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Increasing the injection efficiency, a critical factor constraining the reduction in threshold current in AlGaN-based deep-ultraviolet laser diodes, represents one of the paramount remaining technical challenges. In this study, the impact of compositionally graded layers that were unintentionally formed at the interface between the p-cladding and the core layer on carrier injection efficiency was analyzed. Experimental evaluations using laser diodes have shown that the elimination of an unintentionally formed layer increases the injection efficiency above the threshold current, from the conventional 3% to 13%. It has been postulated that the electron overflow toward the p-side exerts a substantial deleterious effect on the injection efficiency. An improvement in this aspect is achieved by increasing the electron-blocking capability due to the improved interface abruptness between the p-cladding layer and the core layer. The lasing threshold was strongly reduced, and characteristic temperature increased from 76 to 107 K for the improved devices. [ABSTRACT FROM AUTHOR]

One approach to improving the output power of ultraviolet (UV-C) light-emitting diodes (LEDs) is to adopt an electron-blocking layer (EBL) with a high barrier. However, the intended effect may not be realized because of the composition pulling effect, which is the unintended occurrence of a gradient layer at an AlGaN/AlGaN hetero-interface with substantial differences in the Al composition. Here, we demonstrate that low-temperature growth (i.e., <1000 °C) can be used to control the unintentional gradient layer at an AlN/AlGaN hetero-interface between a barrier layer and AlN-EBL with a difference in Al compositions of more than 30%. LEDs with an emission wavelength of 265 nm were fabricated, and an AlN-EBL was grown at low temperature to realize an abrupt interface. At an applied current of 100 mA, growing the EBL under low-temperature conditions improved the forward voltage by 0.5 V and remarkably improved the peak luminous intensity by 1.4–1.6 times. Our results can be used to realize UV-C LEDs with a steep EBL and further improve their device characteristics. [ABSTRACT FROM AUTHOR]

Conventional deep-ultraviolet (UV) light-emitting diodes (LEDs) based on AlGaN crystals have extremely low light-emission efficiencies due to the absorption in p-type GaN anode contacts. UV-light-transparent anode structures are considered as one of the solutions to increase a light output power. To this end, the present study focuses on developing a transparent AlGaN homoepitaxial tunnel junction (TJ) as the anode of a deep-UV LED. Deep-UV LEDs composed of n+/p+-type AlGaN TJs were fabricated under the growth condition that reduced the carrier compensation in the n+-type AlGaN layers. The developed deep-UV LED achieved an operating voltage of 10.8 V under a direct current (DC) operation of 63 A cm−2, which is one of the lowest values among devices composed of AlGaN tunnel homojunctions. In addition, magnesium zinc oxide (MgZnO)/Al reflective electrodes were fabricated to enhance the output power of the AlGaN homoepitaxial TJ LED. The output power was increased to 57.3 mW under a 63 A cm−2 DC operation, which was 1.7 times higher than that achieved using the conventional Ti/Al electrodes. The combination of the AlGaN-based TJ and MgZnO/Al reflective contact allows further improvement of the light output power. This study confirms that the AlGaN TJ is a promising UV-transmittance structure that can achieve a high light-extraction efficiency. [ABSTRACT FROM AUTHOR]

Previously reported UV-C laser diode (LD) structures have been subject to design constraints owing to dark line defects at the edge of the mesa stripe after device fabrication. To address this issue, a detailed analysis revealed that the dark line defects were dislocations generated by local residual shear stresses associated with mesa formation on highly strained epitaxial layers. A technique for controlling the local concentration of shear stress using a sloped mesa geometry was proposed based on insight gained by modeling the stress distribution at the edge of the mesa stripe. Experimental results showed that this technique succeeded in completely suppressing the emergence of dark-line defects. This technique will be useful in improving the performance of pseudomorphic AlGaN/AlN-based optoelectronic devices, including UV-C LDs. [ABSTRACT FROM AUTHOR]

Although the pulsed operation of AlGaN-based laser diodes at UV-C wavelengths has been confirmed in the previous studies, continuous oscillation without cooling is difficult because of the high operating voltage. In this study, the temperature dependence of key parameters was investigated and their impact on achieving continuous-wave lasing was discussed. A reduction in the threshold voltage was achieved by tapering the sides of the laser diode mesa and reducing the lateral distance between the n- and p-electrodes. As a result, continuous-wave lasing at room temperature was demonstrated at a threshold current density of 4.2 kA / cm 2 and a threshold voltage of 8.7 V. [ABSTRACT FROM AUTHOR]

In this study, we enhanced the emission power of AlGaN-based tunnel junction deep-ultraviolet LEDs (TJ LEDs) by using a MgZnO and aluminum stacked structure as UV reflective electrodes on the anode side. The emission wavelength of the fabricated TJ LED was 284 nm, and the emission power was 57.3 mW at 63 A cmâˆ'2. The polycrystalline MgZnO enabled both conductivity and UV transmittance to be achieved, approximately doubling with a reflectance of the fabricated TJ LED at 284 nm compared to conventional TJ LED with Ti/Al. These factors contributed to the increased emission power of TJ LEDs. [ABSTRACT FROM AUTHOR]

We demonstrated the structural optimization of AlGaN tunnel junction (TJ) deep-ultraviolet light-emitting diodes by changing the thickness and impurity concentrations of p+-type and n+-type AlGaN constituting the TJ. By decreasing the total thickness of the TJ to 23 nm, the operating voltage reached a minimum of 8.8 V at 63 A cmâˆ'2. Further decrease in TJ thickness markedly increases the operating voltage. This finding implies that the depletion layer width becomes greater than the TJ thickness if it is smaller than 12 nm. Therefore, we conclude that the TJ thickness must be greater than the depletion layer width. [ABSTRACT FROM AUTHOR]

We demonstrated continuous-wave lasing of an AlGaN-based ultraviolet laser diode, fabricated on a single-crystal AlN substrate when operating at 5 °C. The threshold current density and device series resistance were reduced by improvements to the epitaxial structure and electrode arrangement. A peak wavelength of 274.8 nm was observed for lasing at a drive current over 110 mA, which corresponded to a threshold current density of 3.7 kA cmâˆ'2. The operating voltage at the threshold current was as low as 9.6 V. [ABSTRACT FROM AUTHOR]

We analyzed the p–n junction of an aluminum gallium nitride (AlGaN) homojunction tunnel junction (TJ) deep-ultraviolet light-emitting diode by phase-shifting electron holography. We clearly obtained a phase image reflecting the band alinement of the p–n homojunction and derived a depletion layer width of approximately 10 nm. In addition, the observed depletion layer width for the AlGaN TJ was in good agreement with the simulated one reflecting the diffusion profile of Mg and Si, thus enabling a discussion on the electrical conduction mechanism for an AlGaN p–n junction. [ABSTRACT FROM AUTHOR]

In this study, we investigated the relationship of light output power with the optical thickness of the p-layers in AlGaN-based deep ultraviolet light-emitting diodes with a transparent high-Al-composition p-AlGaN clad layer, a thin p-GaN contact layer, and a reflective p-type electrode. By adjusting the thickness of the transparent high-Al-composition p-AlGaN clad layer, we observed a marked change in light output power. A maximum light output power of 385 mW at 1500 mA, a maximum external quantum efficiency of 15.7% at 10 mA, and a maximum wall-plug efficiency of 15.3% at 10 mA were obtained at an emission wavelength of 275 nm. [ABSTRACT FROM AUTHOR]

We reduced the operating voltage of AlGaN homojunction tunnel junction (TJ) deep-ultraviolet (UV) light-emitting diodes (LEDs) by two approaches: the suppression of carbon incorporation and the doping of a high concentration of silicon in an n+-AlGaN layer. The AlGaN homojunction TJ deep-UV LEDs had a significantly reduced forward voltage upon suppressing the incorporation of carbon in the n+-AlGaN layer. The suppression of electron compensation by carbon in nitrogen sites and the doping of a high concentration of silicon in an n+-AlGaN layer are important for reducing the operating voltage of AlGaN homojunction TJ deep-UV LEDs. [ABSTRACT FROM AUTHOR]

The space charge density profile of the nondoped AlGaN-based p-type cladding layer for UV-C laser diodes realized by distributed polarization doping is examined theoretically and experimentally. The analysis of the capacitance-voltage measurement revealed that the average effective acceptor density of 4.2 × 1017 cm–3 is achieved even without impurity doping, and it is in good agreement with the theoretical prediction from the measured Al composition profile. This result suggests that the cladding layer is ideal for UV-C LDs because it provides sufficient hole injection while potentially avoiding internal losses due to impurity doping. [ABSTRACT FROM AUTHOR]

We present an optical modeling and characterization study of prototype ultraviolet laser diode (LD) structures grown on single-crystal AlN substrates, with focus on the reduction of modal loss caused by optical mode coupling to the absorptive layers on the p-side (i.e. p-contact and p-metal layers). The transparent AlN substrates enabled optical pumping for measuring modal loss without requiring functioning LDs. The modal loss measured in this way was in good agreement with electrically evaluated results of processed LDs, and both results were consistent with optical modeling predictions. By using 0.32 μm thick p-side cladding, we were able to suppress the modal loss of the designed LD structure to 8.4 cm−1, where the contribution from the absorptive p-contact layers was less than 3 cm−1. [ABSTRACT FROM AUTHOR]

The properties of phase‐separated MgZnO induced by heat treatment are investigated, because the electrical conductivity of MgZnO deposited by sputtering can be improved by heat treatment. The absorption edge shows a red shift, but the transmittance in the ultraviolet (UV)‐C region increases after heat treatment. This is due to the formation of wurtzite (WZ) MgZnO with a high Zn content and a rock salt (RS) structure with a low Zn content induced by phase separation. This suggests that the current path is formed by the WZ crystals with low resistivity, and the transmittance in the UV region is increased by the RS crystals with high transmittance. It is confirmed that the RS structure is partially mixed with the WZ crystal in the in‐plane direction. In contrast, different distributions of crystals are observed in the stacking direction. A WZ structure is formed after RS‐MgZnO is formed on the substrate interface. It is found that Mg is incorporated into the RS structure by heat treatment, and Mg‐rich MgZnO is formed. [ABSTRACT FROM AUTHOR]

Herein, gallium nitride (GaN) samples implanted with magnesium (Mg) and fluorine (F) ions are investigated by photoluminescence (PL) measurements. In low‐temperature PL measurements, the characteristic green luminescence (GL) band attributable to nitrogen vacancies (VN) is observed in Mg‐ion‐implanted GaN. As VN are likely to act as donors, suppressing their formation is essential to realizing p‐type conductivity. The energy required for a F impurity to replace VN in GaN and eventually form F on a N site decreases when the Fermi level approaches the valence band maximum, and therefore F is employed as a subsequent implantation element to compensate for VN. The GL band peak disappears upon implanting Mg and F ions at a high temperature and adjusting the F concentration to an appropriate value. This result suggests that VN generated by Mg ion implantation can be suppressed using an element with a lower formation energy than that of VN. [ABSTRACT FROM AUTHOR]

We have demonstrated an on-wafer fabrication process for AlGaN-based UV-C laser diodes (LDs) with etched mirrors and have achieved lasing for 100 ns pulsed current injection at room temperature. A combined process of dry and wet etching was employed to achieve smooth and vertical AlGaN (1 1 ¯ 00) facets. These etched facets were then uniformly coated with a distributed Bragg reflector by atomic layer deposition. A remarkable reduction of the lasing threshold current density to 19.6 kA / cm 2 was obtained owing to the high reflectivity of the etched and coated mirror facets. The entire laser diode fabrication process was carried out on a whole 2-in. wafer. We propose this mirror fabrication process as a viable low-cost AlGaN-based UV-C LD production method that is also compatible with highly integrated optoelectronics based on AlN substrates. [ABSTRACT FROM AUTHOR]

In this study, V-shaped dislocations in a GaN epitaxial layer on a free-standing GaN substrate were observed. Our investigation further revealed that the V-shaped dislocations were newly generated at the interface in the epilayer rather than propagated from the GaN substrate. V-shaped dislocations consist of two straight parts. The straight parts of the V-shaped dislocations were separated from each other in the m-direction and tilted toward the step-flow direction of the GaN epitaxial layer. The V-shaped dislocations are continuous single dislocations having a Burgers vector component of 1a and an intrinsic stacking fault between their straight parts. [ABSTRACT FROM AUTHOR]

The degradation of an AlGaN‐based deep‐ultraviolet laser diode during operation is studied. A rapid increase in threshold current without any facet mirror damage under direct current stress below the threshold current is observed, which is considered to limit the lifetime of continuous wave lasing to the level of seconds. The evolution of current–light and current–voltage characteristics suggests that the dominant mechanism of degradation is the increased loss of carriers before they can reach the active layer, i.e., the decrease in carrier injection efficiency. The decrease in emission intensity, which is more pronounced at lower current densities, and subsequent increase in sub‐threshold current indicate the increase in defect density under current stress, which is similar to the well‐analyzed degradation mechanism found in AlGaN‐based light‐emitting diodes. [ABSTRACT FROM AUTHOR]

A gallium nitride (GaN) epitaxial layer with a low density of threading dislocations is successfully grown on a silicon substrate by using in situ gas etching. Silicon nitride (SiNx) film is used as a mask, and ammonia is intermittently supplied in hydrogen ambient during the etching. After etching, high‐density deep pits appeared on the surface of a GaN template layer and corresponded to the threading dislocations in the layer. In this novel method, before growing an additional GaN layer on the template GaN layer, a second SiNx layer is deposited after the etching process, and this layer prevents GaN nuclei from growing on the upper side‐walls of the pits. By using this method, the density of threading dislocations of the GaN surface is reduced to 6.7 × 107 cm−2. This method is cost effective, completing all the necessary processes in one growth run without taking samples out from a metalorganic chemical vapor deposition (MOCVD) reactor. [ABSTRACT FROM AUTHOR]

In this study, GaN m‐plane Schottky barrier diodes are fabricated by metalorganic vapor‐phase epitaxy (MOVPE) on several off‐angle gallium nitride (GaN) substrates, and the off‐cut angle dependence of impurity incorporation is investigated. We show that the MOVPE layer on the substrate inclined 5° toward the [000–1] direction has extremely low impurity incorporation. These results provide important suggestions for the fabrication of m‐plane power devices. [ABSTRACT FROM AUTHOR]

Dislocations that cause a reverse leakage current in vertical p-n diodes on a GaN free-standing substrate were investigated. Under a high reverse bias, dot-like leakage spots were observed using an emission microscope. Subsequent cathodoluminescence (CL) observations revealed that the leakage spots coincided with part of the CL dark spots, indicating that some types of dislocation cause reverse leakage. When etch pits were formed on the dislocations by KOH etching, three sizes of etch pits were obtained (large, medium, and small). Among these etch pits, only the medium pits coincided with leakage spots. Additionally, transmission electron microscopy observations revealed that pure screw dislocations are present under the leakage spots. The results revealed that 1c pure screw dislocations are related to the reverse leakage in vertical p-n diodes. [ABSTRACT FROM AUTHOR]

We investigate the influence of crystal defects on p-type GaN grown by metalorganic vapor phase epitaxy. Sets of p-type GaN films were grown on sapphire substrates and on free-standing GaN (F-GaN) substrates simultaneously using various Et-Cp2Mg flow rates. Although there is a difference of two orders of magnitude between the threading dislocation densities of p-type GaN grown on sapphire and F-GaN substrates, there is no significant difference in hole concentration. However, there are problems with the surface morphology of p-type GaN grown on sapphire. The deterioration of the surface was caused by the difference in nanopipe density. The electrical properties of a p-n junction diode formed on sapphire with a high density of nanopipes were observed using emission microscopy under both forward- and reverse-bias conditions. Our results demonstrate that the nanopipes are electrically inactive, and that other types of threading dislocation have more influence on the current-voltage characteristics. [ABSTRACT FROM AUTHOR]

In this study, GaN m-plane Schottky barrier diodes fabricated with a metalorganic vapor-phase epitaxy on a GaN substrate were investigated using emission microscope, photoluminescence, and cathodoluminescence. In addition, facet dependence of leakage current under reverse-biased condition was observed. We showed that the leakage-current distribution was caused by the facet dependence of the carrier concentration and oxygen concentration. These results can provide important suggestions for the fabrication of m-plane devices. (a) four-faceted hillocks on m-plane GaN MOVPE sample, facet dependence of (b) leakage current and (c) PL peak intensity of the m-plane GaN Schottky barrier diode. [ABSTRACT FROM AUTHOR]

Individual core–shell GaN nanorods (NRs) with InGaN quantum wells (QWs), lying in non‐polar, semi‐polar, and polar planes, are investigated by micro‐photoluminescence (μ‐PL) spectroscopy. Complementary transmission electron microscopy (TEM) studies reveal the presence of basal stacking faults (BSFs), which intersect the QWs. Narrow peaks of excitonic emission were detected at the NR tips, where the BSFs can both cross the semi‐polar QWs and penetrate through the thick polar well. In the NRs without the polar wells, the peaks appear in the blue spectral range only, while in the NRs with such wells, the peaks also appear in the green spectral range. Polarization resolved μ‐PL measurements reveal the scattering of linear polarization degree among the narrow peaks, as well as among individual NRs, although the dominant polarization of the narrow lines was normal to the NR axis. In general, these findings are consistent with the origination of the narrow excitonic lines from the intersections of the BSFs with QWs of different types. [ABSTRACT FROM AUTHOR]

InGaN/GaN multiple quantum wells (MQWs) on semipolar (11̄01) GaN microstripes on a Si substrate were fabricated and their optical properties were investigated. From cathodoluminescence (CL) analysis, strong CL emission was obtained in an MQW emitting at 433 nm. However, dark lines appeared in MQWs emitting at longer wavelengths. These dark lines are attributed to lattice relaxation and the generation of misfit dislocations and stacking faults in an MQW, resulting in nonradiative centers. The internal quantum efficiency (IQE) was estimated from excitation-power-dependent photoluminescence analysis. The (11̄01) InGaN/GaN MQW had a high IQE owing to the high crystalline quality of the underlying GaN and the reduced piezoelectric field. The IQE at a carrier concentration of 1×1018 cm-3 in a sample emitting at 490 nm was as high as 90%. The efficiency decreased in a sample with a higher indium content in the MQW due to the generation of misfit dislocations and stacking faults. [ABSTRACT FROM AUTHOR]