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We characterize composition and structure of ultrathin nickel silicide during formation from 3 nm Ni films on Si(100) using in-situ high resolution ion scattering and high resolution transmission electron microscopy. We show the transition to occur in discrete steps, in which an intermediate phase is observed within a narrow range of temperature from 230 oC to 290 oC. The film composition of this intermediate phase is found to be 50% Ni:50% Si, without evidence for long-range structure, indicating the film to be a homogeneous monosilicide NiSi phase. The final phase is resemblant of the cubic disilicide NiSi2, but with slightly off-stoichiometric composition of 38% Ni and 62% Si. Along the [100] axis, the lattices of the film and the substrate are found in perfect alignment. Due to the epitaxial growth of the silicide, a contraction of the c lattice constant of the film by 0.7-1% is detected., Comment: 17 pages, 6 figures

We demonstrate a novel approach for non-destructive in-situ characterization of phase transitions of ultrathin nickel silicide films using 3D medium-energy ion scattering. The technique provides simultaneously composition and real-space crystallography of silicide films during the annealing process using a single sample. We show, for 10 nm Ni films on Si, that their composition follows the normal transition sequence, such as Ni-Ni2Si-NiSi. For samples with initial Ni thickness of 3 nm, depth-resolved crystallography using a position-sensitive detector, shows that the Ni film transform from an as-deposited disordered layer to epitaxial silicide layers at a relatively low temperature of ~290 {\deg}C., Comment: 10 pages, 5 figures