279 results on '"Zhang G.Q."'
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2. Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
3. Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors
4. Recessed gate Pt-AlGaN/GaN HEMT H2 sensor
5. Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications
6. Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
7. Daylighting simulation and analysis of buildings with dynamic photovoltaic window shading elements
8. High aspect ratio spiral resonators for process variation investigation and MEMS applications
9. An AlAs/germanene heterostructure with outstanding tunability of electronic properties
10. A PoF and statistics combined reliability prediction for LED arrays in lamps
11. A rapid method of estimating the solar irradiance spectra with potential lighting applications
12. 3D interconnect technology based on low temperature copper nanoparticle sintering
13. Fast analysis and implementation of microelectronic packaging MSL with equal moisture distribution method
14. Fast MSL analysis of microelectronic packages by using equal weight increasing method
15. Tunable binary Fresnel lens based on stretchable PDMS/CNT composite
16. Review on retrofit G4 LED lamps: Technology, challenges, and future trends
17. Accelerated reliability test method for optics in LED luminaire applications
18. An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components
19. A Kind of Nonlinear Feedback Control and Its Application
20. Parameters Estimation of Three Mixed Exponential Distributions
21. Studies on holographic recording performance for different doped LiNbO3crystals
22. Miniaturized particulate matter sensor for portable air quality monitoring devices
23. Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications
24. Colour shift in remote phosphor based LED products
25. Reliability and accelerated test methods for plastic materials in LED-based products
26. Investigation of color shift of LEDs-based lighting products
27. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications
28. Investigation of color shift of plastics lenses in LED-based products
29. Carbon Nanotube based heat-sink for solid state lighting
30. Geometric optimization of high performance interconnect of Rigid/Flexible/Rigid substrate for Wafer Level Packaging in Solid State Lighting applications by numerical simulations
31. Application of U-Shaped Wells Technologies for Efficient Stimulation of CBM
32. Application of U-Shaped Wells Technologies for Efficient Stimulation of CBM
33. Numerical modeling of flexible actuator for dynamic lighting.
34. Comparation of thermal and hygro effects on the degradation of LED package.
35. Investigation of temperature and moisture effect on interface toughness of EMC and copper using cohesive zone modeling method.
36. Decapsulation methods for Cu interconnection packages
37. Equivalent moisture distribution calculation for fast moisture sensitivity level analysis (MSLA)
38. Thermal and moisture degradation in SSL system
39. Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
40. The Grand Trends and Global Strategic Research Agenda of Solid State Lighting
41. Reliability of LED Products
42. Research on heat dissipation of high heat flux multi-chip GaN-based white LED lamp
43. Co-design of Wafer Level Thin Film Package assembly
44. Temperature dependency in performance of solid state lighting drivers
45. LED system reliability
46. Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting
47. Low cycle fatigue crack growth in nanostructure copper
48. Degradation of epoxy lens materials in LED systems
49. The effects of response features on failure modes of board level drop impact test
50. Effects of crosstalk and simultaneous switching noise on high performance digital system packages
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