1. Thermal shock resistance enhancement by improved interfacial bonding for carbon/aluminium composites
- Author
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Wenfu Wei, Zhanglin Huang, Guofeng Yin, Zefeng Yang, Xiaobo Li, Haozi Zuo, Qin Deng, Guizao Huang, Junwen Ren, Qianhua Liao, Yan Yang, Guangning Wu, and School of Electrical and Electronic Engineering
- Subjects
Thermal Shock Resistance ,Electrical and electronic engineering [Engineering] ,Energy Engineering and Power Technology ,Composite Failure ,Electrical and Electronic Engineering - Abstract
Carbon/aluminium (C/Al) composites have the advantages of low density and high electrical conductivity, which have potential applications in aerospace, rail transportation and other fields. However, the unstable bonding of the C/Al interface and significant thermal expansion differences have resulted in risks of the composites' failure once suffering from severe thermal shock. In this work, the C/Al composites were prepared by the pressure impregnation method, and silicon (Si) was added to overcome the problems of C/Al non-wettability and thermal expansion differences. The effects of mass fractions of doped silicon on the mechanical properties, electrical conductivity and thermal shock resistance of C/Al composites were also examined. Results show that the formed SiC interlayer has effectively enhanced the interfacial bonding and reduced the differences in the thermal expansion coefficient of each component. As a result, the thermal shock resistance of the composites has been remarkably improved, and the flexural strength could remain 90% of the original level after the thermal shock test, compared with 50% of that without Si doping. Published version This study was funded by the National Natural Science Foundation of China (No. 52077182, 51837009, and U19A20105), the Fundamental Research Funds for the Central Universities (2682018CX17), the National Rail Transit Electrification and Automation Engineering Technology Research Project, and Chengdu Guojia Electrical Engineering Co. Ltd. (No. NEEC‐2018‐B06).
- Published
- 2022