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Passivating contacts consisting of doped polycrystalline silicon (poly‐Si) on a thin tunnel‐oxide enable excellent operating voltages for crystalline silicon solar cells. However, hole‐collecting contacts based on boron‐doped poly‐Si do not yet reach their full surface‐passivation potential, likely due to boron diffusion during annealing. In this work, the authors show how the insertion of a thin intrinsic silicon buffer layer between the silicon oxide and poly‐Si is effective in improving the contact passivation. By tailoring the microstructure of the buffer layer, the chemical passivation and contact resistivity are simultaneously significantly improved. On device level, the buffer layer enables a ≈30 mV open‐circuit voltage enhancement and 1.4% absolute gain in power conversion efficiency. [ABSTRACT FROM AUTHOR]

Excellent amorphous/crystalline silicon interface passivation is of extreme importance for high-efficiency silicon heterojunction solar cells. This can be obtained by inserting hydrogen-plasma treatments during deposition of the amorphous silicon passivation layers. Prolonged hydrogen-plasmas lead to film etching. We report on the defect creation induced by such treatments: A severe drop in interface-passivation quality is observed when films are etched to a thickness of less than 8 nm. Detailed characterization shows that this decay is due to persistent defects created at the crystalline silicon surface. Pristine interfaces are preserved when the post-etching film thickness exceeds 8 nm, yielding high quality interface passivation. [ABSTRACT FROM AUTHOR]