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Integration of thin-film oxide piezoelectrics on glass is imperative for the next generation of transparent electronics to attain sensing and actuating functions. However, their crystallization temperature (above 650 {\deg}C) is incompatible with most commercial glasses. Guided by finite element analysis, we developed a low-temperature flash lamp process for direct growth of piezoelectric lead zirconate titanate films. The process enables crystallization on various types of glasses in a few seconds only. Ferroelectric, dielectric and piezoelectric properties (e$_{33,f}$ of -5 C m$^{-2}$) of these films are comparable to the properties of films processed with standard rapid thermal annealing at 700 {\deg}C. To demonstrate applicability, a surface haptic device was fabricated with a 1 $\unicode{x00B5}$m-thick film. Its ultrasonic surface deflection reached 1.5 $\unicode{x00B5}$m at 60 V, which is sufficient for its use in surface rendering applications. This demonstrated flash lamp annealing process is compatible with large glass sheets and roll-to-roll processing and, therefore, has the potential to significantly expand the applications of piezoelectric devices on glass., Comment: 33 pages, 18 figures

The stress corrosion cracking (SCC) of a simulated weld heat-affected zone (HAZ) in X100 pipeline steel in a carbonate/bicarbonate solution was studied at the open-circuit potential (OCP) and various cathodic potentials. Microstructure of the weld HAZ was simulated by Gleeble processing. Results showed that the steel had a higher sensitivity to SCC at the OCP than at the cathodic potentials. Moreover, the SCC process at − 850 mV was controlled by both anodic dissolution and hydrogen embrittlement (HE), while the SCC was due to HE at − 1200 mV. The SCC occurred at the intercritical HAZ at the cathodic potential because of its lower strength than that of the other weld areas. The fracture modes at the cathodic potentials were all intergranular and transgranular.

Using 2007-2017, securities regulatory commission announced on the administrative penalty, penalty and certified public accountant firm in the audit failure penalty as the research sample, respectively, from the audit failure of violating the frequency of the auditing standards, registered public accounting firm scale and the relationship between the financial fraud and audit failure three aspects to discusses the reasons of audit failure. It is found that “audit evidence” and “verification” account for a large proportion of audit failures. There is a positive correlation between the size of firms and audit quality, and the proportion of audit failures in “big firms” is low. There is no correlation between financial fraud and audit failure. , In view of the reasons for the audit failure, this paper puts forward some preventive strategies.