66 results on '"Chen, Chuantong"'
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2. Development of micron-sized Ag-Si composite paste die attach material for highly stable microstructure during high temperate aging
3. Enhanced Reliability for Power Modules via a New Ag/Si Sinter Joining Strategy
4. Improve the high-temperature reliability of epoxy encapsulation with copper substrates through a copper thiolate complex layer
5. Simulation of morphology evolution and pore segregation of Ag sinter joint at high temperature
6. Condition monitoring of SiC power assembly by using time-series analysis of acoustic emission during power cycling tests
7. High reliability design Ag sinter joining on softened Ni-P /Pt/Ag metallization substrate during harsh thermal cycling
8. A Novel Chiplet Integration Architecture Employing Pillar-Suspended Bridge with Polymer Fine-Via Interconnect
9. Fine Pitch Micro Via Interconnection with Reliable Electroless/electric Cu plating Layers Combined with High Power DUV Picosecond Laser for Organic Substrates
10. Pattern Design of SiC-TEG Heater Chip with Uniform Temperature Distribution Applied in Power Module Packaging
11. Rapid silver sinter joining technology for large area chips
12. Effect of Aging and Thermal Shock on the Reliability of Silver Sintered Die Attach for SiC Power Devices
13. Novel Al /AlN bonding by micro-sized Ag particles sinter joining in low temperature low pressure air conditions
14. Study of Cu Micro-via by TOF-SIMS and STEM
15. Effect of Ni additive on electroless Cu quality for high density interconnect PCB substrate
16. Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
17. Phase-Field Modelling for Crack Evolution of PBX Under Thermomechanical Loadings
18. Micro-flake Ag paste sinter joining on bare DBA substrate for high temperature SiC power modules
19. Real-time monitoring and diagnosis of die attach structure deterioration by using acoustic emission method
20. Chemical bonding copper and epoxy through self-assembled layer
21. Cracking-Less Heat-Resistant Electroless Ni-P Plating Film for Wide Bandgap Power Modules
22. Ag die-attach paste modified by WC additive for high-temperature stability enhancement
23. Novel Ag salt paste for large area Cu-Cu bonding in low temperature low pressure and air condition
24. Ag-Ag direct bonding via a pressureless, low-temperature, and atmospheric stress migration bonding method for 3D integration packaging
25. Development of Solder Deterioration Diagnosis System of a Power Module via the Acoustic Emission Monitoring (AEM) Technique
26. Low temperature Cu sinter joining on different metallization substrates and its reliability evaluation with a high current density
27. Pressureless and low temperature direct bonding on Si, SiC and GaN via Ag paste sinter-joining
28. Novel approach of die attach technology for SiC power module by pure Al thin film bonding
29. Micromorphology analysis of Sn-3.0Ag-0.5Cu solder under compression in wide ranges of temperature and strain rate
30. Thermal evaluation of metalized ceramic substrates for use in next-generation power modules toward international standardization
31. Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates
32. Advanced SiC power module packaging technology direct on DBA substrate for high temperature applications: Ag sinter joining and encapsulation resin adhesion
33. Advanced SiC power module packaging technology direct on DBA substrate for high temperature applications
34. Microstructural and mechanical reliability of a GaN/DBA die-attached module with Ag sinter joining in harsh thermal environments
35. Sinterability improvement of hybrid silver sinter joining paste by adding silver nanoparticles
36. Reliability analysis of sintered Cu joints under power cycle condition
37. Sinter Ag joining on different metallization substrate and their high temperature reliability
38. Effect of Substrate Preheating Treatment on Thermal Reliability and Micro-Structure of Ag Paste Sintering on Au Surface Finish
39. Direct bonding with Ni-P finished DBC substrate with sinter Ag micro-sized particles
40. Long-term reliability of GaN/DBA die-attached module with Ag sinter paste and with high temperature solder
41. Die attach module by Cu sheet interconnect for high temperature applications
42. Thermal shock reliability of GaN die-attached on DBA with Ag sinter paste
43. Effect of oxygen on Ag sintering technology with low temperature pressureless
44. Effect of temperature on electrochemical corrosion of Zn-30Sn lead-free solder
45. Bonding technology using cold-rolled Ag sheet in die-attachment applications
46. Effect of pre-annealing of Au metallization structure on the bonding performance with low temperature pressureless sintering Ag
47. Metallization technology of SiC power module in high temperature operation
48. Ag joint bonding technology for bare copper substrate in low temperature, pressureless and air condition
49. Corrosion process study of Zn-30Sn high-temperature lead-free solder
50. Solvent effect on pressureless and low-temperature sintering of Ag paste for die-attachment in high-power devices
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