Author: "Stampoulidis, L." / Language: undetermined - Searchworks@Jio Institute Digital Library Search Results

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Author: MARTI, J, RAMOS, F, MARTINEZ, J, CLAVERO, R, HERRERA, J, SEOANE, J, HOLM-NIELSEN, P, LIU, Y, HILL, M, KOONEN, A, DORREN, H, Van Caenegem, Ruth, Colle, Didier, Pickavet, Mario, Demeester, Piet, KEHAYAS, E, STAMPOULIDIS, L, TSIOKOS, D, BAKOPOULOS, P, AVRAMOPOULOS, H, Mitchell, J, and Faulkner, D
Subjects: Technology and Engineering
Published: 2005

Author: MARTI, J, RAMOS, F, MARTINEZ, J, CLAVERO, R, HERRERA, J, SEOANE, J, HOLM-NIELSEN, P, LIU, Y, HILL, M, KOONEN, A, DORREN, H, Van Caenegem, Ruth, Colle, Didier, Pickavet, Mario, Demeester, Piet, KEHAYAS, E, STAMPOULIDIS, L, TSIOKOS, D, BAKOPOULOS, P, and AVRAMOPOULOS, H
Subjects: Technology and Engineering
Published: 2005

Author: Stamatiadis, C., Stampoulidis, L., Vyrsokinos, K., Lazarou, I., Zimmermann, L., Voigt, K., Moerl, L., Kreissl, J., Sedighi, B., Sheng, Z., Heyn, P., Thourhout, D., Karl, M., Wahlbrink, T., Bolten, J., Leinse, A., Heidemann, R., Gomez-Agis, F., Dorren, H. J. S., Pagano, A., Riccardi, E., Herakles Avramopoulos, and Electro-Optical Communication
Subjects: Technology and Engineering, Hardware_INTEGRATEDCIRCUITS, Hardware_PERFORMANCEANDRELIABILITY
Abstract: BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.

Author: Vyrsokinos, K., Stampoulidis, L., Sheng, Z., Kehayas, E., Bakopoulos, P., Petrantonakis, D., Stamatiadis, C., Kouloumentas, Ch, Zakynthinos, P., Dekker, R., Klein, E. J., Thourhout, D. V., Korthorst, M. T., and Herakles Avramopoulos

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