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It is vital to have an exclusive modification in semiconductor production process because of meeting differentiated customer demands in dynamic and competitive global minuscule semiconductor technology market and the highly complex fabrication process. In this paper, we propose a control system based on the dynamic mixed-effect least-square support vector regression (LS-SVR) control system for overlay error compensation with stochastic metrology delay to minimize the misalignment of the patterning process. Moreover, for the stability of the control system in the presence of metrology delay and to deal with nonlinearity among the overlay factors, the novel Lyapunov-based kernel function is merged with the LS-SVR controller. The proposed controller’s operation has been validated and implemented by a major semiconductor manufacturer in Taiwan. The experiments are verified that mixed-effect LS-SVR controller has the higher validity and higher efficiency in comparison with the exponentially weighted moving average (EWMA) and threaded EWMA controllers which had been previously implemented at the company or applied in similar studies. Note to Practitioners—Due to high production complexity in semiconductor manufacturing process, a meticulous and intelligent process control is needed to achieve higher throughput and customer satisfaction. Monitoring a complex system is challenging because the process components and variables operate autonomously and interoperate with other manufacturing segments. This paper proposes a novel run-to-run (R2R) control system to compensate the overlay error during the photolithography process that efficiently deals with the high-mixed manufacturing environment and metrology delay. [ABSTRACT FROM AUTHOR]

Earthquake early warning system uses high-speed computer network to transmit earthquake information to population center ahead of the arrival of destructive earthquake waves. This short (10 s of seconds) lead time will allow emergency responses such as turning off gas pipeline valves to be activated to mitigate potential disaster and casualties. However, the excessive false alarm rate of such a system imposes heavy cost in terms of loss of services, undue panics, and diminishing credibility of such a warning system. At the current, the decision algorithm to issue an early warning of the onset of an earthquake is often based on empirically chosen features and heuristically set thresholds and suffers from excessive false alarm rate. In this paper, we experimented with three advanced machine learning algorithms, namely, $K$ -nearest neighbor (KNN), classification tree, and support vector machine (SVM) and compared their performance against a traditional criterion-based method. Using the seismic data collected by an experimental strong motion detection network in Taiwan for these experiments, we observed that the machine learning algorithms exhibit higher detection accuracy with much reduced false alarm rate. [ABSTRACT FROM AUTHOR]

In the semiconductor manufacturing industry the development of single index assessing the equipment health condition is urgent, and thus the dashboard can be used for monitoring thousands of equipment. This paper proposes a novel equipment health index (EHI) framework and a Hotelling T-squared index (HTI) to monitor equipment and support preventive maintenance in real time in the semiconductor manufacturing industry. The EHI framework consists of data preprocessing, statistical process control, analytic hierarchy process, and a comprehensive single index representing the health condition of equipment. It considers different types of the univariate control charts for each status variable identification (SVID), and aggregates the scores corresponding to the control charts throughout the hierarchical structure. The HTI considers the correlation among the selected SVIDs and builds a multivariate index by using Hotelling T-squared statistic. An empirical study of Taiwan’s leading semiconductor assembly manufacturer finds that both the EHI and the HTI supported monitoring thousands of pieces of equipment in real time. In practice, firms can rapidly troubleshoot the root causes of failures by the decomposition of EHI. [ABSTRACT FROM AUTHOR]