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This study investigated the effects of adding titanium dioxide (TiO2) and aluminium oxide (Al2O3) nanoparticles into Sn3.0Ag0.5Cu (SAC) lead-free solder alloy on the thermal properties and wettability. In comparison with SAC lead-free solder without addition of nanoparticles, the melting temperature is very similar and comparable. The solidus temperature is in the range of 217.1 to 217.2 °C with the addition of TiO2 and Al2O3 nanoparticles. The results shows that the addition of 0.25-1.0 wt% of TiO2 and Al2O3 nanoparticles caused the liquidus temperature to decrease from 222.4 to 220.5 °C. The spreading area of SAC-xTiO2-xAl2O3 lead-free solder increases from 5.7 to 7.1mm at 0-0.5wt% of TiO2 and Al2O3 nanoparticles. The contact angle decreased from 66.09° to 46.84° when the composition of TiO2 and Al2O3 increases from 0-0.5wt%.

Industrial printed circuit boards (PCB)s are composites with complex geometrical features. In this study, a homogenization scheme was proposed to model bending, i.e., the primary deformation mode of industrial PCBs. Four-point bend tests were conducted on two types of industrial PCBs to measure their bending stiffness in the longitudinal and the lateral directions, respectively. The experimental results showed significant anisotropy and non-uniformity in the mechanical properties of the PCBs. PCB modelling was performed using the finite element method and a zoning approach. Three micromechanics models, namely Cox-Krenchel model, modified Cox Lamina model and Pan model, were adopted. These models were compared to the classical rule of mixtures (ROM). Results showed that ROM and the micromechanics models gave the upper and the lower bounds, respectively, of the stiffness and overall response of the PCB in bending. Among the micromechanics model, Pan model gave the best prediction of elastic stiffness, at accuracy of more than 80%.

Purpose The purpose of this study is to investigate the effect of electromigration (EM) on solder alloy joint on copper with nickel surface finish. Sn-Bi solder alloy has been used in this research. Design/methodology/approach The EM process was completed with the duration of 0, 24, 48, 72 and 96 h under direct current (DC) of 1,000 mA. Tensile stress on the substrates was assessed after EM at a tension rate of 0.1 mm/min. Microscopy was used to observe the formation and size of voids and conduct an analysis between copper and nickel substrates. Findings Four types of intermetallic compounds (IMCs), namely, Cu-Sn, Cu3Sn, Cu6Sn5, and Sn-Bi, were detected between the Sn-Bi/Co solder joint. Voids appear to be at the anode and the cathode for 96 h of EM for Sn-Bi/Ni solder join; however, there seem to be more voids at the cathode. Originality/value EM is one of the crucial keys to produce a good integrated circuit (IC). When the current density is extremely high and will cause the metal ions to move into the electron direction flow, it will be characterised based on the ion flux density. In this research, the effect of EM on the Sn-Bi solder alloy joint on copper with nickel surface finish was studied.

Purpose This paper aims to investigate the effect different fluxes have on the mechanical properties of lead-free solders, specifically Sn-Zn-Bi solder alloy. The solder billets were soldered in between copper substrates and flux was applied. The mechanical tests carried out on the solder alloys were tensile and shear tests. They were experimented on with different fluxes, namely, water-soluble (paste), rosin mildly activated (RMA) and insoluble (RMA) flux. From these experiments, the ultimate tensile strength, shear strength, elongation, yield stress, Young’s modulus and the stress-strain curve are derived. The results showed that solder billets that were soldered onto copper substrates with water-soluble flux yielded the highest ultimate tensile strength and shear strength values of 9.9961 MPa and 118.836 MPa, respectively. Billets soldered using RMA flux had the highest values of elongation and Young’s modulus, 0.306 mm and 50,257.295 MPa, respectively. However, on viewing the failure of all the specimens under an optical microscope and scanning electron microscope (SEM), specimens soldered using water-soluble flux possessed the least deformities, depicting their higher level of mechanical properties, entailing their strength and ductility, deeming them as the most suitable flux for microelectronic applications. Design/methodology/approach The solder billets were soldered in between copper substrates and flux was applied. The mechanical tests carried out on the solder alloys were tensile and shear tests. They were experimented on with different fluxes, namely, water-soluble (paste), RMA and insoluble flux (RMA) flux. From these experiments, the ultimate tensile strength, shear strength, elongation, yield stress, Young’s modulus and the stress-strain curve are derived. Findings The results showed that solder billets that were soldered onto copper substrates with water-soluble flux yielded the highest ultimate tensile strength and shear strength values of 9.9961 MPa and 118.836 MPa, respectively. Originality/value This paper demonstrated that water-soluble fluxes gave the better strength and were most suitable for microelectronics applications.

Background: Elderly people with severe finger weakness may need assistive health technology interventions. Finger weakness impedes the elderly in executing activities of daily living such as unbuttoning shirts and opening clothes pegs. While studies have related finger weakness with ageing effects, there appears to be no research that uses an algorithmic problem-solving approach such as the theory of inventive problem-solving (TRIZ) to recommend finger grip assistive technologies that resolve the issue of finger weakness among the elderly. Using TRIZ, this study aims to conceptualise finger grip enhancer designs for elderly people. Methods: Several TRIZ tools such as the cause-and-effect chain (CEC) analysis, engineering contradiction, physical contradiction, and substance-field analysis are used to conceptualise solutions that assist elderly people in their day-to-day pinching activities. Results: Based on the segmentation principle, a finger assistant concept powered by a miniature linear actuator is recommended. Specific product development processes are used to further conceptualise the actuation system. The study concluded that the chosen concept should use a DC motor to actuate fingers through tendon cables triggered by a push start button. Conclusions: Finger pinch degradation worsens the quality of life of the elderly. A finger grip enhancer that assists in day-to-day activities may be an effective option for elderly people, not only for their physical but also their mental well-being in society.

Purpose The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder characteristics that focused on its wettability. Design/methodology/approach This paper approach on the review of the solder wettability on the surface. It reviews on the solder especially on the contact angle and surface tension that is covered under the wettability of the solder. Findings This paper also reviews on the lead free solder characteristics that focused on its wettability. Originality/value This paper summarized finding from other researchers. The authors collect and summarize the useful data from other papers or journals. It is to create an understanding for the reader by discussion from the others research papers findings.

In this paper, characteristic of In–32.7Bi–0.5Zn lead-free solder system have been studied. DSC shows that, In–32.7Bi–0.5Zn system alloy give low melting temperature at 72.30 °C. Lowest melting temperature ensures that the solder melts, forms a joint with the substrates, and re-solidifies within the shortest possible process time. Further, the wettability between molten solder and copper substrate was measured at different reflow temperature. The contact angle for In–32.7Bi–0.5Zn solder alloys were decreasing 30.76° to 24.5° as the temperature increased from 100 to 140 °C. A significant increment of contact angle for In–32.7Bi–0.5Zn at 140 °C. The result of spreading area is inversed with the contact angle. Energy-dispersive X-ray analysis indicated two layer of intermetallic compound between the solder and the substrate; Cu5Zn8 and Cu11In9 compound.

Purpose – The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many researchers have studied the SAC solder alloy and found that the properties such as melting temperature, wettability, microstructure and interfacial, together with mechanical properties, are better for the SAC solder than the tin – lead (SnPb) solders. Meanwhile, addition of various elements and nanoparticles seems to produce enhancement on the prior bulk solder alloy as well. These benefits suggest that the SAC solder alloy could be the next alternative solder for the electronic packaging industry. Although many studies have been conducted for this particular solder alloy, a compilation of all these properties regarding the SAC solder alloy is still not available for a review to say. Design/methodology/approach – Soldering is identified as the metallurgical joining method in electronic packaging industry which uses filler metal, or well known as the solder, with a melting point < 425°C (Yoon et al., 2009; Ervina and Marini, 2012). The SAC solder has been developed by many methods and even alloying it with some elements to enhance its properties (Law et al., 2006; Tsao et al., 2010; Wang et al., 2002; Gain et al., 2011). The development toward miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important characteristics and the fundamental factor involving the SAC solder is still not sufficient. Henceforth, this paper resolves in stating all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding. Findings – Various Pb-free solders have been studied and investigated to overcome the health and environmental concern of the SnPb solder. In terms of the melting temperature, the SAC solder seems to possess a high melting temperature of 227°C than the Pb solder SnPb. Here, the melting temperature of this solder falls within the range of the average reflow temperature in the electronic packaging industry and would not really affect the process of connection. A good amendment here is, this melting temperature can actually be reduced by adding some element such as titanium and zinc. The addition of these elements tends to decrease the melting temperature of the SAC solder alloy to about 3°C. Adding nanoparticles, meanwhile, tend to increase the melting temperature slightly; nonetheless, this increment was not seemed to damage other devices due to the very slight increment and no drastic changes in the solidification temperature. Henceforth, this paper reviews all the properties of the Pb-free SAC solder system by how it is developed from overcoming environmental problem to achieving and sustaining as the viable candidate in the electronic packaging industry. The Pb-free SAC solder can be the alternative to all drawbacks that the traditional SnPb solder possesses and also an upcoming new invention for the future needs. Although many studies have been done in this particular solder, not much information is gathered in a review to give better understanding for SAC solder alloy. In that, this paper reviews and gathers the importance of this SAC solder in the electronic packaging industry and provides information for better knowledge. Originality/value – This paper resolves in stating of all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

PurposeRecently nanoparticles reinforced lead free solders are vastly developed in electronics packaging industry. Studies and investigations have been conducted to learn and investigate the types, properties, method, availability and importance of nanoparticles in this field.Design/methodology/approachMechanical properties, melting temperature and microstructural conditions are taken into major considerations in any of the preparation on nanoparticles and being reviewed in this paper. Segregation of the types of nanoparticles being added together with their properties is summarized in this paper. High temperature reliability is crucial in providing a good viable solder and hence addition of nanoparticles have been seen to give a positive outcome in this particular property.FindingsThis paper reviews on the beneficial of the various nanoparticles addition in the solder. Briefed explanations and the factors are revealed in this review.Originality/valueThis paper reviews on the beneficial of the various nanoparticles addition in the solder.

This work studied the surface and interfacial properties of a proposed lead-free solder material, the In–31.6Bi–19.6Sn system. Surface tension and contact angle of In–31.6Bi–19.6Sn lead-free solder with melting temperature of 61.33 °C was measured on copper substrate at different reflow temperatures. Sessile drop measurements showed that the contact angle depended on reflow temperature. The contact angle gradually decreased from 38.34° to 17.25° as reflow temperature increased from 80 to 140 °C. Energy-dispersive X-ray analysis indicated two layers of intermetallic compound between the solder and the Cu substrate: one of Cu6Sn5 and Cu11In9 (scallop shaped) and the other of Cu11In9 (brightly coloured). As the reflow temperature increased, the shear strength of the In–31.6Bi–19.6Sn/Cu solder joint improved due to reduced contact angle and larger spreading area.

Due to the increase in the use of electronics devices within the industry, the usage of solder connections has increased. These is a concern that lead within the electronic products is considered toxic because lead has potential for leaching from landfills onto water sources and becoming a hazard to human health and surrounding environment. For this reason, replacing Sn-37Pb to free solder with low melting temperature is one of the most important issues in electronic industry. This is due to a demand on low temperature for interconnection and polymer based part component such as LCD display functionality availability at low temperature apply. In this paper, Bi-In-Sn system alloy was investigated as a potential candidate replacing Sn-37Pb. This study covers on solder characteristic such as melting temperature, thermal expansion and microstructure. Bi-In-Sn was prepared and melted in crucible. Solder was cleaned mechanical and chemical before characterized. DSC shows that, Bi-In-Sn system alloy give low melting temperature in range of 65-100°C. The addition of In to Bi-Sn system alloy lowered the melting temperature compared than Sn-37Pb. Lowest melting temperature ensures that the solder melts, forms a joint with the substrates, and re-solidifies within the shortest possible process time. From thermal expansion analysis, it was found that Bi-In-Sn gives good expansion properties to avoid mismatch between Cu pads and solder itself. EDX analysis indicated that, there are two obvious regions in Bi-In-Sn system alloy microstructure. Bright colour refers to BiIn rich phase region and dark colour refers to Sn rich phase region. BiIn rich phase region is higher compared to Sn rich phase in solder give good properties in terms of ductility.