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Nowadays, almost all electronic systems on printed circuit boards (PCB) adopt a vital element known as the power delivery network (PDN). However, the performance of the PDN is susceptible to variables such as the temperature and aging of its key constituents: the decoupling capacitors (decaps). Consequently, the long-term reliability of the PDN demands meticulous consideration to foresee how its performance can deviate from the initial design specifications. A realistic high-current server system is considered. It involves hundreds of decaps to achieve the required target impedance as optimally selected and laid out by the Power Integrity (PI) designer. The degradation of decap performance is analyzed by collecting experimental data from tens of decaps for each type used in the design while applying an accelerated aging process at different temperatures. The impact of aging in terms of the capacitance, parasitic inductance, and resistance of the decaps is considered to illustrate an innovative methodological design approach based on statistical analysis. Such a design approach can prevent the detrimental impact of a larger noise level due to the gradual performance degradation of the PDN over the intended life cycle of the system.

This study presents an approach for the prediction of electric field level which depends on the positions of stirrer and frequency in the mode stirred reverberation chamber. A general regression neural network (GRNN) is used for prediction process. In order to show the system performance, feature selective validation (FSV) technique is given. The simulation results show that the predicted values of electrical field have been obtained with high accuracy. Thus, this technique will facilitate estimation of electric field level in the reverberation chamber which is component of especially mode stirrer reverberation chamber test method.

Lists the reviewers who contributed to the publication in 2015.

In 2013, under the direction of Prof. F. Rachidi, the IEEE Transactions on Electromagnetic Compatibility established a program to recognize the voluntary work of our reviewers, which is fundamental to maintaining the highest standards of the EMC Transactions. In this program, a number of outstanding reviewers are recognized each year by receiving the title of Distinguished Reviewer of the IEEE Transactions on Electromagnetic Compatibility. The distinction is based on the number of submitted reviews and the reviewer score (Associate Editors were not considered).

EMC engineers often simulate electromagnetic fields in order to gain a better understanding of how they interact with some device, circuit, or system. Higher-order Techniques in Computational Electromagnetics is a highly specialized book about basis functions for expanding electromagnetic fields and currents within numerical solution procedures. Its focus is primarily on basis functions developed by the authors and published in a series of journal articles during the past 20 years. While numerical techniques are in widespread use today, almost all are based on "low-order" techniques that place a limit on accuracy for a given computational cost. The authors' basis functions enable a better computational efficiency when implemented into a computer code.

1 book was reviewed: PASSIVE MACROMODELING: Theory and Applications; Stefano Grivet-Talogia and Bjorn Gustavsen; 2016.

In 2013, under the direction of Prof. F. Rachidi, the IEEE Transactions on Electromagnetic Compatibility established a program to recognize the voluntary work of our reviewers, which is fundamental to maintaining the highest standards of the EMC Transactions.

This book can be considered an advanced study in signal integrity. Although some basic material is covered, it is assumed that the reader is well acquainted with basic electromagnetic theory, vector calculus, differential equations, statistics, and transmission-line analysis. The book builds on the traditional knowledge base and covers topics required to design present and future digital systems. The book is divided into 14 chapters and six appendices. The main features of this book can be summarized as follows: visual description of theoretical concepts wherever possible so each chapter includes numerous figures to help reinforce the concepts discussed and rigorous coverage of theory and use of practical examples to demonstrate how to use the theory in practical, real-world applications. There is a high degree of quality with the book's graphs and figures. Six appendices enrich the book with useful equations, identities and conversion formulas. Contemporary signaling systems continue to offer new problems to solve. Engineers who can solve these problems will define the future. This book will equip readers with the necessary practical understanding to contend with contemporary problems in highspeed digital design and provide enough theory to see beyond the book to solve problems that have not yet been encountered.

The role of electromagnetic (EM) fields in our lives has been increasing. Communication, remote sensing, integrated command/ control/surveillance systems, medicine, environment, education, marketing, and defense are only a few areas where EM fields have critical importance. In 2015, the number of first-time cell phone subscribers (7.5 billion) exceeded the world population (7.4 billion) and the number of Internet users exceeded 3 billion. We are surrounded by EM fields and this is the reason why Electromagnetic Compatibility is gaining importance after a "decaying" phase.

The role of electromagnetic (EM) fields in our lives has been increasing. Communication, remote sensing, integrated command/control/ surveillance systems, medicine, environment, education, marketing, and defense are only few areas where EM fields have critical importance. In 2015, the number of first-time cell phone subscribers (7.5 billion) exceeded the world population (7.4 billion) and the number of internet users exceeded 3 billion. We are surrounded by EM fields and this is the reason why Electromagnetic Compatibility (EMC) is gaining importance after a "decaying" phase.

IEEE and our Transactions on EMC are continuing to support your efforts to publish papers of higher and higher technical and scientific relevance and of great impact on our EMC community.

This is a very interesting and well written book on power integrity (PI) oriented to systems for computer platforms. It is characterized by a systematic use of what the author and others call the “first principle analysis”. The first principle analysis is simply a way of using basic equations and physics (conceptual tools engineers have encountered in their education) to describe a problem, and then using those tools to solve the problem. Usually the mathematical representations used to describe the problem are a close approximation to the exact equations. For this reason, it is important to have the understanding that comes with the mathematics and physics. Indeed, many complex problems can be solved quickly, using pen and paper, a simple spreadsheet, or a math program, and thus give the engineer quick insight into the boundaries of the solution. First principles will allow engineers to solve a related problem in order to gain insight into the solution of the problem of interest. The book has 249 pages and three appendices. This book provided a systematic and quantitative approach to power integrity for computer platforms and systems that is not easy to find in the current technical and scientific literature.

This book was mainly written (as stated by the author) to instruct advanced undergraduate and graduate students in the basic concepts of classical macroscopic electromagnetic fields. However, the book also provides new insights into and appreciation for what is surely one of the most important achievements in science. The book has 639 pages, 25 chapters and eight appendixes. The chapters are grouped into four parts: Basic Electromagnetic Theory, Four Dimensional Electromagnetism, Electromagnetic Examples, and Backmatter.

The long lasting professional experience of the author in the field of real-world EMC oriented PCB design makes this book a fundamental reading for those of us that need firstly to understand the underlying principles of the potential causes of EM emissions and, secondly, to fix them in a proper engineering-wise, cost-efficient way. Reading the book it is clear the two key ideas that the author, with the contributions of Professor J.L. Drewniak of the Missouri University of Science and Technology in Rolla, wishes to convey to the reader:

It appears that 3D integration with through silicon vias (TSV) is finally here! I am referring to the mem-ory-on-logic and logic-on-logic applications where the improvement in performance, transistor density and form factor enables the electronics industry to continue the miniaturization of systems. Because of this, the timing of this book is about right.

I agree with the author in considering that almost every aspect of modern life depends on the use of electronics. Without electronics, the basic nature of our society would be completely different. The manner and efficiency in which modern life is conducted depends on the ability to achieve and maintain electromagnetic compatibility (EMC), which is a necessary condition for effective communication-electronic system performance.

Since 2012 the second edition of this book is available. This new edition has all the attractive features of the first one and in my opinion it contains some new features and additions that are very useful in the EMC playground. In particular: A section on metamaterials (Section 5.7) is helpful for electromagnetic shielding oriented studies; A section on artificial impedance surfaces (AIS, EBG, PBG, HIS, AMC, PMC) (Section 8.8), is a solid base for any issue related to EBGs; and, in general, Additional smaller inserts throughout the book make it easier and enjoyable to understand; and new figures, photos, and tables have been added. As in the first edition, this second edition is a thorough and detailed engineer-oriented book. The analytical detail, rigor, and thoroughness allow many of the topics to be traced to their origin, and they are presented in sufficient detail so that the reader will follow the analytical developments. The material is presented in a methodical, sequential, and unified manner, and each chapter is subdivided into sections or subsections whose individual headings clearly identify the topics discussed, examined, or illustrated. An exhaustive list of references is included at the end of each chapter to allow the interested reader to trace each topic. A number of appendixes of mathematical identities and special functions, some represented also in tabular and graphical forms, are included. A very useful feature is a set of fortyeight basic MATLAB® computer programs developed and included in the website that is part of the book. They are an aid, also for the skilled reader, for a conceptual fruition of the results based upon the analytical formulations included throughout the book.

During the 2015 IEEE EMC Symposium in Dresden, Germany, the EMC AVIATORS Club met again. Thanks to the planning efforts of Andy Marvin (from the University of York, United Kingdom) and Peter Muller (from Technische Universitat Dresden, Germany) they were able to meet along with Antonio Orlandi (from the University of L'Aquila, Italy) at the Dresden International Conference Center on Tuesday, August 18, and organize a flight event the day after at the airfield of Mohorn.

Printed circuit-board and IC-package design used to be a field that involved expertise in layout, CAD, logic design, heat transfer, mechanical engineering, and reliability analysis. With modern digital electronic systems pushing beyond the 1-GHz barrier, packaging and board designers must now balance signal and power integrity and electrical performance with these other concerns. In our new “highspeed” world, where the packaging and interconnect are no longer electrically transparent to the signals, a new methodology for designing a product right the first time is needed. This new methodology is based on predictability.

The 2.5D/3D stacking of memory and processor chips with through-silicon via connections is part of a long trend toward performance improvement and cost reduction of memories and memory system chips and is becoming not only an engineering reality in the integrated circuit industrial real world but also a hot topic for the EMC/SI scientific community as demonstrated by the increasing number of papers on this topic published in the IEEE Transactions on Electromagnetic Compatibility. The majority of these papers deal with challenging electromagnetic modeling issues leaving in the background the impact that the manufacturing technology can have on the modeling itself.

This is a very interesting and well written book on a hot topic nowadays in signal and power integrity: the study of three dimensional integrated circuits (3D IC) with particular emphasis on the analysis and design of Through Silicon Vias (TSV). TSV, in very basic terms, is a metal pillar inside the silicon (Si) wafer with a silicon oxide coating (‘liner’) to block the DC leakage current between the metal pillar and the silicon wafer.

The requirements of higher bandwidth and lower power consumption of electronic systems render the integration of circuits and electronic packages increasingly complex. In particular, the introduction of three-dimensional (3D) structures based on through-silicon via (TSV) technology provides a potential solution to reduce the size and to increase the performance of these systems. As a consequence, the electromagnetic compatibility (EMC) between circuits, signal integrity (SI) and power integrity (PI) in electronic integration is of vital importance. For this reason, the electronic circuits and packaging systems must be designed by taking into account the trade-offs between cost and performance. This requires a specific knowledge and many years of research work in the fields of modeling and simulation of signal integrity, power integrity and EMC in electronic package integration and multilayered printed circuit boards. The author and his contributors share their knowledge with readers in a systematic and rigorous way in the 366 pages of this book.

This book addresses the gap in the college electrical engineering courses between the traditional digital and microwave curricula, with a focus on a practical and intuitive understanding of signal integrity effects within the data transmission channel. Today’s emerging high-speed digital applications require a special kind of design engineer who understands the subtle signal integrity issues at hand. Although a classical electrical and computer engineering education is helpful, it is the high frequency microwave effects that normally cause the most problems within telecommunications and computer systems, channels, and components. Reflections from impedance discontinuities, crosstalk, intra-line skew, and a multitude of other problems can immediately stop a system from working properly. High-speed interconnects such as connectors, printed circuit boards (PCBs), cables, integrated circuit (IC) packages, and backplanes are critical elements of differential channels that must be designed using today’s most powerful analysis and characterization tools. Both measurements and simulation must be done on the device under test, and both activities must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements. The book has 783 pages; it is divided into six sections and 23 chapters. This book has many positive aspects. One of them is certainly to trigger in the reader the inspiration to learn more about signal integrity and the high-speed technology around us.

This is the first time that I have faced the topic described by the title of this book. As a consequence, my reading of this well written text has been guided more by my own curiosity on a new field related to EMC than by the wish to deepen my knowledge of the subject.

The knowledge of the basic principles of microstrip and planar antennas is an important skill for an EMC engineer. Not only because, as with all other radiating systems, they spread electromagnetic energy around that can unintentionally couple to other victim systems, but also for the more subtle reason that as the frequency involved in digital systems increases more and more, the proper planar structures of a Printed Circuit Board (PCB) layout can behave as planar antennas.

The aim of this book, that conjugates the academic rigor with satisfying practical needs and questions, is to offer a wide perspective into the complex world of electromagnetic measurements and, in particular, near-field measurements.