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Although the World΄s largest industrial sector, Electronics has received relatively little attention with regard to mechanical failure of its equipment. Design strategies against fracture are advanced for applications, such as aerospace, automotive, pressure vessel and engine applications. So a fundamental question arises as to the extent to which these can be applied to Electronics. The paper describes the special characteristics of electronics equipment in service, and outlines common modes of failure, with emphasis on thermomechanical fatigue. The particular challenge of size is considered when behaviour determined from conventional bulk samples is no longer representative of actual components. Two case studies are presented that illustrate the special nature of electronics. It is suggested that as miniaturisation continues, fracture will become a major cause of failure. [ABSTRACT FROM AUTHOR]