131 results on '"Wang, Tongqing"'
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2. Publisher Correction to: Computational investigation of a novel metal thickness measurement system with coaxial triple‑coil sensor for chemical mechanical polishing
3. Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing
4. Polishing mechanisms of various surfactants in chemical mechanical polishing relevant to cobalt interconnects
5. Research on weakly alkaline bulk slurries relevant to chemical mechanical polishing for cobalt interconnects
6. The role of dipotassium ethylenediaminetetraacetic acid and potassium oleate on chemical mechanical planarization relevant to heterogeneous materials of cobalt interconnects
7. An integrated deep multiscale feature fusion network for aeroengine remaining useful life prediction with multisensor data
8. A reinforcement ensemble deep transfer learning network for rolling bearing fault diagnosis with Multi-source domains
9. All-Solution-Processed Electronics with Sub-Microscale Resolution and Nanoscale Fidelity Fabricated Via a Humidity-Controlled, Surface Energy-Directed Assembly Process.
10. Mechanical wear behavior between CeO2(100), CeO2(110), CeO2(111), and silicon studied through atomic force microscopy
11. Exploiting interaction of fine and coarse features and attribute co-occurrence for person attribute recognition
12. Behavioral feature recognition of multi-task compressed sensing with fusion relevance in the Internet of Things environment
13. RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis
14. LINC00958 promotes bladder cancer carcinogenesis by targeting miR-490-3p and AURKA
15. Potassium persulfate as an oxidizer in chemical mechanical polishing slurries relevant for copper interconnects with cobalt barrier layers
16. The effect of citric acid based cleaning solution on particle adhesion and removal during post-Cu CMP cleaning
17. A high capacity reversible data hiding scheme based on right-left shift
18. Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing
19. Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters.
20. Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing.
21. Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing.
22. Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization
23. Effects of KIO4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium
24. Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry
25. Chemical effects on the tribological behavior during copper chemical mechanical planarization
26. Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO4-based slurry
27. Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer
28. Wafer bending/orientation characterization and their effects on fluid lubrication during chemical mechanical polishing
29. Extracting Discriminative Parts with Flexible Number from Low-Rank Features for Human Action Recognition
30. Corrosion Investigations of Ruthenium in Potassium Periodate Solutions Relevant for Chemical Mechanical Polishing
31. Augmenting bag-of-words: a robust contextual representation of spatiotemporal interest points for action recognition
32. In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone
33. Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process
34. Effect of a Cu seed layer on electroplated Cu film
35. Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling
36. Anisotropic clustering on surfaces for crack extraction
37. Extracting Refined Low-Rank Features of Robust PCA for Human Action Recognition
38. Tribocorrosion Study of Copper During Chemical Mechanical Polishing in Potassium Periodate-Based Slurry
39. Association between the cytotoxic T-lymphocyte antigen 4 +49A/G polymorphism and bladder cancer risk
40. Contact stress non-uniformity of wafer surface for multi-zone chemical mechanical polishing process
41. Effect of slurry injection position on material removal in chemical mechanical planarization
42. Solution of a sound field generated by the vibrating surface of a body moving at small Mach number
43. Expression of IL-23R and IL-17 and the pathology and prognosis of urinary bladder carcinoma.
44. Role of the Adhesion Force during Copper Chemical Mechanical Planarization.
45. Residual Stress and Pop-Out Simulation for TSVs and Contacts in Via-Middle Process.
46. Galvanic Corrosion Inhibitors for Cu/Ru Couple during Chemical Mechanical Polishing of Ru.
47. Effects of catalyst concentration and ultraviolet intensity on chemical mechanical polishing of GaN.
48. Effect of photocatalytic oxidation technology on GaN CMP.
49. Removal of Copper and Lead from Aqueous Solution by Adsorption onto Cross-Linked Chitosan/Montmorillonite Nanocomposites in the Presence of Hydroxyl–Aluminum Oligomeric Cations: Equilibrium, Kinetic, and Thermodynamic Studies.
50. Surface characteristics of ruthenium in periodate-based slurry during chemical mechanical polishing.
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