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InGaN-based multi-quantum well (MQW) solar cells are promising devices for photovoltaics (e.g., for tandem solar cells and concentrator systems), space applications, and wireless power transfer. In order to improve the efficiency of these devices, the factors limiting their efficiency and stability must be investigated in detail. Due to the complexity of a MQW structure, compared with a simple pn junction, modeling the spectral response of these solar cells is not straightforward, and ad hoc methodologies must be implemented. In this paper, we propose a model, based on material parameters and closed-formula equations, that describes the shape of the quantum efficiency of InGaN/GaN MQW solar cells, by taking into account the layer thickness, the temperature dependence of the absorption coefficient, and quantum confinement effects. We demonstrate (i) that the proposed model can effectively reproduce the spectral response of the cells; in addition, (ii) we prove that the bulk p-GaN layer absorbs radiation, but the carriers photogenerated in this region do not significantly contribute to device current. Finally, we show that (iii) by increasing the temperature, there is a redshift of the absorption edge due to bandgap narrowing, which can be described by Varshni law and is taken into account by the model, and a lowering in the extraction efficiency due to the increase in recombination (mostly Shockley–Read–Hall) inside the quantum wells, which is also visible by decreasing light intensity. [ABSTRACT FROM AUTHOR]

Degradation of InGaN–GaN LEDs has been the subject of intense investigations in the past few years. While current- and temperature-induced degradation processes have been described, the impact of photon-induced degradation has not been investigated in detail in the literature. This paper aims at improving the understanding of the mechanisms responsible for the degradation of the InGaN subject to high photon densities by stressing the devices under a high-intensity laser beam in open-circuit conditions (i.e., in the absence of external current). We analyzed the degradation by means of electrical, optical, and deep-level characterization techniques. First, we demonstrate the existence of optically induced degradation processes in GaN LEDs: from photoluminescence measurements, we observed a decrease in the luminescence after stress, more prominent in the region irradiated during stress. Second, we ascribe this effect to a decrease in internal quantum efficiency due to the generation of non-radiative defects within the active region. Third, by steady-state photocapacitance measurements, we reveal the presence of a shallow level with an energy of EC–2.2 eV, which can be ascribed to gallium vacancies and its complexes with oxygen and nitrogen and can be related to the increase in yellow luminescence. [ABSTRACT FROM AUTHOR]

Understanding the properties of N-implanted β-Ga2O3 is fundamental for the optimization of doping and isolation structures based on gallium oxide. This paper reports an extensive analysis of the impact of thermal annealing on the concentration and properties of deep levels in N-implanted β-Ga2O3 Schottky barrier diodes by means of capacitance isothermal transient spectroscopy. Samples with annealing temperatures from 800 to 1200 °C were considered. The original results presented in this paper demonstrate the following: (a) The instability of current–voltage characteristics detected for all the samples under test can be attributed to the presence of three electron traps with activation energies of 0.6, 0.7, and 1 eV, consistent with previous reports in β-Ga2O3. (b) The detected traps are not the nitrogen level but intrinsic defects whose concentration is increased by the implantation process. (c) The concentration of deep levels decreases as the annealing temperature increases, demonstrating that the annealing process can effectively restore the quality of the material while keeping the conductivity decrease related to the presence of the nitrogen. Finally, (d) we demonstrate that the residual leakage and the turn-on voltage shift are correlated with the Arrhenius signature of the detected deep levels. An interpretation is proposed to explain the measurement results. [ABSTRACT FROM AUTHOR]

Over the last decade, gallium nitride (GaN) has emerged as an excellent material for the fabrication of power devices. Among the semiconductors for which power devices are already available in the market, GaN has the widest energy gap, the largest critical field, and the highest saturation velocity, thus representing an excellent material for the fabrication of high-speed/high-voltage components. The presence of spontaneous and piezoelectric polarization allows us to create a two-dimensional electron gas, with high mobility and large channel density, in the absence of any doping, thanks to the use of AlGaN/GaN heterostructures. This contributes to minimize resistive losses; at the same time, for GaN transistors, switching losses are very low, thanks to the small parasitic capacitances and switching charges. Device scaling and monolithic integration enable a high-frequency operation, with consequent advantages in terms of miniaturization. For high power/high-voltage operation, vertical device architectures are being proposed and investigated, and three-dimensional structures—fin-shaped, trench-structured, nanowire-based—are demonstrating great potential. Contrary to Si, GaN is a relatively young material: trapping and degradation processes must be understood and described in detail, with the aim of optimizing device stability and reliability. This Tutorial describes the physics, technology, and reliability of GaN-based power devices: in the first part of the article, starting from a discussion of the main properties of the material, the characteristics of lateral and vertical GaN transistors are discussed in detail to provide guidance in this complex and interesting field. The second part of the paper focuses on trapping and reliability aspects: the physical origin of traps in GaN and the main degradation mechanisms are discussed in detail. The wide set of referenced papers and the insight into the most relevant aspects gives the reader a comprehensive overview on the present and next-generation GaN electronics. [ABSTRACT FROM AUTHOR]

We present a detailed model of the static and dynamic gate leakage current in lateral β-Ga2O3 MOSFETs with an Al2O3 gate insulator, covering a wide temperature range. We demonstrate that (i) in the DC regime, current originates from Poole–Frenkel conduction (PFC) in forward bias at high-temperature, while (ii) at low temperature the conduction is dominated by Fowler–Nordheim tunneling. Furthermore, (iii) we modeled the gate current transient during a constant gate stress as effect of electron trapping in deep levels located in the oxide that inhibits the PF conduction mechanism. This hypothesis was supported by a TCAD model that accurately reproduces the experimental results. [ABSTRACT FROM AUTHOR]

Herein, the reliability of commercial ultraviolet‐C (UV‐C) light‐emitting diodes (LEDs) subjected to constant current stress is reported. Electrical, optical, and spectral analyses are carried out on UV‐C LEDs with an emission peak of 275 nm and a nominal optical power of 12 mW at 100 mA. Degradation tests are carried out at the maximum rated current, the double and at three times the maximum. The LED lifetime is found to be inversely proportional to the third power of the stress current density, indicating that the degradation mechanism might be activated by high‐energy electrons arising from Auger–Meitner recombination. Electrical characterization indicates an increase in defect‐related leakage, whereas the spectral analysis identifies a variation in two emission peaks which can be ascribed to a defect density increase in the active region and the p‐gallium nitride (GaN) layer of the LEDs. A final remark comes from the strong dependence of lifetime on operating current: increasing current to lower the number of LEDs in a system is not an optimized strategy. In fact, this has a substantial impact on system lifetime, thus lowering the total number of permitted disinfections. [ABSTRACT FROM AUTHOR]

This tutorial paper focuses on the physical origin of thermal droop, i.e., the decrease in the luminescence of light-emitting diodes (LEDs) induced by increasing temperature. III-nitride-based LEDs are becoming a pervasive technology, covering several fields from lighting to displays, from automotive to portable electronics, and from horticulture to sensing. In all these environments, high efficiency is a fundamental requirement, for reducing power consumption and system cost. Over the last decade, a great deal of effort has been put in the analysis of the efficiency droop, the decrease in LED internal quantum efficiency (IQE) induced by high current density. On the other hand, an IQE decrease is observed also for increasing temperature, a phenomenon usually referred to as thermal droop. For commercial LEDs, the IQE decrease related to thermal droop can be comparable to that of efficiency droop: for this reason, understanding thermal droop is a fundamental step for making LEDs capable of operating at high temperature levels. In several fields (including street lighting, automotive, photochemical treatments, projection, entertainment lighting, etc.), compact and high-flux light sources are required: typically, to reduce the size, weight, and cost of the systems, LEDs are mounted in compact arrays, and heat sinks are reduced to a minimum. As a consequence, LEDs can easily reach junction temperatures above 85–100 °C and are rated for junction temperatures up to 150–175 °C (figures from commercially available LED datasheets: Cree XHP70, Osram LUW HWQP, Nichia NVSL219CT, Samsung LH351B, and LedEngin LZP-00CW0R) and this motivates a careful analysis of thermal droop. This paper discusses the possible physical causes of thermal droop. After an introduction on the loss mechanisms in junctions, we will individually focus on the following processes: (i) Shockley–Read–Hall (SRH) recombination and properties of the related defects; (ii) Auger recombination and its temperature dependence, including the discussion of trap-assisted Auger recombination; (iii) impact of carrier transport on the thermal droop, including a discussion on carrier delocalization, escape, and freeze out; (iv) non-SRH defect-related droop mechanisms. In addition, (v) we discuss the processes that contribute to light emission at extremely low current levels and (vi) the thermal droop in deep ultraviolet LEDs, also with reference to the main parasitic emission bands. The results presented within this paper give a tutorial perspective on thermal droop; in addition, they suggest a pathway for the mitigation of this process and for the development of LEDs with stable optical output over a broad temperature range. [ABSTRACT FROM AUTHOR]

The long-term stability of ultraviolet (UV)-C light-emitting diodes (LEDs) is of major importance for many applications. To improve the understanding in this field, we analyzed the degradation of AlGaN-based UVC LEDs and modeled the variation of electrical characteristics by 2D simulations based on the results of deep-level optical spectroscopy (DLOS). The increase in the forward leakage current observed during ageing was ascribed an increase in trap-assisted tunneling. The analysis of the degradation kinetics suggests the role of a defect diffusion process, possibly involving impurities coming from the p-type layers. [ABSTRACT FROM AUTHOR]

The ongoing problems in western countries connected to the global energy supply urgently force the research community to strive in finding new methodologies for boosting the functional properties of earth‐abundant raw materials, for example, the largely available cupreous oxide. In this work, the authors focus on the surface sensitization of this metal oxide semiconductor with an argon plasma treatment, that promotes, during photoelectrochemical hydrogen evolution, the formation of metallic copper nanostructures. Interestingly, these copper‐based hierarchical nano‐branches, having inherent plasmonic properties, are at the origin of the improved shelf‐life of the modified Cu2O photocathode, as is demonstrated by advanced structural and photophysical analyses. This proposed photophysical mechanism for an operando electrode stabilization suggests that a self‐healing process can occur within the Cu2O/plasmonic Cu heterostructure. These findings pave the way to the implementation of new, easy‐to‐make strategies to improve the properties of low‐cost, low‐toxicity energy materials. [ABSTRACT FROM AUTHOR]

Herein, the results are reviewed concerning reliability of high‐electron mobility transistors (HEMTs) based on GaN, which currently represent the technology of choice for high‐efficiency microwave and millimeter‐wave power amplifiers. Several failure mechanisms of these devices are extensively studied, including converse piezoelectric effects, formation of conductive percolation paths at the edge of gate toward the drain, surface oxidation of GaN, time‐dependent breakdown of GaN buffer, and of field‐plate dielectric. For GaN HEMTs with scaled gate length, the simultaneous control of short‐channel effects, deep‐level dispersion, and hot‐electron‐induced degradation requires a careful optimization of epitaxial material quality and device design. [ABSTRACT FROM AUTHOR]

Costs and toxicity concerns are at the center of a heated debate regarding the implementation of perovskite solar cells (PSCs) into commercial products. The first bottleneck could be overcome by eliminating the top metal electrode (generally gold) and the underlying hole transporting material and substituting both with one single thick layer of conductive carbon, as in the so‐called carbon‐based PSCs (C‐PSCs). The second issue, related to the presence of lead, can be tackled by resorting to other perovskite structures based on less toxic metallic components. An interesting case is that of the double perovskite Cs2AgBiBr6, which at present still lacks the outstanding optoelectronic performances of the lead‐based counterparts but is very stable to environmental factors. In this work, the processing of carbon electrodes onto Cs2AgBiBr6‐based C‐PSCs was reported, starting from an additive‐free isopropanol ink of a carbon material obtained from the hydrothermal recycling of waste tires and employing a high‐throughput ultrasonic spray coating method in normal environmental conditions. Through this highly sustainable approach that ensures a valuable step from an end‐of‐life to an end‐of‐waste status for used tires, devices were obtained delivering a record open circuit voltage of 1.293 V, which might in the future represent ultra‐cheap solutions to power the indoor Internet of Things ecosystem. [ABSTRACT FROM AUTHOR]

The defectiveness of InGaN-based quantum wells increases with low indium contents, due to the compressive strain induced by the lattice mismatch between the InGaN and GaN layers, and to the stronger incorporation of defects favored by the presence of indium. Such defects can limit the performance and the reliability of LEDs, since they can act as non-radiative recombination centers, and favor the degradation of neighboring semiconductor layers. To investigate the location of the layers mostly subjected to degradation, we designed a color-coded structure with two quantum wells having different indium contents. By leveraging on numerical simulations, we explained the experimental results in respect of the ratio between the emissions of the two main peaks as a function of current. In addition, to evaluate the mechanisms that limit the reliability of this type of LED, we performed a constant-current stress test at high temperature, during which we monitored the variation in the optical characteristics induced by degradation. By comparing experimental and simulated results, we found that degradation can be ascribed to an increment of traps in the active region. This process occurs in two different phases, with different rates for the two quantum wells. The first phase mainly occurs in the quantum well closer to the p-contact, due to an increment of defectiveness. Degradation follows an exponential trend, and saturates during the second phase, while the quantum well close to the n-side is still degrading, supporting the hypothesis of the presence of a diffusive front that is moving from the p-side towards the n-side. The stronger degradation could be related to a lowering of the injection efficiency, or an increment of SRH recombination driven by a recombination-enhanced defect generation process. [ABSTRACT FROM AUTHOR]

Favoring innovation by making timely medical technology available to people and by securing patients' safety is a challenge. The new European Medical Device Regulation (MDR) will have a central implication in the development of new devices and could affect their innovation and availability, as well as discourage investment in research within Europe. Start-ups and small companies might not be able to cope with the increasing complexity and the required changes of perspective. Health-care institutions are facing an increasing availability of complex technologies, while data on their clinical efficacy and cost-effectiveness are rarely provided. A partnership/collaboration between health-care institutions, academia, and private industries will enhance their own specific interests with the common goal of improving overall health and quality of life. The complexity of the subject combined with the variety of specialists and stakeholders involved requires the implementation, in hospital centers of clinical excellence, of units dedicated to the whole path of the medical device innovation. Stakeholders should quickly provide adequate measures to facilitate the complex medical device innovation path under the more stringent MDR aimed to increase safety and quality of care. [ABSTRACT FROM AUTHOR]

The degradation of InGaN-based laser diodes for Blu-ray technology is described. The observed degradation of the laser is attributed to an electrothermally activated process that induces an increase in the nonradiative recombination rate with subsequent decrease in the optical efficiency of the active layer.

In this paper, we extensively characterize and model the threshold voltage instability in lateral β-Ga2O3 MOSFETs with Al2O3 gate dielectric. Specifically, (i) the results indicate that the threshold voltage instability originates from electron trapping at gate dielectric border traps close to the Al2O3/β-Ga2O3 interface. (ii) Logarithmic kinetics were detected for both stress and recovery by means of a innovative fast-capacitance experimental setup, over more than seven decades of time; (iii) a generalized model, which is capable of accurately reproducing the experimental results, was proposed to explain this trend. [ABSTRACT FROM AUTHOR]

Herein, the main factors and mechanisms that limit the reliability of gallium nitride (GaN)‐based light‐emitting diodes (LEDs) are reviewed. An overview of the defects characterization techniques most relevant for wide‐bandgap diodes is provided first. Then, by introducing a catalogue of traps and deep levels in GaN and computer‐aided simulations, it is shown which types of defects are more detrimental for the radiative efficiency of the devices. Gradual degradation mechanisms are analyzed in terms of their specific driving force: a separate analysis of recombination‐enhanced processes, driven by nonradiative recombination and/or temperature‐assisted processes, such as defects or impurity diffusion, is presented. The most common lifetime estimation methods and standards adopted for solid‐state luminaires are also reported on. Finally, the paper concludes by examining which are the typical degradation and failure mechanisms exhibited by LEDs submitted to electrical overstress. [ABSTRACT FROM AUTHOR]

We studied the permanent effects of heavy-ion strikes on decananometer triple-gate SOI devices. We highlighted the role of the geometry and the three-dimensional architecture in the response to heavy ions. Heavy-ion strikes in state-of-the-art Triple-Gate FETs may have measurable permanent effects, due to microdose in the buried oxide, breakdown of the gate oxide, or interface state generation in the side oxide/body interface. This last effect is particularly interesting since it is related to the verticality of multigate transistors. Index Terms--Breakdown, heavy ions, microdose, multigate device (MuGFET), triple-gate SOI FETs.

In this paper, the susceptibility of a Kuijk bandgap voltage reference to electromagnetic interferences (EMIs) superimposed to the power supply is investigated. A model of the bandgap circuit is derived from experimental tests consisting of scattering parameters and susceptibility measurements on a test chip. The model is able to correctly predict the susceptibility of the circuit by means of SPICE transient simulations. The simulations identify the fundamental stray components responsible for EMI coupling that are usually not taken into account in postlayout analyses. From the EMI point of view, the rectification phenomenon of bipolar transistors, used in the bandgap cell, and the operational amplifier (op-amp) input distortion are shown to cause the voltage reference performance degradation. In particular, for the first time, the importance of the bandgap cell is pointed out, suggesting that the measures to reduce the susceptibility of the op-amp may not be sufficient to guarantee the bandgap immunity. Moreover, the analyses of main parasitic paths (from the power supply net to the more sensitive nodes) demonstrate the relevance of paths that are not commonly considered during the design phase and that may lead to an immunity degradation. Possible solutions to reduce the bandgap susceptibility are also explored, suggesting design criteria, filtering techniques, and layout variations. A second test chip is designed and manufactured to validate the suggested improvements and verify the critical role of the bandgap cell. Finally, a simplified theoretical analysis, which allows a fast bandgap susceptibility evaluation, is presented. This tool is used to point out the importance of the rectification phenomenon compared to the op-amp differential pair distortion. Index Terms--Differential pair distortion, Kuijk bandgap, RF interference, rectification, stray components.