24 results on '"Yang, Yu-Tao"'
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2. TSV-less Power Delivery for Wafer-scale Assemblies and Interposers
3. RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications
4. Recess Effect Study and Process Optimization of Sub-10 μm Pitch Die-to-wafer Hybrid Bonding
5. Fine-Pitch (≤ 10 µm) Nb-based Superconducting Silicon Interconnect Fabric for Large-Scale Quantum System Application
6. Copper to gold thermal compression bonding in heterogenous wafer-scale systems
7. Reliability Considerations for Wafer Scale Systems
8. Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications
9. A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils
10. Large-Scale Quantum System Design on Nb-based Superconducting Silicon Interconnect Fabric
11. Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using Thermocompression Bonding
12. Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems
13. Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-Level Hybrid Bonding in 3D Integration
14. On-die 16nm metal critical peak current test methodology with 100ps pulse width
15. High Transmittance Broadband THz Polarizer Using 3D-IC Technologies
16. Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration
17. Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package
18. Energy and Exergy Analysis of a Refrigeration System with Vapor Injection Using Reciprocating Piston Compressor
19. An advanced 3D/2.5D integration packaging approach using double-self-assembly method with complex topography, and micropin-fin heat sink interposer for pressure sensing system
20. Reliability investigation and mechanism analysis for a novel bonding method of flexible substrate in 3D integration
21. A field-programmable lab-on-a-chip with built-in self-test circuit and low-power sensor-fusion solution in 0.35μm standard CMOS process
22. A 3.3V 15.6b 6.1pJ/0.02%RH with 10ms response humidity sensor for respiratory monitoring
23. 0.0354mm 82μW 125KS/s 3-axis readout circuit for capacitive MEMS accelerometer
24. A digital microfluidic processor for biomedical applications
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