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Hybrid kenaf/glass fiber reinforced polymer composites have emerged as promising structural materials, garnering significant attention due to their unique blend of natural kenaf fibers and synthetic glass fibers. However, despite their potential, there remains a gap in the comprehensive understanding of their quasi‐static mechanical behavior, creep resistance, and fatigue performance. This paper addresses this gap by presenting recent advancements in studying these key properties of hybrid composites. Studies reveal that the combination of kenaf and glass fibers results in enhanced tensile, flexural, and impact strengths compared to individual fiber composites. Additionally, the hybridization offers improved creep resistance, with the glass fibers reinforcing the polymer matrix against deformation under sustained loads. Furthermore, investigations into fatigue properties demonstrate the resilience of hybrid composites to cyclic loading, contributing to prolonged service life in high‐stress environments. By elucidating the interplay between kenaf and glass fibers, this review underscores the potential of hybrid composites in various structural applications. The synergistic effects between natural and synthetic fibers offer a balance between sustainability, performance, and durability, making hybrid kenaf/glass fiber reinforced polymer composites a compelling choice for industries seeking lightweight, high‐performance materials in which aligns with the sustainable development goals (SDGs) especially on Goal 12. Highlights: In composite engineering, combining glass and kenaf fibers could cut production costs, yield high‐performance materials, and promote green technology.Substituting part of the glass fiber with kenaf can enhance the strength‐to‐weight ratio and promote greater biodegradability in current synthetic composites.Quasi‐mechanical properties of hybrid kenaf/glass‐based composites was enhanced by optimal stacking sequences, filler addition, and fiber treatment.Failures due to fatigue and creep can be reduced by hybridizing kenaf/glass fiber composites can prevent in polymer composite due to enhance elastic modulus.Enhanced tribological performance of hybrid kenaf/glass‐based composites due to less damage in microstructure via good interlocking of kenaf and glass in matrix. [ABSTRACT FROM AUTHOR]

Particleboard is one of the building materials that contribute to the emittance of formaldehyde in enclosed area. In order to reduce the formaldehyde emission from particleboard, amines were added into the urea formaldehyde (UF) resin as formaldehyde scavenger. The amines used were methylamine, ethylamine and propylamine. 0.5, 0.7 and 1% of each type of amine were added into UF resin and the mixtures were used to produce particleboard from rubberwood particles. The properties of the UF resin after addition of amines such as gelation time, viscosity, pH, free formaldehyde content and thermal stability were evaluated. The physical, mechanical properties and formaldehyde emission of the produced boards were also assessed. The results revealed that fully cured amine-containing UF resin possesses higher thermal stability compared to control UF resin. Amine-containing UF resin also had longer gelation time due to higher pH value. Nevertheless, both physical and mechanical properties of the resultant particleboard were negatively affected. Particleboard made from amine-containing UF resin had higher thickness swelling and water absorption. In addition, lower bending strength and internal bonding strength were also recorded. Insufficient pressing time for fully cured of resin might be the reason for such phenomenon. Particleboard with F*** emission level (0.5 ≤ x ≤ 1.5 mg/L) as specified in Japanese Industrial Standard (JIS) or European's E0 class equivalent were achieved when ethylamine and propylamine were added, regardless of dosage used. This study showed the feasibility of using amines as formaldehyde scavenger. However, optimisation of processing parameters is needed to enhance the physico-mechanical properties of the particleboard. [ABSTRACT FROM AUTHOR]