and reflection geometries. Complex inclusions were identified and their microstructure was analyzed. Additionally, generation of threading dislocation clusters during epitaxial growth is analyzed. Various defects are delineated from the substrate vs epitaxial layers. Growth on the ammono-thermal substrate led to less defective and flatter epitaxial layers compared to the growth on the VAS substrate. Determining the origins and microstructure of defects is crucial toward developing defect mitigation strategies for reliable GaN devices. [ABSTRACT FROM AUTHOR]

Activation of implanted donors into a highly-resistive, nitrogen-doped homoepitaxial β-Ga2O3 has been investigated. Nitrogen acceptors with the concentration of ∼1017 cm−3 were incorporated during epitaxial growth yielding low-doped (net donor concentration <1014 cm−3) films subsequently implanted with Si, Ge, and Sn. Upon Ohmic contact formation to the implanted regions, sheet resistance values of 314, 926, and 1676 Ω/sq were measured at room temperature for the Si-, Ge-, and Sn-implanted samples, respectively. Room temperature Hall measurements resulted in sheet carrier concentrations and Hall mobilities of 2.13 × 1014 /93, 8.58 × 1013/78, and 5.87 × 1013/63 cm2/(V s), respectively, for these three donor species. Secondary ion mass spectroscopy showed a volumetric dopant concentration of approximately 2 × 1019 cm−3 for the three species, resulting in carrier activation efficiencies of 64.7%, 40.3%, and 28.2% for Si, Ge, and Sn, respectively. Temperature-dependent Hall effect measurements ranging from 15 to 300 K showed a nearly constant carrier concentration in the Si-implanted sample, suggesting the formation of an impurity band indicative of degenerate doping. With a bulk carrier concentration of 1.3 × 1019 cm−3 for the Si implanted sample, a room temperature mobility of 93 cm2/(V s) is among the highest reported in Ga2O3 with a similar carrier concentration. The unimplanted Ga2O3:N regions remained highly resistive after the surrounding areas received implant and activation anneal. These results open the pathway for fabricating Ga2O3 devices through the selective n-type doping in highly resistive epitaxial Ga2O3. [ABSTRACT FROM AUTHOR]

Vertical power devices require significant attention to their edge termination designs to obtain higher breakdown voltages without substantial increase in ON-state resistance. A simple edge termination structure for a GaN p-n diode is proposed, comprising a full layer lightly doped p-type GaN region underneath the higher doped ${p} +\!+$ contact layer. A TCAD model of the device is developed, and removal of the portions of ${p}$ ++ cap outside of the device active area in simulations is shown to increase the device blocking voltage capability. It causes the depletion width to increase in the lightly doped p-type layer and allows it to act similar to a junction termination extension (JTE). These predictions are validated empirically, resulting in a 52% measured increase in breakdown capability after selective removal of the ${p}$ ++ cap. This simple edge termination technique can be formed with only a single low-energy nitrogen implant or etching procedure, greatly increasing its manufacturability over more complex structures. Design optimization studies are pursued in TCAD to determine optimal parameter values for further improving breakdown performance. It is shown that the proposed edge termination technique can be employed to produce future high voltage vertical GaN devices without a significant gain in ON-state resistance and with wide tolerance to process variations. [ABSTRACT FROM AUTHOR]

GaN vertical PiN diodes with different anode thicknesses were fabricated on three native GaN wafers with the same p-layer doping concentrations, and planar hybrid edge termination. The breakdown behavior in terms of the breakdown voltage and the electroluminescence were studied as functions of the anode thickness. A repeatable avalanche breakdown and highest breakdown voltage were measured with the thinnest anode of 300 nm and with the thinnest edge termination region. This indicates the efficacy of the nitrogen-implanted hybrid edge termination design that comprises of junction termination and guard rings hybrid design. As the anode thickness increases, the edge termination thickness increases, and the devices exhibit lower breakdown voltages and less robust breakdown characteristics, often destructive. From this study, we also conclude that a very high p-layer doping of 2 × 1019 cm−3 is not s practical doping level, because it is too sensitive to the edge termination thickness. [ABSTRACT FROM AUTHOR]

Heterojunction field-effect transistors based on the β-(AlxGa1−x)2O3/Ga2O3 heterostructure grown by ozone-assisted molecular beam epitaxy were demonstrated for the first time. Al composition ratios in the 14%–23% range were validated using x-ray diffraction on the three samples grown for this study. Electrochemical capacitance-voltage (ECV) measurements showed the presence of a charge sheet in the delta-doped (AlxGa1−x)2O3 barrier layer. Secondary ion mass spectroscopy and ECV measurements also revealed an unintentional Si peak at the (AlxGa1−x)2O3/Ga2O3 interface. Direct current (IDS-VGS) and transconductance (Gm-VGS) measurements demonstrated depletion-mode transistor operation as well as the presence of a parallel conduction channel. A one-dimensional Poisson model suggested that dopant redistribution in the delta-doped region could cause a secondary channel to form in the barrier in addition to the primary channel near the (AlxGa1−x)2O3/Ga2O3 interface under certain conditions met in these samples. Fabricated devices on sample A did not exhibit breakdown up to the measurement limit of 1100 V, with stability after ten cycles. A maximum output drain current density of 22 mA/mm was measured on sample B. Room temperature Hall measurements yielded a sheet carrier density of 1.12 × 1013 cm−2 with corresponding Hall mobility of 95 cm2/V s in sample C. [ABSTRACT FROM AUTHOR]

The ultra-wide bandgap semiconductor gallium oxide (Ga2O3) offers substantial promise to significantly advance power electronic devices as a result of its high breakdown electric field and maturing substrate technology. A key remaining challenge is the ability to grow electronic-grade epitaxial layers at rates consistent with 20–40 μm thick drift regions needed for 20 kV and above technologies. This work reports on extensive characterization of epitaxial layers grown in a novel metalorganic chemical vapor deposition tool that permits growth rates of 1.0–4.0 μm h−1. Specifically, optical, structural and electrical properties of epilayers grown at ∼1 μm h−1 are reported, including employment in an operating MOSFET. The films demonstrate relatively smooth surfaces with a high degree of structural order, limited point defectivity (Nd − Na ≈ 5 × 1015 cm−3) and an optical bandgap of 4.50 eV. Further, when employed in a MOSFET test structure with an n+ doped channel, a record high mobility for a transistor structure with a doped channel of 170 cm2 V−1 s−1 was measured via the Hall technique at room temperature. This work reports for the first time a β-Ga2O3 MOSFET grown using Agnitron Technology's high growth rate MOCVD homoepitaxial process. These results clearly establish a significant improvement in epilayer quality at growth rates that can support future high voltage power device technologies. [ABSTRACT FROM AUTHOR]

GaN is a favorable martial for future efficient high voltage power switches. GaN has not dominated the power electronics market due to immature substrate, homoepitaxial growth, and immature processing technology. Understanding the impact of the substrate and homoepitaxial growth on the device performance is crucial for boosting the performance of GaN. In this work, we studied vertical GaN PiN diodes that were fabricated on non-homogenous Hydride Vapor Phase Epitaxy (HVPE) substrates from two different vendors. We show that defects which stemmed from growth techniques manifest themselves as leakage hubs. Different non-homogenous substrates showed different distribution of those defects spatially with the lesser quality substrates clustering those defects in clusters that causes pre-mature breakdown. Energetically these defects are mostly mid-gap around 1.8Ev with light emission spans from 450nm to 700nm. Photon emission spectrometry and hyperspectral electroluminescence were used to locate these defects spatially and energetically. [ABSTRACT FROM AUTHOR]

About 2 MeV proton numerical calculation damage indicates that a quasiflat profile is introduced into the GaN buffer layer of high‐electron‐mobility transistor (HEMT) templates. A previous transport study of such HEMT structures showed increased breakdown voltage and reduced GaN buffer layer leakage after proton irradiation. Hyperspectral electroluminescence measurements detected the emission band in the spectral region between 700 and 800 nm. This emission is assumed to be associated with the generation of trap levels responsible for the device failure. To obtain insights into the nature of radiation‐generated traps, detailed low‐temperature photoluminescence (PL) and cathodoluminescence (CL) experiments are conducted in a set of virgin and proton‐irradiated device structure templates. Both the PL and CL spectra show large intensity variations of all emission bands, in the spectral range between 330 and 890 nm, with increasing proton dosage. This is consistent with the introduction of compensating and/or nonradiative recombination centers in the GaN buffer layer. Luminescence measurements carried out under various excitation conditions show different recombination rates for emission bands observed near 420 and 550 nm, indicating different free carrier capture rates. Spectral analysis suggests that these two emission bands have different dependences on proton irradiation dosage, consistent with different chemical natures. [ABSTRACT FROM AUTHOR]

We report selective area n-type doping using ion implantation of Si into semi-insulating, C-doped GaN samples activated using both conventional rapid thermal annealing (RTA) and 30 atm N2 overpressure annealing. Implanted regions were tested for Si activation using Circular Transmission Line Measurements (CTLM), while linear and circular photoconductive switches (PCSS) in the unimplanted regions were used as a test vehicle to separate implanted Si dopant activation from leakage paths generated by N vacancy formation due to damage and decomposition during annealing. We observed that at an optimal temperature around 1060 °C, a low contact resistivity of $1\times 10^{-6}\,\,\Omega $ -cm2 was obtained while preserving the breakdown of the unimplanted regions. [ABSTRACT FROM AUTHOR]

Record DC power has been demonstrated in AlGaN/GaN high electron mobility transistors fabricated using a substrate replacement process in which a thick diamond substrate is grown by chemical vapor deposition following removal of the original Si substrate. Crucial to the process is a ~30 nm thick SiN interlayer that has been optimized for thermal resistance. The reductions obtained in self-heating have been quantified by transient thermoreflectance imaging and interpreted using 3D numerical simulation. With a DC power dissipation level of 56 W/mm, the measured average and maximum temperatures in the gate-drain access region were 176 °C and 205 °C, respectively. [ABSTRACT FROM AUTHOR]

Semi-insulating halide vapor phase epitaxial β-Ga2O3 films without intentional dopants introduced during growth are demonstrated. The sheet resistance measured in the 340–480 K range yielded 268–134 kΩ/◻ and an activation energy of 0.81 eV. Room temperature capacitance-voltage measurements at 1 MHz showed evidence of an ultra-low free carrier concentration n-type film with a free carrier concentration near flatband (VFB ∼ 4.4 V) estimated to be <1014 cm−3, resulting in a high breakdown voltage of 2380 V (3.18 MV/cm) measured on a lateral diode without field termination. Secondary ion mass spectroscopy did not reveal Fe compensating species; however, an average Si concentration of about 5 × 1015 cm−3 and an N concentration of about 2 × 1017 cm−3 were detected, suggesting that N acceptors compensated Si donors to result in a nearly intrinsic β-Ga2O3 film. Photoionization spectroscopy suggested the presence of a deep acceptor-like level located at Ec −0.23 eV. [ABSTRACT FROM AUTHOR]

One-dimensional and quasi-one-dimensional strongly coupled dusty plasma rings have been created experimentally. Longitudinal (acoustic) and transverse (optical) dispersion relations for the one-ring are measured and found to be in excellent agreement with the theory for an unbounded straight chain of particles interacting through a Yukawa (i.e., screened Coulomb or Debye-Hückel) potential. These rings provide a new experimental system to directly study one-dimensional and quasi-one-dimensional linear and nonlinear phenomena. [ABSTRACT FROM AUTHOR]

The saturation magnetization of Y3Fe5O12 (YIG) epitaxial films 4 to 250 nm in thickness has been determined by complementary measurements including the angular and frequency dependencies of the ferromagnetic resonance fields as well as magnetometry measurements. The YIG films exhibit state-of-the-art crystalline quality, proper stoichiometry, and pure Fe3+ valence state. The values of YIG magnetization obtained from all the techniques significantly exceed previously reported values for single crystal YIG and the theoretical maximum. This enhancement of magnetization, not attributable to off-stoichiometry or other defects in YIG, opens opportunities for tuning magnetic properties in epitaxial films of magnetic insulators. [ABSTRACT FROM AUTHOR]

The saturation magnetization of Y3Fe5O12 (YIG) epitaxial films 4 to 250 nm in thickness has been determined by complementary measurements including the angular and frequency dependencies of the ferromagnetic resonance fields as well as magnetometry measurements. The YIG films exhibit state-of-the-art crystalline quality, proper stoichiometry, and pure Fe3+ valence state. The values of YIG magnetization obtained from all the techniques significantly exceed previously reported values for single crystal YIG and the theoretical maximum. This enhancement of magnetization, not attributable to off-stoichiometry or other defects in YIG, opens opportunities for tuning magnetic properties in epitaxial films of magnetic insulators. [ABSTRACT FROM AUTHOR]

Single phase ε -Mn 4 N thin and ultrathin films are grown on MgO(001) using molecular beam epitaxy. Reflection high-energy electron diffraction and out-of-plane X-ray diffraction measurements are taken for each sample in order to determine the in- and out-of-plane strain for each sample. Vibrating sample magnetometry and superconducting quantum interference device measurements, which are performed on the thin and ultrathin films respectively, are used to plot the magnetization of each sample versus both in- and out-of-plane H → -fields and to determine the magnitude of perpendicular magnetic anisotropy in these films. Three significant components of perpendicular magnetic anisotropy are observed in these films and are attributed to sample strain (1 component) and shape (2 components). Among these components, the most significant component 0.8 – 4.9 Merg cm 3 is identified as a second term of shape anisotropy, which possesses a negative linear relationship with sample thickness over the range from 9 nm to 310 nm. Atomic (magnetic) force microscopy measurements show the presence of a surface localized magnetic polarization (22–82 % ), which increases with decreasing thickness, when the net magnetizations of the films are zero. The second term of shape anisotropy as well as the surface localized polarization, which each depend on sample thickness, are each regarded as a consequence of Ising domains overlapping out-of-plane in these films. [ABSTRACT FROM AUTHOR]

We measure the spin Hall angle in Au layers of 5-100 nm thicknesses by spin pumping from Y3Fe5O12 epitaxial films grown by ultrahigh vacuum, off-axis sputtering. We observe a striking increase in the spin Hall angle for Au layers thinner than the measured spin diffusion length of 12.6 nm. In particular, the 5 nm Au layer shows a large spin Hall angle of 0.087, compared to those of 0.016 and 0.017 for the 50 and 100 nm Au layers, respectively, suggesting that the top surface plays a dominant role in spin Hall physics when the spin current is able to reach it. Other spin pumping related parameters, including Gilbert damping enhancement, interfacial spin mixing conductance, and spin current are also determined for Au layers of various thicknesses. Given the pervasive role of ultrathin films in electrical and spin transport applications, this result emphasizes the importance of considering the impact of the top surface and reveals the possibility of tuning critical spin parameters by film thickness. [ABSTRACT FROM AUTHOR]

Skyrmions hold great promise for low-energy consumption and stable high density information storage, and stabilization of the skyrmion lattice (SkX) phase at or above room temperature is greatly desired for practical use. The topological Hall effect can be used to identify candidate systems above room temperature, a challenging regime for direct observation by Lorentz electron microscopy. Atomically ordered FeGe thin films are grown epitaxially on Ge(111) substrates with ~ 4 % tensile strain. Magnetic characterization reveals enhancement of Curie temperature to 350 K due to strain, well above the bulk value of 278 K. Strong topological Hall effect was observed between 10 K and 330 K, with a significant increase in magnitude observed at 330 K. The increase in magnitude occurs just below the Curie temperature, a similar relative temperature position as the onset of Skx phase in bulk FeGe. The results suggest that strained FeGe films may host a SkX phase above room temperature when significant tensile strain is applied.

We have experimentally realized unidirectional or one-way coupling in a mechanical array by powering the coupling with flowing water. In cyclic arrays with an even number of elements, solitonlike waves spontaneously form but eventually annihilate in pairs, leaving a spatially alternating static attractor. In cyclic arrays with an odd number of elements, this alternating attractor is topologically impossible, and a single soliton always remains to propagate indefinitely. Our experiments with 14- and 15-element arrays highlight the dynamical importance of both noise and disorder and are further elucidated by our computer simulations.