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Micro-LED is a new technology applied in the display field, which has the advantages of self-illumination, low power consumption, high brightness, long life and ultra-high resolution, and has broad application prospects. Using MOS devices to drive micro-LED can enable each unit to have its own drive, thus improving the yield and reducing the subsequent repair processes. In this paper, Sentaurus TCAD simulation software is used to design and simulate NMOS/PMOS devices and their driving circuits. For the first time, CMOS inverters are used to directly drive Micro-LED. Three kinds of driving circuits are compared and analyzed according to their simulation results in output characteristics and transient characteristics. In terms of switching characteristics caused by output characteristics, a CMOS inverter driving a micro-LED circuit has no problems of incomplete turn-off and has greater advantages. In the switching characteristics aspect caused by transient characteristics, PMOS driving a micro-LED circuit has the shortest turn-on time and greater advantages. When compared with a micro-LED driven by an access current-limiting resistor, a micro-LED driven by a direct drive has a smaller on-time value and greater advantages. [ABSTRACT FROM AUTHOR]

During off-state, the influence of surface-trapped electron charges induced by high-field stress near the gate electrode of AlGaN/GaN power high-electron mobility transistor devices causes a reduction in two-dimensional electron gas (2DEG) carrier density at the heterointerface. In a pulse turn-on operation, the weakened 2DEG channel results in a higher on-state conduction resistance during the transient, known as the current collapse phenomenon. The phenomenon increases the switching loss by a higher on-state resistance and prolonged turn-on transition time, thus limits the device operating frequency range. In this paper, such a phenomenon is modeled, analyzed by Sentaurus TCAD simulation, and verified by the laboratory measurement data, with the emphasis on the influence of field plates toward the current collapse. The spatial distributions of trapped electrons and excess free electrons along the AlGaN surface are modeled and analyzed to arrive at the quantitative relationships among the trapped electron density, on-resistance increase, and the electric field distribution which provide a reliable criterion for current collapse reduction. It was found that, with a proper field plate design, it is possible to achieve an improvement on transient on-state resistance and the current recovery time. [ABSTRACT FROM AUTHOR]