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In this letter, we report a detailed experimental investigation of the time-dependent breakdown induced by forward gate stress in GaN-based power HEMTs with a p-type gate, controlled by a Schottky metal/p-GaN junction. When a high stress voltage is applied on the gate, a large voltage drop and an electric field occur in the depletion region of the p-GaN close to the metal interface, promoting the formation of a percolation path. We have investigated the mechanisms underlying the gate breakdown by adopting different stress conditions, analyzing the influence of the temperature, and investigating the activation energy of the traps. In addition, thanks to this approach, the device lifetime has been evaluated and an original empirical model, representing the relationship between the gate leakage current and the time to failure, has been proposed.

In this paper, we present the results of a combined measurement/simulation analysis of the degradation induced by on-state stress in Au-free AlGaN/gallium-nitride-on-Si Schottky barrier diodes (SBDs). Turn-on voltage ( $V_{\mathrm{ TON}}$ ) and on-resistance ( $R_{\mathrm{\scriptscriptstyle ON}}$ ) are affected by charge carrier trapping/detrapping, occurring in different regions and caused by different mechanisms, when a high stress current is applied to the device. In particular, we have investigated the degradation of SBDs adopting different stress conditions and analyzing the influence of the diode geometry; consequently, we were able to identify the physical mechanisms responsible for long-term degradation of $V_{\mathrm{ TON}}$ and $R_{\mathrm{\scriptscriptstyle ON}}$ . In addition, thanks to this approach, a critical electric field for the $R_{\mathrm{\scriptscriptstyle ON}}$ degradation has been determined.