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Previews the 1996 IEEE Solid-State Circuits Conference (ISSCC) to be held in San Francisco, California from February 8 through the 10th. Companies and their planned introductions including Hewlett-Packard, Digital and Cyrix; Dynamic random access memories (DRAM) to be released by Samsung and Mitsubishi; Informational sessions on memory to be held; Other details.

Reports that organizers of the International Solid-State Circuits Conference are trying to understand why papers from universities and companies in Taiwan were eliminated from the conference for a fifth straight year. Total number of papers Taiwan submitted in 2001; How Nicky Lu of Etron Technologies hopes to remedy the problem; Symposium that has seen similar problems with Taiwanese submissions.

Focuses on the papers presented during the 2000 International Solid-State Circuits Conference concerning architectures that are compatible with conventional silicon processes. Details on the paper presented by Kazuo Nakazato, chief researcher at Hitachi Cambridge Laboratories; Applicability of a vertical replacement gate to scalable complementary metal oxide semiconductor logic.

The article reports that Rambus Inc. will reveal a technique for delivering Input/Output with power rates of 2.2 milli-watts per gigabit per second, at the 2007 International Solid-State Circuits Conference in San Francisco, California. In its prepared paper, Rambus Inc. will describe a 6-Gbit/second serializer/deserializer transceiver at 2.2 mW/Gbit/s in 90-nanometer process technology. The company believes that the technology would achieve power reduction and would deliver high performance.

Provides information on the 50th International Solid-State Circuits Conference that will be held on February 10, 2003 in San Francisco, California. Theme of the keynote speech that will be delivered by Gordon Moore, chairman emeritus of Intel Corp.; Paper sessions; Panels; Workshops.

Focuses on a graphics rendering engine launched by Sony Computer Entertainment Inc., whose graphics processing paper was presented at the International Solid-State Circuits Conference in February 2001. Features and capabilities of the product; Involvement of Simplex Solutions Inc. in the graphics processing.

Presents information on a paper on the electronics of carbon nanotubes in a session at the 1999 International Solid-State Circuits Conference (ISCC). Potential benefits from carbon nanotube for building semiconductor device structures; Comment from paper's author Alan Johnson of the University of Pennsylvania; Device which carbon nanotube is applied.

Previews the International Solid-State Circuits Conference in February 2000. Emerging technologies for transistors; Factors that prompted researchers to attack the problems of integrated systems for cell and videophones; Synopses of other international papers on processes and devices to be submitted to the conference.

Presents information on the papers presented by the IBM Microelectronics on silicon-on insulator (SOI) PowerPC chips at the 1999 International Solid-State Circuits Conference. How big gains in device performance can be made possible; SOI DRAM dynamic random access memory chip from Samsung Electronics Inc.; Development of PowerPC implementations.

Reports on the 1994 International Solid State Circuits Conference (ISSCC). Spotlighting on advances in low-power technologies and mixed-signal integration; Comments of program vice chairman Timothy J. Tredwell on the trend towards portable computing and consumer products; Paper session on the power issue; Explanation of the conference's low-power theme by Tredwell.

Focuses on the 1996 International Solid-State Circuits Conference. Plenary sessions on a chip-level multimedia complex and on single-chip cameras and television receivers; Highlights on the challenges to system-level integrated circuits; Technical papers; Participants; Memory sessions.

Previews 160 papers to be presented by the Institute of Electrical and Electronics Engineers (IEEE) at the International Solid-State Circuits Conference (ISSCC) which will take place during the week of February 5, 1996. The 25 paper sessions and range of issues they will address; Details to be revealed by Cyrix regarding its 5GX86 processor with multimedia hooks; Hewlett-Packard to release new benchmarks for its PA-8000 architecture.

Reports that Intel Corp. decided against presenting a paper that it was slated to give at the 2001 International Solid-State Circuits Conference that would have described its McKinley processor.

Presents a list of Web sites that offer information about the topics and papers presented at the International Solid-State Circuits Conference (ISSCC) in 2000. Features of the sites.

Announces the gaining popularity of spread-spectrum clocking as a way to lower electromagnetic interference as processor speeds increase. Papers presented at the 1999 International State-Solid Circuits Conference (ISCC); Dual-loop spread-spectrum concept by Hung-Sung Li of NeoMagic Corp.; Circuit proposed by Yongsam Moon, a doctoral candidate at Seoul National University.

Reports on the possibility of using radio frequency-(RF) powered electronic implants to stimulate the nerves of paraplegics and the retinas of those with eye diseases, according to papers at the 1999 International Solid-State Circuits Conference in San Francisco, California. Fully integrated neuromuscular electrical stimulation system called Finess; Neurostimulator controlled by RF signals.

Focuses on the window provided by the 1995 International Solid State Circuits Conference on the future of semiconductor design. Comparison of dynamic random access memory (DRAM) papers from Hitachi Ltd. and NEC Corp.; Design of the Hitachi DRAM; Approach taken by NEC; Mitsubishi Electronic Corp.'s research on DRAM design.

Opinion. Focuses on presentations at the 1997 Solid-State Circuits Conference involving computer chips. NEC's paper on a 4-Gbit DRAM; Intel Corp.'s presentation of an engineering test vehicle for the Klamath CPU; Confusion among the engineering audience over the contents of the presentations.

Reports on Asian memory-chip companies' presentation of flash papers at the 1996 International Solid State Circuits Conference (ISSCC). Dominance of the flash market by Intel Corp. and Advanced Micro Devices (AMD); Toshiba Corp.'s practical approach to flash design; Hitachi/Mitsubishi's smaller erasure blocks of 512 bytes; Multi-level programming as a space saver.

Reports on the 1995 International Solid State Circuits Conference. Xilinx's presentation of a paper on a fabricated field programmable gate array (FPGA); Features.

Reports on the erroneous announcement made regarding a paper supposedly authored by Xilinx Inc. and Xenon Corp. that was submitted for the 1995 International Solid State Circuits Conference. Comments from Xilinx on the mixup.

Highlights several papers for presentation in the 1995 International Solid State Circuits Conference. Includes Intel Corp.'s P6; Hal Computer System Inc.'s implementation of the Sparc V9 architecture; Samsung Co. Ltd. and Hyundai Corp.'s memory technologies.

Presents a sampling of the papers at the International Solid State Circuits Conference in San Franciso, California, on February 1994. Technologies targeting wide and local area networking, digital cellular and radio frequency communications markets; `A GaAs High-Power RF SPDT Switch IC for Digital Mobile Communication System' from Matsushita Electronics; More.