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1. Plasma Pretreatment System for the Reduction of By-Product Particles in Semiconductor Manufacturing.

2. Improved single‐layer powder core inductor design procedure for DC‐DC converters.

3. Improved single‐layer powder core inductor design procedure for DC‐DC converters

4. Observation and Suppression of Growth Pits Formed on 4H-SiC Epitaxial Films Grown Using Halide Chemical Vapor Deposition Process.

5. On thermal characterization method of integrated magnetic components.