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The article announces the IEEE International Symposium on Technology and Society, scheduled from September 18-20 in Puebla, Mexico, focusing on the Social Implications of Artificial Intelligence (AI), inviting submissions from academia, industry, and government to explore AI's impacts.

The article presents the discussion on theme of ISTAS 2024 inviting participation from practitioners in academia, industry, and government.

The article discusses the International Conference on Plasma Science held in Atlantic City, New Jersey, U.S. in 2017.

The article offers information of Technology Computer-Aided Design (TCAD) which refers to the use of computer simulations to develop and optimize semiconductor process technologies and devices.

An introduction is presented in which the editor discusses articles in the issue on topics including IEEE Transactions on Electron Devices on New simulation methodologies for next-generation TCAD tools, and large-scale simulations.

The article announces winners of the periodical's 2020 outstanding papers including a paper by L. Guo on deep convolutional transfer learning network, and a paper by C. Li on modified neutral point balancing space vector modulation.

The article offers information on call for papers IEEE Trans. on circuits and systems for video technology special section on video and Language.

The article offers information regarding details for Papers Institute of Electrical and Electronics Engineers (IEEE) Transactions on Broadcasting that focuses on the 5G wireless networks. It mentions its main aim to revolutionize different vertical industries including media broadcasting and also mentions the increasing importance of fixed and mobile broadband IP delivery.

The "IEEE Transactions on Semiconductor Manufacturing" is a journal that publishes the latest advancements in the manufacturing of microelectronic and photonic components. It aims to enhance knowledge and improve manufacturing practices in the semiconductor industry. The journal covers various topics such as process integration, manufacturing equipment performance, yield analysis, metrology, and supply chain management. Papers submitted to the journal should focus on practical engineering techniques for solving manufacturing-related problems. The journal follows a peer-review process and encourages authors from low-income countries to submit their work. The standard length for regular papers is eight pages, and shorter contributions can be submitted as letters. The journal provides guidelines for manuscript preparation, including the use of the IEEE template style. It also accepts graphical abstracts and electronic supplements. Authors are responsible for preparing a publication-quality manuscript and may use English language editing services if needed. Plagiarism is strictly prohibited, and manuscripts found to have plagiarized content may be penalized. Authors are required to have an Open Researcher and Contributor ID (ORCID) and can submit their manuscripts online. The journal offers both traditional and open access publication options, with associated fees. Native language author names are supported, and page charges may apply for publication. The IEEE holds the copyright to the published material. [Extracted from the article]

The article offers information on electronics devices, complementary metal–oxide–semiconductor (CMOS) logic, power and memory. Topics discussed include electronics devices with features related to experimental results and theoretical model; include advanced transitory with features of self-heating effect and variability; and discusses power devices like the metal–oxide–semiconductor field-effect transistor (MOSFET) and insulated-gate bipolar transistor (IGBT).