1. An ultra-thin interposer utilizing 3D TSV technology
- Author
-
Chiou, W.C., primary, Yang, K.F., additional, Yeh, J.L., additional, Wang, S.H., additional, Liou, Y.H., additional, Wu, T.J., additional, Lin, J.C., additional, Huang, C.L., additional, Lu, S.W., additional, Hsieh, C.C., additional, Teng, H.A., additional, Chiu, C.C., additional, Chang, H.B., additional, Wei, T.S., additional, Lin, Y.C., additional, Chen, Y.H., additional, Tu, H.J., additional, Ko, H.D., additional, Yu, T.H., additional, Hung, J.P., additional, Tsai, P.H., additional, Yeh, D.C., additional, Wu, W.C., additional, Su, A.J., additional, Chiu, S.L., additional, Hou, S.Y., additional, Shih, D.Y., additional, Chen, Kim H., additional, Jeng, S.P., additional, and Yu, C.H., additional
- Published
- 2012
- Full Text
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