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In this chapter simulation and measurement experiments prove that the structure function evaluation of the thermal transient testing is capable to locate die attach failure(s), even in case of stacked die packages. Both the strength and the location of the die attach failure may be determined with the methodology of a fast thermal transient measurement and the subsequent computer evaluation. The paper presents first the theoretical background of the method. After this, application on single die packages is presented. In the rest of the paper first simulation experiments show the feasibility of locating die attach problem in stacked die structures with the presented algorithm and a large number of measured experiments prove that the methodology is applicable also in practice. At the end of the chapter, in the evaluation of the methodology the special advantage of the method, that normally it does not require any additional circuit elements on any of the possibly-stacked-dies is also presented. [ABSTRACT FROM AUTHOR]