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Discusses a low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations. Material used to reduce frequency response in power-supply planes; Peak-noise amplitude reduction; Cross-sectional structure of the sub-board.

Proposes a front connection technique using the front-side of the circuit board in rack systems configured like bookshelves, in an effort to increase pin-counts for high-through-put switching modules. Information on the implementation of this technique; Aims of the configuration.