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States that the National Fluid Power Association in the U.S. calls for paper for the 2003 Industry/Educator Summit to be held on October 24-25, 2003. Theme; Contact numbers.

Previews the 1996 IEEE Solid-State Circuits Conference (ISSCC) to be held in San Francisco, California from February 8 through the 10th. Companies and their planned introductions including Hewlett-Packard, Digital and Cyrix; Dynamic random access memories (DRAM) to be released by Samsung and Mitsubishi; Informational sessions on memory to be held; Other details.

The article reports on the outcome of the Fourth Annual National Citizen Science Conference of the Society for Amateur Scientists in late August 2006. Essentially all of the attendees presented papers. Members tend to be folks who find out how the world works through experiments using equipment ranging from cardboard and tape to state-of-the-art gear, but with utmost dedication. Bill Appleby chose to find out how fabric similar to that on the Hindenburg zeppelin burns when ignited. He discovered that uncoated cotton burned faster than any of several coated versions

The article presents information on the winners of the competition that was organized by the Titanium Development Association, Dayton, Ohio. The winners were announced at an awards luncheon in October during the 1990 international Conference on "Titanium Products and Applications" in Lake Buena Vista, Florida. The top three winners of the competition were; a titanium crucible for casting uranium, titanium components for paper processing, and a new denture base made from titanium. The titanium crucible for melting and casting of uranium and its alloys takes the place of ceramic crucibles, which often crack during use in vacuum induction furnaces.

Information about several papers discussed at the Car Training Institute (CTI) Symposium on Automotive Transmissions that was held at Detroit, Michigan from May 6-8, 2008 is presented. Topics include the growing role of advanced transmission technologies in the future and General Motors Corp. (GM) has presented information on its six-speed transaxles for the global market. It also features the new eight-speed planetary design from ZF GmbH and a nine-speed from Tata Motors Ltd.

Previews 160 papers to be presented by the Institute of Electrical and Electronics Engineers (IEEE) at the International Solid-State Circuits Conference (ISSCC) which will take place during the week of February 5, 1996. The 25 paper sessions and range of issues they will address; Details to be revealed by Cyrix regarding its 5GX86 processor with multimedia hooks; Hewlett-Packard to release new benchmarks for its PA-8000 architecture.

The article presents information about the research papers presented at the second Sensors Application Symposium organized by the Instrumentation and Measurement Society of the Instrumentation and Measurement Society of the Institute of Electrical and Electronics Engineers Inc. The research paper, entitled "A Sensor Network for Buildings Based on the DALI Bus," reports how researchers modified a lighting protocol to avoid establishing separate networks in the same building.

Reports on the plan of Intel to release papers on technologies for improving the performance of computer chips, at the International Solid State Circuits Society conference in San Francisco, California in 2005. Overview of the content of the papers; Biggest challenge in the development of computer chips; Information on the next generation Itanium processor of Intel, code-named Montecito.

The article features the web site of Bearing Specialists' Association (BSA). The homepage, www.bsahome.org offers news and association information, including "newsfeed" from NAW's Smartbrief newsletter. Visitors can link to certification, convention, industry partners committees, sales training and other materials. With "Tools You Can Use direct link," BSA white papers, educational services committee reports, the association's Certified Bearing Specialist program can all be found.

Comments on the IEEE International Solid State Circuits Conference (ISSCC) which is planned for February 8-10, 1996. The conference's plans to feature many communications integrated circuit (IC) papers; The percentage of papers that will deal with this topic.

The author reflects on the topic discussed by Brian Halla of National Semiconductor at the electronica trade show in Munich, Germany in November 2008. According to the author, Halla demonstrated the new cycle in business for the semiconductor industry and suggested the need for electronic engineers to design new low-power systems that looks after the public's health and energy needs. He cites the paper presented by professor Ian Phillips at the recent IPSoC conference.

Information about several papers discussed at the 2007 Automation Summit of Siemens AG in the U.S. is presented. Vice President of Automation and Motion Control Raj Batra tackles safety and security, energy efficiency and industrial networking as the issues faced by manufacturers. The event details how Owens-Illinois modernized its proprietary motion control systems. It also discusses how Osram Sylvania used wireless networking technologies to simplify input/output communications.

The article presents information related to the 10th annual Semico Summit which provided extensive proof that the convergence of computer, communications and consumer electronics continues at an unabated pace. Several papers were presented by the high-level executives from companies confronting the challenges of the International Technology Roadmap for Semiconductors (ITRS). The Semico Summit also provided insight into the areas in which improvement is needed.

The article presents information on different blogs posted on the Web site www.designnews.com. A call for papers has been issued by Ageus Solutions for the International Symposium on Environmental Standards for Electronics 2007, which will be held in Ottawa, Ontario on October 10, 2007. The BMX riders will start each race on a new pneumatic starting gate that features advanced electronic controls at the 2008 Summer Games in Beijing, China.

Focuses on the decision of Intel to use copper interconnects for several technology nodes, reported by Shekhar Borkar, director of circuit research for microprocessor technology of the company, during the IEEE Symposium on VLSI Circuits in Honolulu, Hawaii. Description of the different research papers of Intel on optimizing chips; Improvement in the soft error rates of the company; Other research topics presented at the symposium.

Presents news briefs on engineering design in the U.S., as of February 3, 2004. Conference organized by "Start" magazine and Save American Manufacturing; Job listings web site launched by the American Society of Mechanical Engineers; Paper on computer-aided design market offered by Cyon Research Corp.

Discusses the papers presented at the ISSCC 2003 convention. Information on the eponymous law of Gordon Moore, co-founder of Inte Corp.; Alternative solution to cut heat of integrated circuits; Role of analog circuitry at the input, output, and power supply of digital electronics.

Highlights the microprocessors, digital signal processors and related embedded technologies which will be introduced at the Embedded Processor Forum in San Jose, California. Innovations in embedded technologies; Expansion of the network processor component of the forum; Research paper on next-generation processor that will be presented by the PMC-Sierra company.

Focuses on the 50th Electronic Components & Technology Conference in the United States in May 2000. Highlights of the event; Information on the paper titled `Predictive Reliability Modeling for Flip-Chip Interconnect Bump Extrusion'; Issue on package reliability.

Reports that the 1999 International Conference on High Density Packaging & Multichip Modules will reveal advances in three-dimensional designs, flex circuits and other technologies. Presentation of papers on multichip module (MCM) substrate types at the conference; Topics of the technical sessions and professional development courses offered at the conference; Comments from conference chair Rene Cote of Unicorn Designs.

Presents information on the 1999 Society for Automotive Engineers International Congress and Exposition in Detroit, Michigan. Technology trends in automotive electronics; Companies that presented papers during the event; 1998 revenues of the automotive connector industry.

Highlights technical sessions planned for the Portable by Design conference at the Santa Clara Convention Center from March 25-29, 1996. Includes Hewlett-Packard's discussion of innovations in high-speed IrDA transceiver hardware; Novalog Inc.'s focus on noise and speed considerations for analog IR transceiver electronics; Papers on low-power comparators in battery power management from National Semiconductors.

Reports on the 1995 International Solid State Circuits Conference. Xilinx's presentation of a paper on a fabricated field programmable gate array (FPGA); Features.

Reports on the erroneous announcement made regarding a paper supposedly authored by Xilinx Inc. and Xenon Corp. that was submitted for the 1995 International Solid State Circuits Conference. Comments from Xilinx on the mixup.

Highlights several papers for presentation in the 1995 International Solid State Circuits Conference. Includes Intel Corp.'s P6; Hal Computer System Inc.'s implementation of the Sparc V9 architecture; Samsung Co. Ltd. and Hyundai Corp.'s memory technologies.

Presents a sampling of the papers at the International Solid State Circuits Conference in San Franciso, California, on February 1994. Technologies targeting wide and local area networking, digital cellular and radio frequency communications markets; `A GaAs High-Power RF SPDT Switch IC for Digital Mobile Communication System' from Matsushita Electronics; More.

Announces the deadline for submission of technical papers for the 1994 International Test Conference. Venue.

The article highlights the 1993 Society of Automotive Engineers (SAE) International Congress and Exhibition in the U.S. SAE officials report that more than 39 000 people attended the four-day event which featured 800 exhibitors and 1 000 technical papers. Eagle-Picher Industries Inc. introduced its Nickel-Super-Hydride battery. The Department of Energy exhibited an electromechanical battery comprising a 200 000-rpm composite flywheel and a magnetically coupled generator. ITW Chronomatic announced a self-regulating, phase transfer catalysis-polymer sea-heating system compatible with cushion-forming processes.