691 results on '"Hashimoto, H."'
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2. Intermittent Versus Daily Treatment for Noncavitary Nodular Bronchiectatic Mycobacteria Avium Complex Lung Disease With Rifampicin, Ethambutol, and Clarithromycin (iREC): An Open-label, Multicenter, Randomized Controlled Trial
3. An Iterated Local Search Algorithm for Commuting Bus Routing Problem with Latest Arrival Time Constraint
4. Chip-to-Chip/Wafer Three-Dimensional Integration of 2.5 mm-sized Neuron and Memory Chips by Via-Last Approach
5. Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Integration Application
6. 1-Chip ExG Recording System with Electrode Interface Evaluation Functions for Biologically Safe Recording
7. High Aspect Ratio TSV Formation by Using Low-Cost, Electroless-Ni as Barrier and Seed Layers for 3D-LSI Integration and Packaging Applications
8. Induction Bar and Edge Heating Technology in the Hot Strip Mill
9. Standing Assistance Control considering with Posture Tolerance of its User
10. Low-Cost and Self-Formed Vertical Nanowires with Aspect Ratio >100x in Deep Si-Trenches for Future 3D-LSI/IC Applications
11. Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal
12. Enlarging the Nanocylinder Size for Through-Si-Via Applications
13. PATTERN BASED STANDING ASSISTANCE FOR A LOW LEVEL OF CARE
14. Feasibility study on ultrafine-pitch Cu-Cu bonding using directed self-assembly (DSA)
15. Development of actual EUV mask observation method for micro coherent EUV scatterometry microscope
16. Impact of Interconnections on Vertically Stacked 20 um-Thick DRAM Chips
17. Transfer and Non-transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding
18. Back-via 3D integration technologies by temporary bonding with thermoplastic adhesives and visible-laser debonding
19. Capacitance Characteristics of Low-k Low-Cost CVD Grown Polyimide Liner for High-Density Cu-TSVs in 3D-LSI
20. Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study
21. Improved C-V, I–V characteristics for co-polymerized organic liner in the Through-Silicon-Via for high frequency applications by post heat treatment
22. An efficient method for checking overlaps and construction algorithms for the bitmap shape packing problem
23. Highly dependable 3-D stacked multicore processor system module fabricated using reconfigured multichip-on-wafer 3-D integration technology
24. Highly beneficial organic liner with extremely low Thermal stress for fine Cu-TSV in 3D-integration
25. A LOAD ESTIMATION OF A PATIENT CONSIDERING WITH A POSTURE DURING STANDING MOTION
26. Via-last/backside-via 3D integration using a visible-light laser debonding technique
27. A resilient 3-D stacked multicore processor fabricated using die-level 3-D integration and backside TSV technologies
28. Wafer thinning for high-density three dimensional integration _ 12-inch wafer-level 3D-LSI program at GINTI
29. Modeling of dynamic characteristics for spring operating Gas Circuit Breaker
30. A STANDING ASSISTANCE FOR BOTH VOLUNTARY MOVEMENT AND POSTURE ADJUSTMENT.
31. Toward digital staining using stimulated Raman scattering and statistical machine learning
32. A Regulation of Energy Flow in Purple Bacterial Photosynthetic Antennas
33. Elucidation and Control of Ultrafast Intramolecular Charge Transfer Dynamics of Marine Photosynthetic Pigments
34. Primary Process in Light-Harvesting Complex Studied by Pump-Repump-Probe Spectroscopy
35. Influence of wafer thinning process on backside damage in 3D integration
36. Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system
37. A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor
38. A SIMPLE LOAD ESTIMATION OF A PATIENT DURING A STANDING ASSISTANCE MOTION
39. A Development of SNS Which Used the Japanese Historical Government System
40. Examination of mitral regurgitation with a goat heart model for the development of intelligent artificial papillary muscle
41. Thermo-mechanical and electrical characterization of through-silicon vias with a vapor deposited polyimide dielectric liner
42. Flood-risk assessment of the dense downtown in Fukuoka City, Japan
43. Indirect measurements of reactions in hot p-p chain and CNO cycles
44. Adaptive three-dimensional wavelet analysis for denoising TOF-SIMS images: Toward digital staining of pathological specimens
45. Evaluation of Reconfigurable Processor Test Chip for Dependable 3D Stacked Multicore Processor
46. Measurements of ISGMR in Sn, Cd and Pb isotopes and the asymmetry of nuclear matter incompressibility
47. Simultaneous localization assistance for multiple mobile robots using particle filter based target tracking
48. Circle fitting based position measurement system using laser range finder in construction fields
49. Human action recognition using wavelet signal analysis as an input in 4W1H
50. Inundation risk assessment of underground spaces in the downtown of Fukuoka City, Japan
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