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This study was aimed to investigate the response of bark beetle community structure to green-tree retention in a Korean pine tree forest between 2013 and 2015. Five types of retention methods were evaluated to investigate the retention effect on insect community structure at various sites in Keunjeogol, Samcheok, and Gangwon-do. Lindgren funnel traps were installed to collect insects from July to August, over a 3-year period. Overall, 690 individuals and 29 species of Scolytinae were collected, with populations of insects appearing to gradually increase by each year of the study. Results of the insect community analysis showed that most survey sites presented a higher diversity than the control site annually except in 2015. This study can be used as a baseline dataset for the long-term study of early changes in insect community in response to green-tree retention in forests.

We optimized a silicon nitride (SiNx) passivation process using a catalytic-chemical vapor deposition (Cat-CVD) system to suppress the current collapse phenomenon of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs). The optimized Cat-CVD SiNx film exhibited a high film density of 2.7 g/cm3 with a low wet etch rate (buffered oxide etchant (BOE) 10:1) of 2 nm/min and a breakdown field of 8.2 MV/cm. The AlGaN/GaN-on-Si HEMT fabricated by the optimized Cat-CVD SiNx passivation process, which had a gate length of 1.5 μm and a source-to-drain distance of 6 μm, exhibited the maximum drain current density of 670 mA/mm and the maximum transconductance of 162 mS/mm with negligible hysteresis. We found that the optimized SiNx film had positive charges, which were responsible for suppressing the current collapse phenomenon.

In this study, we have investigated the effects of SF6 plasma treatment on the isolation leakage current characteristics of AlGaN/GaN heterojunction field-effect transistors (HFETs). The device isolation was performed by Cl2/BCl3-based plasma etching process followed by SF6 plasma treatment for 1 min. It was found that the SF6 plasma post-etching treatment was an effective method to improve the electrical isolation characteristics. X-ray photoelectron spectroscopy analysis was carried out to investigate the chemical bonding states of the etched GaN surfaces.

Biodiversity in forests is strongly affected by forest management practices, such as clearcutting and aggregated retention. Therefore, the assessment of the effects of forest management on biodiversity is a major concern in forest ecology. In the present study, we aimed to characterize the effects of forest management practices, after one year, on the abundance, species richness, community composition, and functional groups of moths in forests. The moths were sampled in four different forest stands: three stands (clearcutting, aggregated retention, and no cutting) in a planted Japanese larch forest and one stand in a natural Mongolian oak forest. The results revealed that the moth communities changed in response to the changes in vegetation after the implementation of forest management practices, and clearcutting increased the abundance and species richness of herbivorous and warm-adapted species. The structure and function of moth communities were affected by the forest management practices such as clearcutting and aggregated retention, which were reflected by a decrease in community indices and change in moth community composition with changes in vegetation. [ABSTRACT FROM AUTHOR]

Road deposited sediments (RDS) swept from highways in South Korea were characterized to quantitatively evaluate the reduction in non-point source pollutants by sweeping. The swept RDS consisted primarily of sand (63 µm to 2 mm) particles (80.34±8.33% of total weight) highly contaminated by organics, nutrients and heavy metals. The average concentrations of total organic carbon (TOC), biochemical oxygen demand (BOD), volatile solids (VS), total nitrogen (T-N), and total phosphorus (T-P) were 20.17±9.13, 1.04±0.62, 39.92±16.55, 1.99±0.96, and 0.54±0.19 g kg–1 (±one standard deviation), respectively, for 63 µm to 2 mm RDS. The concentrations of the pollutants were high for RDS smaller than 63 µm, but most of the mass was associated with the 63 µm to 2mm RDS. The results suggest that the pollutants associated with RDS swept from highways originated mainly from engine wear, exhaust emissions, and tire wear. These results were different from the RDS on roads in residential and commercial areas, where natural particles and brake wear contribute significantly to RDS. In addition, the reductions in TOC, BOD, VS, T-N, T-P, Cu, Pb, Zn, Fe, and As based on the swept RDS measurements were calculated to be 3,355.3, 175.1, 6,621.4, 323.0, 88.3, 30.3, 13.7, 1.0, 303.4, 11,198.7, and 0.4 g km–1, respectively. [ABSTRACT FROM AUTHOR]

We developed a high-quality plasma enhanced atomic layer deposited (PEALD) aluminum oxynitride (AlOxNy) process for the metal-oxide-semiconductor (MOS) gate insulator of fully-recessed-gate AlGaN/GaN-on-Si MOS-heterojunction field-effect transistors (MOS-HFETs). It was found that the cyclic nitrogen incorporation into aluminum oxide (Al2O3) during PEALD process improved the conduction band offset at GaN interface resulting in higher forward breakdown field strength, which also contributed to suppressed trapping effects under forward gate bias stress. Improved interface characteristics, which resulted from suppressed surface oxidation, led to significant improvement of threshold voltage stability. A low threshold voltage hysteresis of 180 mV at maximum gate sweep voltage of 10 V was obtained with AlOxNy gate insulator. The MOS channel mobility was also improved to 235 cm2 V−1 s−1. The fabricated fully-recessed-gate AlGaN/GaN-on-Si MOS-HFET with PEALD AlOxNy gate insulator exhibited excellent overall performances such as a threshold voltage of 3.2 V, a maximum drain current density of 481 mA mm−1, an on/off current ratio of ∼1010, an ON-resistance of 12 mΩ mm, and a breakdown voltage of 1050 V. [ABSTRACT FROM AUTHOR]

Radio frequency (RF)-sputtered ZnO gate dielectrics for AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMTs) were investigated with varying O2/Ar ratios. The ZnO deposited with a low oxygen content of 4.5% showed a high dielectric constant and low interface trap density due to the compensation of oxygen vacancies during the sputtering process. The good capacitance–voltage characteristics of ZnO-on-AlGaN/GaN capacitors resulted from the high crystallinity of oxide at the interface, as investigated by x-ray diffraction and high-resolution transmission electron microscopy. The MOS-HEMTs demonstrated comparable output electrical characteristics with conventional Ni/Au HEMTs but a lower gate leakage current. At a gate voltage of −20 V, the typical gate leakage current for a MOS-HEMT with a gate length of 6 μm and width of 100 μm was found to be as low as 8.2 × 10−7 mA mm−1, which was three orders lower than that of the Ni/Au Schottky gate HEMT. The reduction of the gate leakage current improved the on/off current ratio by three orders of magnitude. These results indicate that RF-sputtered ZnO with a low O2/Ar ratio is a good gate dielectric for high-performance AlGaN/GaN MOS-HEMTs. [ABSTRACT FROM AUTHOR]

We have investigated the effects of post-metallization-annealing (PMA) in oxygen atmosphere on recessed-gate GaN metal-oxide-semiconductor heterostructure field effect transistors (MOSHFETs). The flat band voltage of MOS is a function of bulk and interface charges in the oxide, which strongly depends on a post-annealing process as well as deposition conditions. A positive threshold voltage shift enabling normally-off operation has been achieved by an O2 PMA process where the GaN MOSHFET employed an ICPCVD SiO2 gate oxide with a Ni/Au metal gate. According to the analysis using energy dispersive x-ray spectroscopy in transmission electron microscopy and x-ray photoelectron spectroscopy, it is suggested that the improved SiO2/GaN interface quality with an enhanced metallic-like Ga level was responsible for the positive shift in threshold voltage. [ABSTRACT FROM AUTHOR]

We have developed a low-temperature ohmic contact process with a recessed overhang configuration for Au-free (complementary metal-oxide semiconductor) CMOS-compatible AlGaN/GaN heterostructure field effect transistors (HFETs). The recessed overhang configuration has a Ti/Al bilayer directly in contact with the AlGaN/GaN heterojunction interface at the recessed sidewall overlaid with the AlGaN barrier layer, which allows good and reproducible ohmic formation with low-temperature annealing. The optimum Ti/Al thickness was 40/200 nm, which resulted in an Rc of 0.76 Ω mm with excellent surface morphology when annealed at 550 °C for 1 min. The device fabricated with a Ni/Mo gate exhibited a maximum drain current density of ∼500 mA mm−1, a specific on-resistance of 1.35 mΩ cm2 and a breakdown voltage of >1 kV. [ABSTRACT FROM AUTHOR]