30 results on '"Oprins, Herman"'
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2. Impact of FEOL cross-heating on the thermal performance of advanced BEOL
3. Package level thermal analysis of backside power delivery network (BS-PDN) configurations
4. Thermal analysis of advanced back-end-of-line structures and the impact of design parameters
5. Circuit-level Thermal Modelling of Silicon Photonic Transceiver Array using Machine Learning
6. Joule heating investigation for advanced interconnect schemes with airgaps
7. Thermal analysis of 3D functional partitioning for high-performance systems
8. Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)
9. Thermal Aspects of Silicon Photonic Interposer Packages
10. 3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last Bonding
11. First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications
12. High Heat Flux Removal Using Optimized Microchannel Heat Sink
13. Thermal Performance Comparison of Advanced 3D Packaging Concepts for Logic and Memory Integration in Mobile Cooling Conditions
14. NOZZLE ARRAY SCALING EFFECTS ON THE THERMAL/HYDRAULIC PERFORMANCE OF LIQUID JET IMPINGEMENT COOLERS FOR HIGH PERFORMANCE ELECTRONIC APPLICATIONS
15. Distributed electro-thermal model based on fast and scalable algorithm for GaN power devices and circuit simulations
16. New fast distributed thermal model for analysis of GaN based power devices
17. Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages
18. A modeling and experimental method for accurate thermal analysis of AlGaN/GaN powerbars
19. 3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications
20. Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding.
21. Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections
22. Convolution Based Steady State Compact Thermal Model for 3D-Integrated Circuits: Methodology for Including the Thermal Impact of Die to Die Interconnections
23. Convolution based compact thermal model for 3D-ICs: Methodology and accuracy analysis
24. Thermal effects due to environmental variables in photovoltaic cells
25. DRAM-on-logic Stack – Calibrated thermal and mechanical models integrated into PathFinding flow
26. Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions
27. 3D integration: Circuit design, test, and reliability challenges
28. Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design
29. Design issues and considerations for low-cost 3D TSV IC technology
30. Practical chip-centric electro-thermal simulations
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