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Topographical as well as microscopic imaging of nanoscale surfaces plays a pivotal role across various disciplines. Nevertheless, achieving fast, label-free, and accurate characterization of laterally expanded structures below the diffraction limit remains challenging. Recent studies highlight the use of microsphere assistance for resolution improvement. Confocal microscopy, augmented by microspheres, enables the imaging of small structures that were previously inaccessible. This is experimentally compared with microsphere-assisted microscopy (MAM) to underline the decisive role of the confocal effect.

We present how to develop virtual microcylinder- or microsphere-assisted surface topography measurement instruments. As the most critical part, the interaction between light, microcylinder and measurement object is considered based on the finite element method (FEM). Results are obtained for microcylinder-assisted conventional, interference, and confocal microscopes without necessity to repeat the time-consuming FEM simulations for each sensor.

The topography of surfaces produced by metal additive manufacturing is a challenge for optical measurement systems such as focus variation microscopes. These irregularities can lead to artifacts, such as incorrectly measured protrusions or spikes, hampering reliable topographic characterization. In order to eliminate this problem, we introduce a new algorithm based on dual convolving a vertical Sobel operator with cross sections of an image stack parallel to the scanning direction of the so-called depth scan. This has proven beneficial in order to distinguish the focus region from out-of-focus areas where outliers are frequently detected. This paper introduces a method for deriving self-adaptive thresholds from the convolution result and compares the effects of different operators in creating self-adaptive thresholds. Additionally, a simulation model of focus variation microscopy is introduced to validate both the measuring system and the proposed algorithm, thereby enhancing the overall performance of focus variation microscopy. Finally, comparisons of measurement results on rough metal additive manufacturing workpieces with and without self-adaptive thresholds are discussed to demonstrate the algorithm's effectiveness.The utilization of self-adaptive thresholds demonstrably reduces the uncertainty range in roughness parameter calculations. For example, in the case of an additive manufactured metal sample due to outlier elimination, the S z roughness value reduces from 543 µm to 413 µm. [ABSTRACT FROM AUTHOR]

Due to their contactless and fast measuring capabilities, laser interferometers represent an interesting alternative to tactile stylus instruments for surface profilometry. In addition to these outstanding attributes, acquisition costs play a major role in industry, limiting the frequent use of optical profilometers, which are significantly more expensive than tactile profilometers. We present a low-cost laser distance-measuring interferometer featuring axial repeatability below 1 nm at acquisition rates of 38,000 height values per second. The sensor's performance is validated on several surface standards, achieving lateral scan velocities up to 160 mm/s. Further to high scan velocities, the high acquisition rate enables improved measurement accuracy by averaging measured height values. For example, the standard deviation of 625 pm for repeated measurements can be reduced to 265 pm at the expense of the data rate. However, the sensor concept provides the potential for further improvements in data rate and measurement repeatability. [ABSTRACT FROM AUTHOR]

The depth discrimination in confocal microscopy is based on the digital analysis of depth response signals obtained by each camera pixel during measurement. Various signal‐processing algorithms are used for this purpose. The accuracy of these algorithms is inter alia restricted by the axial symmetry of the signals. However, in practice response signals are rather asymmetrical especially in case of measurement objects with critical surface structures such as edges or steep flanks. We present a novel signal‐processing algorithm based on an exponential function with a cubic argument to handle asymmetrical and also symmetrical depth response signals. Results obtained by this algorithm are compared to those of commonly used signal processing algorithms. It turns out that the novel algorithm is more robust, more accurate and exhibits a repeatability of a similar order compared to other algorithms. Research Highlights: A novel, more robust algorithm with improved accuracy in peak extraction especially for asymmetrical response signals in confocal microscopy is introduced and validated.Improved accuracy is demonstrated for height and layer thickness measurements. [ABSTRACT FROM AUTHOR]

Laser distance sensors are a widespread, fast and contactless approach for distance and surface topography measurements. Main characteristics of those sensors are given by resolution, measurement speed and sensor geometry. With decreasing sensor size, the alignment of the optical components in sensor setup becomes more challenging. The depth response of optical profilers is analyzed to obtain characteristic parameters and, thus, to value the alignment and the transfer behavior of those sensors. We present a novel miniaturized sensor setup comprising of confocal and interferometric confocal signals within one sensor in order to compare both principles simply by obscuring the reference arm by an absorber. Further, we introduce a theoretical signal modeling in order to analyze influences such as spatial coherence, Gaussian beam characteristics and tilted reflectors on depth response signals. In addition to this, we show that the coherent superposition significantly reduces the axial resolution due to the confocal effect in interferometric signals compared to simple confocal signals in measurement and simulation results. Finally, an appropriate fit function is presented, in order to figure out characteristic sensor parameters from the obtained depth response signal. In this context, a good agreement to simulated and measured signals is achieved. [ABSTRACT FROM AUTHOR]

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Rough surfaces such as metal additive manufactured surfaces are quite challenging for measurement. Artifacts caused by irregular and difficult-to-measure geometries are inevitable. Removing all the artifacts would cause a portion of surface information to be missing. Different from previous works, the postprocessing in this paper includes an additional step to eliminate artifacts based on autocorrelation functions of particular subimages instead of simply removing them. This increases the accuracy with respect to surface roughness and provides a more comprehensive view on the topography. In addition, a dome shape LED array ring light is proposed to provide all-round lighting due to the high degree of irregularity of workpiece surfaces. The experimental results obtained from FVM are validated and compared with the given roughness values of a Rubert Microsurf 329 comparator test panel as well as measurement results of a metal additive workpiece by a confocal microscope. [ABSTRACT FROM AUTHOR]

We present a Mirau-type coherence scanning interferometer (CSI) with an oscillating reference mirror and an integrated interferometric distance sensor (IDS) sharing the optical path with the CSI. The IDS works simultaneously with the CSI and measures the distance changes during the depth scanning process with high temporal resolution. The additional information acquired by the IDS is used to correct the CSI data disturbed by unwanted distance changes due to environmental vibrations subsequent to the measurement. Due to the fixed reference mirror in commercial Mirau objectives, a Mirau attachment (MA) comprising an oscillating reference mirror is designed and built. Compared to our previous systems based on the Michelson and the Linnik interferometer, the MA represents a novel solution that completes the range of possible applications. Due to its advantages, the Mirau setup is the preferred and most frequently used interferometer type in industry. Therefore, the industrial use is ensured by this development. We investigate the functioning of the system and the capability of the vibration compensation by several measurements on various surface topographies. [ABSTRACT FROM AUTHOR]

Although optical 3D topography measurement instruments are widespread, measured profiles suffer from systematic deviations occurring due to the wave characteristics of light. These deviations can be analyzed by numerical simulations. We present a 3D modeling of the image formation of confocal microscopes. For this, the light-surface interaction is simulated using two different rigorous methods, the finite element method and the rigorous coupled-wave analysis. The image formation in the confocal microscope is simulated using a Fourier optics approach. The model provides high accuracy and advantages with respect to the computational effort as a full 3D model is applied to 2D structures and the lateral scanning process of the confocal microscope is considered without repeating the time consuming rigorous simulation of the scattering process. The accuracy of the model is proved considering different deterministic surface structures, which usually cause strong systematic deviations in measurement results. Further, the influences of apodization and a finite pinhole size are demonstrated. [ABSTRACT FROM AUTHOR]

Copyright of Technisches Messen is the property of De Gruyter and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Optical interference microscopes are widespread in topography and roughness measurement on the micro- and nanoscale. In spite of a wide range of scientific and industrial applications, systematic deviations between the measured and the real surface topography occur in certain situations, e.g. at edges or steep flanks. We present a numerical model considering the properties of the measurement instrument as well as the surface structure to be measured in order to get new insights into the physical dependencies of these deviations. The computation is based on a rigorous simulation of the scattered near field combined with a Fourier optics treatment of the image formation in the measurement instrument. In this study, the near fields are calculated with an open-source finite element method (FEM) software and a commercial finite difference time domain method (FDTD) software. The numerical results are compared with an analytical Kirchhoff approach and measurements. The main intention of this paper is to introduce the modelling and point out possible fields of application. In further studies, this model could be extended to 3D and parameter dependencies of systematic deviations, such as the material of the measurement object and the NA of the measurement instrument, could be investigated. [ABSTRACT FROM AUTHOR]

Copyright of Technisches Messen is the property of De Gruyter and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Typical 3-D topography sensors for the measurement of surface structures in the micro- and nanometre range are atomic force microscopes (AFMs), tactile stylus instruments, confocal microscopes and white-light interferometers. Each sensor shows its own transfer behaviour. In order to investigate transfer characteristics as well as systematic measurement effects, a multi-sensor measuring system is presented. With this measurement system comparative measurements using five different topography sensors are performed under identical conditions in a single set-up. In addition to the concept of the multi-sensor measuring system and an overview of the sensors used, surface profiles obtained from a fine chirp calibration standard are presented to show the difficulties of an exact reconstruction of the surface structure as well as the necessity of comparative measurements conducted with different topography sensors. Furthermore, the suitability of the AFM as reference sensor for high-precision measurements is shown by measuring the surface structure of a blank Blu-ray disc. [ABSTRACT FROM AUTHOR]

Despite the fact that optical profilers, such as coherence scanning interferometers, are frequently used for fast and contactless topography measurements in various fields of application, measured profiles still suffer from the wave characteristics of light, which leads to systematic deviations that are still not sufficiently investigated. In order to analyze these systematic deviations and their physical relations, we apply a rigorous simulation model considering both the transfer characteristics of the measurement instrument as well as the geometry and material of different measurement objects. Simulation results are compared to measurement results for different polarizations, wavelengths and interferometer types, considering surface structures including edges, slopes and different materials as the main reasons for those deviations. Compared to former publications, a full three-dimensional (3D) modeling of the image formation with regard to two-dimensional (2D) surface structures is provided. The advantages of 3D modeling in contrast to a time efficient 2D approach are discussed. Further, an extract of an atomic force microscope (AFM) measurement result is used as the basis for the FEM simulation in one example in order to achieve most realistic simulation results.

Tailored 3D microparticles and nanostructures lead to increasing possibilities in semiconductor industry or biomedical applications. In an interdisciplinary study we investigate the parallel production of such particles by using nanoimprint lithography in combination with their characterization based on interference microscopy. In this Letter we report on a metrological inspection, which tends to a universal measurement solution comparing the sample optically to a master object produced in the same way as the sample.