Author: "Nicolas Raynaud" / Publication Type: Conference Materials - Searchworks@Jio Institute Digital Library Search Results

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1. Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields.

Author: Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, and Pascal Metzger
Published: 2019
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