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Based on the ground surface perturbation concept, a novel stopband-enhanced electromagnetic-bandgap (EBG) structure has been proposed to suppress the power/ground noise on a three-layer package. This structure consists of a coplanar periodic pattern on the top layer, a ground plane on the third layer, and a ground surface perturbation lattice on the second layer with eight vias connecting to the ground plane. By designing the dimension and via numbers, the ground surface perturbation lattice can significantly enhance the stopband bandwidth. A generic 1-D circuit model is proposed for the three-layer EBG structure. The reason why the proposed structure can possess wider stopband will be explained. Several test samples are fabricated. The agreement of the stopband between the circuit model and measured results are good. [ABSTRACT FROM AUTHOR]

A novel power/ground plane for eliminating the power noise in the high-speed digital circuits using an artificial substrate electromagnetic bandgap (AS-EBG) structure is proposed. The AS-EBG is designed by embedding the air rods and high dielectric constant (DK) rods between the coplanar EBG power/ground planes to enhance the stopband bandwidth. A 2-D transmission-line model of the AS-EBG power planes is also developed with experimental verification to explain the mode perturbation and predict the bandgap of the AS-EBG. It is found that over 60% enhancement of bandwidth (from 1.5 to 2.4 GHz) can be achieved for a 3 × 3 AS-EBG power plane compared to the coplanar-EBG power planes by proper design of the high DK rod with DK of 92. Based on SPICE-based modeling, the excellent power/signal integrity performance of the AS-EBG structure is also presented by the chip-package co-simulation in the time domain. It is found over 70% reduction of the simultaneously switching noise can be obtained with good signal eye-diagram improvement. [ABSTRACT FROM AUTHOR]

An efficient numerical approach based on the 2-D finite-difference time-domain (FDTD) method is proposed to model the power/ground plane noise or simultaneously switching noise (SSN), including the interconnect effect between the package and the print circuit board (PCB). The space between the power and ground planes on the package and PCB are meshed with 2-D cells. The equivalent R-L-C circuits of the via and the solder balls connecting the package and PCB can be incorporated into a 2-D Yee cell based on a novel integral formulation in the time domain. An efficient recursive updating algorithm is proposed to fit the lumped networks into the Yee equations. A test sample of a ball grid array (BGA) package mounted on a PCB was fabricated. The power/ground noise coupling behavior was measured and compared with the simulation. The proposed method significantly reduces the computing time compared with other full-wave numerical approaches. [ABSTRACT FROM AUTHOR]

A power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic bandgap (LPC-EBG) structure. Keeping solid for the ground plane and designing an LPC-EBG pattern on the power plane, the proposed structure omnidirectionally behaves highly efficiently in suppression of GBN (over 50 dB) within the broad-band frequency range (over 4 GHz). In addition, the proposed designs suppress radiated emission (or electromagnetic interference) caused by the GBN within the stophand. These extinctive behaviors of low radiation and broad-band suppression of the GBN is demonstrated numerically and experimentally. Good agreements are seen. The impact of the LPC-EBG power plane on the signal integrity for the signals referring to the power plane is investigated. Two possible solutions, differential signals and an embedded LPC-EBG power plane concept, are suggested and discussed to reduce the impact. [ABSTRACT FROM AUTHOR]

A novel L-bridged electromagnetic bandgap (EBG) power/ground planes is proposed with super-wideband suppression of the ground bounce noise (GBN) from 600Mz to 4.6GHz. The L-shaped bridge design on the EBG power plane not only broadens the stopband bandwidth, but also can increase the mutual coupling between the adjacent EBG cells by significantly decreasing the gap between the cells. It is found the small gap design can prevent from the severe degradation of the signal quality for the high-speed signal referring to the perforated EBG power plane. The excellent GBN suppression performance with keeping reasonably good signal integrity for the proposed structure is validated both experimentally and numerically. Good agreement is seen. [ABSTRACT FROM PUBLISHER]