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In the field of the electronics, silver is widely used as a conductive material. In order to improve the electrical conductivity of the silver-containing conductive material, it is essential to form a network of the silver in it, which requires not only controlling the size and number of silver particles but also flake shape. By pulverizing the silver particles in two stages, a bead mill and a microbead mill, flake-shaped particles with a thickness of 20 nm could be obtained, and the silver network of the conductive material could be strengthened. The conductive material using the ultra-thin flake-shaped Ag powder was superior in conductivity to that of the conventional flake-shaped Ag powder, and the conductivity was difficult to change even when deformed. These features are not only suitable for applications such as conductive paste and conductive ink, but are also expected to be applied to miniaturization and thinning required in the electronics field, contact sensors for robots, and bed leaving sensors used for nursing beds. [ABSTRACT FROM AUTHOR]