9 results on '"Shiguo Liu"'
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2. A high sensitivity SOI electric-field sensor with novel comb-shaped microelectrodes.
3. Detecting internal defect of non-ceramic insulators using a novel micromachined electric field sensor.
4. Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP).
5. Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package.
6. Design and Optimization of Bump Structures of Large Die Fine Pitch Copper/Low-k FCBGA and Copper Post Interconnections.
7. Effects of detailed substrate modeling and solder layout design on the 1st and 2nd level solder joint reliability for the large die FCBGA.
8. The 1st Level & 2nd Level Solder Joint Reliability Co-design for Larger Die Flip Chip Package.
9. Structural design for Cu/low-K larger die flip chip package.
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