18 results on '"Geiger, David"'
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2. X-ray inspection methods for controlling PCBA potting process — 2DX and partial angle computer tomography
3. Lead-free and halogen free solder flip chips on board using SMT processes and materials for miniaturization and lower cost
4. Process development and reliability study with anisotropic conductive film bonding on multiple types of PCB surface finishes
5. A new drop test vehicle for a uniform shock response
6. Failure mechanism and mitigation of PCB pad cratering
7. Head in pillow (HIP) and yield study on SIP and PoP assembly
8. Yield Study of Inline Package on Package (PoP) Assembly
9. Process Development and Reliability Evaluation of Electrically Conductive Adhesives (ECA) For Low Temperature SMT Assembly
10. Process development, repair and reliability evaluation for inline Package on Package (PoP) assembly
11. Drop test reliability of lead-free chip scale packages
12. Process development and reliability evaluation for inline Package-on-Package (pop) assembly
13. Process Development and Solder Joint Reliability of a New Lead-Free Solder: Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC)
14. Solder Joint Characteristics and Reliability of Lead-Free Area Array Packages Assembled Under Various Tin-Lead Soldering Process Conditions
15. Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)
16. PRECISION AGRICULTURE: A TOOL FOR COTMAN.
17. Static tests for the evaluation of fuel additives
18. COTMAN AS A SITE-SPECIFIC MANAGEMENT TOOL.
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