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This paper presents a chopper-stabilized three-stage operational amplifier (OpAmp) with a unity gain bandwidth of 69 MHz and an input referred noise density of 3 nV $/\surd {Hz}$ . The proposed design achieves a stable unity gain by proposing a new pole and zero scheme with very low power consumption, drawing only 3.3 mA from a 1.8 V power supply while driving a load capacitor as large as 100pF. To achieve rail-to-rail input swing, the design uses both NMOS and PMOS differential pairs at the input and biases them in the subthreshold region to provide an identical net trans-conductance over the rail-to-rail input common mode. Furthermore, an adaptive biasing is employed and the current sources are kept ON during large signal transitions at the input, thus eliminating crossover distortion and providing a high slew rate of 40 V/ $\mu \text{s}$ at a 100 pF load capacitor. The design employs chopping at 2.5 MHz and is enhanced with a local ripple reduction loop, making the OpAmp suitable for high gain and wide bandwidth applications with less filtering required. The design also reduces the input bias current significantly from 500 nA to 1.5 nA by buffering the input and applying it to the modified bootstrap switches. The proposed OpAmp, fabricated in a $0.18~\mu \text{m}$ CMOS process, exhibits a maximum offset of $4.5~\mu \text{V}$ , a flicker noise corner frequency of 246 Hz, a DC gain of 146 dB, a power supply rejection ratio of 123 dB, and a common mode rejection ratio of 116 dB.

This article presents a chip designed for wireless intra-cardiac monitoring systems. The design consists of a three-channel analog front-end, a pulse-width modulator featuring output-frequency offset and temperature calibration, and inductive data telemetry. By employing a resistance boosting technique in the instrumentation amplifier feedback, the pseudo-resistor exhibits lower non-linearity, leading to a total harmonic distortion of below 0.1%. Furthermore, the boosting technique enhances the feedback resistance, leading to a reduction in the size of the feedback capacitor and, consequently, the overall size. To make the modulator's output frequency resilient to temperature and process changes, coarse and fine-tuning algorithms are used. The front-end channel is capable of extracting the intra-cardiac signal with an effective number of bits of 8.9, while exhibiting an input-referred noise of less than 2.7 $\mu V_{rms}$, and consuming 200 nW per channel. The front-end output is encoded by an ASK-PWM modulator, which drives an on-chip transmitter at 13.56 MHz. The proposed System-on-Chip (SoC) is fabricated in a 0.18 $\mu m$ standard CMOS technology and consumes 4.5 $\mu W$ while occupying 1.125 $mm^{2}$.

This paper discusses a novel substrate modeling technique for the simulation of substrate noise in mixed signal VLSI systems. This model yields to easy merger with the SPICE simulation netlist for the complete pre and post layout estimation of substrate noise effects in large mixed signal VLSI chips. Compared to previous numerous efforts in substrate noise modeling ranging from finite element methods (FEM) to boundary elements methods (BEM), this model, based on a finite sheet resistor slicing scheme also incorporates the effect of supply rail bounce due to bonding wire inductances, and, provides realistic estimates of substrate noise effects with a high degree of computational efficiency. Substrate noise simulations were done using a 0.18 μm TSMC CMOS process technology using typical process parameters. A differential switched capacitor sample and hold circuit and a linear differential transconductor stage was used for the performance evaluation of this novel substrate model. Simulation results indicate a typical increase in Total Harmonic Distortion (THD) by atleast 6 dB due to the substrate noise effects, which corresponds to a performance loss by around 1-b precision. Also, the substrate noise effects are found to be proportional to the oversampling ratio (i.e., the digital clocking rate with respect to the input signal) and the net number of logic transitions at each register transfer instance in the mixed signal chip.